Patent classifications
C22F1/08
METAL COMPOSITION, BONDING MATERIAL
A metal composition that includes a metal component and a flux. The metal component is composed of a first metal powder of a Sn-based metal, and a second metal powder of a Cu-based metal that has a higher melting point than the Sn-based metal. The flux includes a rosin, a solvent, a thixotropic agent, an activator, and the like. When the metal composition is heated to a temperature equal to or higher than the melting point of the first metal powder, the first metal powder is melted. The melted Sn and the CuNi alloy powder produce an intermetallic compound phase of a CuNiSn alloy through a TLP reaction.
METAL COMPOSITION, BONDING MATERIAL
A metal composition that includes a metal component and a flux. The metal component is composed of a first metal powder of a Sn-based metal, and a second metal powder of a Cu-based metal that has a higher melting point than the Sn-based metal. The flux includes a rosin, a solvent, a thixotropic agent, an activator, and the like. When the metal composition is heated to a temperature equal to or higher than the melting point of the first metal powder, the first metal powder is melted. The melted Sn and the CuNi alloy powder produce an intermetallic compound phase of a CuNiSn alloy through a TLP reaction.
COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND METHODS FOR PRODUCING THESE
A copper alloy plate containing in a center part of a plate thickness direction more than 2.0% (% by mass) and 32.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.1% of Fe, and 0.005% or more and 0.1% or less of P; and the balance Cu, including a surface layer part in which a surface Zn concentration in a surface is 60% or less of a center Zn concentration in the center part, having a depth from the surface to where Zn concentration is 90% of the center Zn concentration; and in the surface layer, the Zn concentration increases from the surface toward the center part in the plate thickness direction at a concentration gradient of 10% by mass/μm or more and 1000% by mass/μm or less.
Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLATE WITH PLATING FILM, AND METHODS OF PRODUCING THE SAME
A Cu—Ni—Si based copper alloy containing Ni and Si: in a center portion in a plate thickness direction, containing 0.4% by mass or more and 5.0% by mass or less of Ni, 0.05% by mass or more and 1.5% by mass or less of Si, and the balance Cu and inevitable impurities; where an Ni concentration on a plate surface is 70% or less of a center Ni concentration in the thickness center portion; a surface layer portion having a depth from the plate surface to be 90% of the center Ni concentration; in the surface layer portion, the Ni concentration increases from the plate surface toward the thickness center portion at 5.0% by mass/.Math.m or more and 100% by mass/.Math.m or less of a concentration gradient; to improve the electric connection reliability under high-temperature environment.
Controlled thermal coefficient product system and method
A controlled thermal coefficient product manufacturing system and method is disclosed. The disclosed product relates to the manufacture of metallic material product (MMP) having a thermal expansion coefficient (TEC) in a predetermined range. The disclosed system and method provides for a first material deformation (FMD) of the MMP that comprises at least some of a first material phase (FMP) wherein the FMP comprises martensite randomly oriented and a first thermal expansion coefficient (FTC). In response to the FMD at least some of the FMP is oriented in at least one predetermined orientation. Subsequent to deformation, the MMP comprises a second thermal expansion coefficient (STC) that is within a predetermined range and wherein the thermal expansion of the MMP is in at least one predetermined direction. The MMP may be comprised of a second material phase (SMP) that may or may not transform to the FMP in response to the FMD.
Controlled thermal coefficient product system and method
A controlled thermal coefficient product manufacturing system and method is disclosed. The disclosed product relates to the manufacture of metallic material product (MMP) having a thermal expansion coefficient (TEC) in a predetermined range. The disclosed system and method provides for a first material deformation (FMD) of the MMP that comprises at least some of a first material phase (FMP) wherein the FMP comprises martensite randomly oriented and a first thermal expansion coefficient (FTC). In response to the FMD at least some of the FMP is oriented in at least one predetermined orientation. Subsequent to deformation, the MMP comprises a second thermal expansion coefficient (STC) that is within a predetermined range and wherein the thermal expansion of the MMP is in at least one predetermined direction. The MMP may be comprised of a second material phase (SMP) that may or may not transform to the FMP in response to the FMD.
Copper-nickel-tin alloy with high toughness
A spinodal copper-nickel-tin alloy with a combination of improved impact strength, yield strength, and ductility is disclosed. The alloy is formed by process treatment steps including solution annealing, cold working and spinodal hardening. These include such processes as a first heat treatment/homogenization step followed by hot working, solution annealing, cold working, and a second heat treatment/spinodally hardening step. The spinodal alloys so produced are useful for applications demanding enhanced strength and ductility such as for pipes and tubes used in the oil and gas industry.
Copper-nickel-tin alloy with high toughness
A spinodal copper-nickel-tin alloy with a combination of improved impact strength, yield strength, and ductility is disclosed. The alloy is formed by process treatment steps including solution annealing, cold working and spinodal hardening. These include such processes as a first heat treatment/homogenization step followed by hot working, solution annealing, cold working, and a second heat treatment/spinodally hardening step. The spinodal alloys so produced are useful for applications demanding enhanced strength and ductility such as for pipes and tubes used in the oil and gas industry.
Method for forming large-size QCr0.8 alloy tapered cylindrical ring
A method for forming a QCr0.8 alloy tapered cylindrical ring, including: heating a standard QCr0.8 alloy cylindrical part followed by upsetting and stretching at least twice to obtain a primary blank; heating the primary blank followed by upsetting and chamfering to obtain a secondary blank, where a diameter of a top end is greater than that of a bottom end; subjecting the secondary blank to backward extrusion to form a preform; machining the preform to remove a flash and a bottom residue; subjecting a bottom end of the preform to local bulging to enable a shape and a size thereof to match that of a drive roller in a forming tooling, so as to form a profiled ring blank; and rolling the profiled ring blank by a radial-axial ring rolling machine with the forming tooling to form the tapered cylindrical ring.
Electric Guitar Strings of Magnetic Copper Alloys
Guitar strings made of a magnetic copper-nickel-tin-manganese alloy are disclosed. Also disclosed are processing steps that can be performed to fabricate the guitar strings from the alloy. Further described herein are alternative uses for the strings on other electric stringed instruments.