The present invention discloses a Nb and Al-containing titanium-copper alloy strip, characterized in that the weight percentage composition of the titanium-copper alloy strip comprises: 2.00-4.50 wt % Ti, 0.005-0.4 wt % Nb, and 0.01-0.5 wt % Al, balance being Cu and unavoidable impurities. Preferably, in the microstructure of the titanium-copper alloy strip, the number of Nb and Al-containing intermetallic compound particles with a particle size of 50-500 nm is not less than 110.sup.5/mm.sup.2, and the number of Nb and Al-containing intermetallic compound particles with a particle size greater than 1 m is not more than 110.sup.3/mm.sup.2. Under the condition of ensuring excellent bendability, the titanium-copper alloy strip has excellent stability, especially the stability of mechanical properties at high temperatures. The present invention also relates to a method for producing the titanium-copper alloy strip.

Exemplary methods of cooling a semiconductor component substrate may include heating the semiconductor component substrate to a temperature of greater than or about 500 C. in a chamber. The semiconductor component substrate may be or include aluminum. The methods may include delivering a gas into the chamber. The gas may be characterized by a temperature below or about 100 C. The methods may include cooling the semiconductor component substrate to a temperature below or about 200 C. in a first time period of less than or about 1 minute.

Exemplary methods of cooling a semiconductor component substrate may include heating the semiconductor component substrate to a temperature of greater than or about 500 C. in a chamber. The semiconductor component substrate may be or include aluminum. The methods may include delivering a gas into the chamber. The gas may be characterized by a temperature below or about 100 C. The methods may include cooling the semiconductor component substrate to a temperature below or about 200 C. in a first time period of less than or about 1 minute.

Thermoelectric devices including Arsenic-Phos-phorous (As.sub.xP.sub.1-x) as a source of power, wherein x is a number ranging from 0.1 to 1, are provided. Methods of making crystalline Arsenic-Phosphorous (As.sub.xP.sub.1-x), wherein x ranges from 0.1 to 1, are also provided. The methods include annealing phosphorous and arsenic at a temperature and under conditions sufficient to produce crystalline formation.

Thermoelectric devices including Arsenic-Phos-phorous (As.sub.xP.sub.1-x) as a source of power, wherein x is a number ranging from 0.1 to 1, are provided. Methods of making crystalline Arsenic-Phosphorous (As.sub.xP.sub.1-x), wherein x ranges from 0.1 to 1, are also provided. The methods include annealing phosphorous and arsenic at a temperature and under conditions sufficient to produce crystalline formation.

Systems and methods of hot forming a metal blank include receiving the metal blank at a heater and positioning the blank adjacent a magnetic rotor of the heater. The systems and methods also include heating the metal blank through the magnetic rotor by rotating the magnetic rotor. Rotating the magnetic rotor induces a magnetic field into the metal blank such that the metal blank is heated.

The present disclosure relates to a high-entropy alloy and a manufacturing method therefor, and in particular, a high-entropy alloy and a manufacturing method therefor that comprises a multi-element alloy matrix and Cu, and comprises an alloy having a face-centered cubic (FCC)-based phase, such that the high-entropy alloy may have greater hardness and strength than an existing transition metal alloy while maintaining a FCC-based single phase, and has high lubricity.

The present disclosure relates to a high-entropy alloy and a manufacturing method therefor, and in particular, a high-entropy alloy and a manufacturing method therefor that comprises a multi-element alloy matrix and Cu, and comprises an alloy having a face-centered cubic (FCC)-based phase, such that the high-entropy alloy may have greater hardness and strength than an existing transition metal alloy while maintaining a FCC-based single phase, and has high lubricity.

A method for heat treating a superalloy component includes heating a superalloy component to a first temperature, cooling the superalloy from the first temperature to a second temperature at a first cooling rate in a furnace, and cooling the superalloy component from the second temperature to a final temperature at a second cooling rate. The second cooling rate is higher than the first cooling rate.

A method for heat treating a superalloy component includes heating a superalloy component to a first temperature, cooling the superalloy from the first temperature to a second temperature at a first cooling rate in a furnace, and cooling the superalloy component from the second temperature to a final temperature at a second cooling rate. The second cooling rate is higher than the first cooling rate.