Patent classifications
C22F1/14
Intermetallic L10-NiPtAg catalysts for oxygen reduction reaction
An electrode catalyst for an oxygen reduction reaction including intermetallic L1.sub.0-NiPtAg alloy nanoparticles having enhanced ORR activity and durability. The catalyst including intermetallic L1.sub.0-NiPtAg alloy nanoparticles is synthesized by employing silver (Ag) as a dopant and annealing under specific conditions to form the intermetallic structure. In one example, the intermetallic L1.sub.0-NiPtAg alloy nanoparticles are represented by the formula: Ni.sub.xPt.sub.yAg.sub.z wherein 0.4≤x≤0.6, 0.4≤y≤0.6, z≤0.1.
Intermetallic L10-NiPtAg catalysts for oxygen reduction reaction
An electrode catalyst for an oxygen reduction reaction including intermetallic L1.sub.0-NiPtAg alloy nanoparticles having enhanced ORR activity and durability. The catalyst including intermetallic L1.sub.0-NiPtAg alloy nanoparticles is synthesized by employing silver (Ag) as a dopant and annealing under specific conditions to form the intermetallic structure. In one example, the intermetallic L1.sub.0-NiPtAg alloy nanoparticles are represented by the formula: Ni.sub.xPt.sub.yAg.sub.z wherein 0.4≤x≤0.6, 0.4≤y≤0.6, z≤0.1.
Ag ALLOY SPUTTERING TARGET, AND Ag ALLOY FILM
An Ag alloy sputtering target includes Mg in a range of more than 1.0 atom % and 5.0 atom % or less, Pd in a range of more than 0.10 atom % and 2.00 atom % or less, and a balance consisting of Ag and inevitable impurities. The Ag alloy sputtering target may further include 0.10 atom % or more of Au, and a total content of Au and Pd may be set to 5.00 atom % or less. The Ag alloy sputtering target may further include Ca in a range of 0.01 atom % or more and 0.15 atom % or less. In addition, the oxygen content may be 0.010% by mass or less.
WIRE WITH PLATINUM COMPOSITION FOR CONTACTING TEMPERATURE SENSORS
The invention relates to a wire for electrically contacting temperature sensors, the wire consisting of at least 50 wt % of a platinum composition, the platinum composition containing between 2 wt % and 3.5 wt % tungsten, up to 47.95 wt % of at least one precious metal selected from the group consisting of rhodium, gold, iridium and palladium and mixtures thereof, between 0.05 wt % and 1 wt % oxides of at least one non-precious metal selected from the group consisting of (i) zirconium, (ii) aluminum and (iii) zirconium and at least one element selected from aluminum, yttrium and scandium, and, as the remainder, at least 50 wt % platinum including impurities. The invention also relates to a temperature sensor having such a wire, and to a method for producing such a wire and such a temperature sensor.
WIRE WITH PLATINUM COMPOSITION FOR CONTACTING TEMPERATURE SENSORS
The invention relates to a wire for electrically contacting temperature sensors, the wire consisting of at least 50 wt % of a platinum composition, the platinum composition containing between 2 wt % and 3.5 wt % tungsten, up to 47.95 wt % of at least one precious metal selected from the group consisting of rhodium, gold, iridium and palladium and mixtures thereof, between 0.05 wt % and 1 wt % oxides of at least one non-precious metal selected from the group consisting of (i) zirconium, (ii) aluminum and (iii) zirconium and at least one element selected from aluminum, yttrium and scandium, and, as the remainder, at least 50 wt % platinum including impurities. The invention also relates to a temperature sensor having such a wire, and to a method for producing such a wire and such a temperature sensor.
AG ALLOY SPUTTERING TARGET, AND AG ALLOY FILM
An Ag alloy sputtering target includes Mg in a range of 1.0 atom % or more and 5.0 atom % or less, Au in a range of 0.10 atom % or more and 5.00 atom % or less, and a balance consisting of Ag and inevitable impurities. The Ag alloy sputtering target may further include Ca in a range of 0.01 atom % or more and 0.15 atom % or less. In addition, the oxygen content may be 0.010% by mass or less.
DC high voltage relay and contact material for DC high-voltage relay
A DC high-voltage relay including at least one contact pair including a movable contact and a fixed contact, having a contact force and/or opening force of 100 gf or more, the DC high-voltage relay of 48 V or more. The movable contact and/or the fixed contact includes Ag oxide-based contact material. Metal components in the contact material includes at least one metal M essentially containing Sn, and a balance including Ag and inevitable impurity metals. The content of the metal M is 0.2% by mass or more and 8% by mass or less based on the total mass of all metal components in the contact material. The contact material has a material structure in which one or more oxides of the metal M are dispersed in a matrix including Ag or a Ag alloy. As metal M, In, Bi, Ni and Te can be added.
Platinum-nickel-based alloys, products, and methods of making and using same
Platinum-nickel-based ternary or higher alloys include platinum at about 65-80 wt. %, nickel at about 18-27 wt. %, and about 2-8 wt. % of ternary or higher additions that may include one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, and/or Ta. These alloys are age-hardenable, provide hardness greater than 580 Knoop, ultimate tensile strength in excess of 320 ksi, and elongation to failure of at least 1.5%. The alloys may be used in static and moveable electrical contact and probe applications. The alloys may also be used in medical devices.
Platinum-nickel-based alloys, products, and methods of making and using same
Platinum-nickel-based ternary or higher alloys include platinum at about 65-80 wt. %, nickel at about 18-27 wt. %, and about 2-8 wt. % of ternary or higher additions that may include one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, and/or Ta. These alloys are age-hardenable, provide hardness greater than 580 Knoop, ultimate tensile strength in excess of 320 ksi, and elongation to failure of at least 1.5%. The alloys may be used in static and moveable electrical contact and probe applications. The alloys may also be used in medical devices.
Systems and methods for tailoring coefficients of thermal expansion between extreme positive and extreme negative values
Systems and methods disclosed herein relate to the manufacture of metallic material with a thermal expansion coefficient in a predetermined range, comprising: deforming, a metallic material comprising a first phase and a first thermal expansion coefficient. In response to the deformation, at least some of the first phase is transformed into a second phase, wherein the second phase comprises martensite, and orienting the metallic material in at least one predetermined orientation, wherein the metallic material, subsequent to deformation, comprises a second thermal expansion coefficient, wherein the second thermal expansion coefficient is within a predetermined range, and wherein the thermal expansion is in at least one predetermined direction. In some embodiments, the metallic material comprises the second phase and is thermo-mechanically deformed to orient the grains in at least one direction.