Systems and methods disclosed herein relate to the manufacture of metallic material with a thermal expansion coefficient in a predetermined range, comprising: deforming, a metallic material comprising a first phase and a first thermal expansion coefficient. In response to the deformation, at least some of the first phase is transformed into a second phase, wherein the second phase comprises martensite, and orienting the metallic material in at least one predetermined orientation, wherein the metallic material, subsequent to deformation, comprises a second thermal expansion coefficient, wherein the second thermal expansion coefficient is within a predetermined range, and wherein the thermal expansion is in at least one predetermined direction. In some embodiments, the metallic material comprises the second phase and is thermo-mechanically deformed to orient the grains in at least one direction.

A formation of multielement nanoparticles is disclosed that includes at least three elements. Each of the at least three elements is uniformly distributed within the multielement nanoparticles forming nanoparticles having a homogeneous mixing structure. At least five elements may form a high-entropy nanoparticle structure. A method for manufacturing a formation of multielement nanoparticles includes providing a precursor material composed of the at least three component elements in multielement nanoparticles; heating the precursor material to a temperature and a time; and quenching the precursor to a temperature at a cooling rate to result in a formation of multielement nanoparticles containing at least three elements and the heating and the quenching representing a multielement nanoparticle thermal shock formation process. A corresponding system for manufacturing the formation of multielement nanoparticles and a method of using the multielement nanoparticles are also disclosed.

A formation of multielement nanoparticles is disclosed that includes at least three elements. Each of the at least three elements is uniformly distributed within the multielement nanoparticles forming nanoparticles having a homogeneous mixing structure. At least five elements may form a high-entropy nanoparticle structure. A method for manufacturing a formation of multielement nanoparticles includes providing a precursor material composed of the at least three component elements in multielement nanoparticles; heating the precursor material to a temperature and a time; and quenching the precursor to a temperature at a cooling rate to result in a formation of multielement nanoparticles containing at least three elements and the heating and the quenching representing a multielement nanoparticle thermal shock formation process. A corresponding system for manufacturing the formation of multielement nanoparticles and a method of using the multielement nanoparticles are also disclosed.

The present invention provides an artifactless superelastic alloy including a Au—Cu—Al alloy, the superelastic alloy containing Cu in an amount of 20 atom % or more and 40 atom % or less, Al in an amount of 15 atom % or more and 25 atom % or less, and Au as a balance, the superelastic alloy having a bulk magnetic susceptibility of −24 ppm or more and 6 ppm or less. The Ni-free superelastic alloy of the present invention is capable of exhibiting superelasticity in a normal temperature range, and hardly generated artifacts in a magnetic field environment. The alloy can be produced by setting a casting time in a melting and casting step to a fixed time, and hot-pressing an alloy after casting to make material structures homogeneous.

The present invention provides an artifactless superelastic alloy including a Au—Cu—Al alloy, the superelastic alloy containing Cu in an amount of 20 atom % or more and 40 atom % or less, Al in an amount of 15 atom % or more and 25 atom % or less, and Au as a balance, the superelastic alloy having a bulk magnetic susceptibility of −24 ppm or more and 6 ppm or less. The Ni-free superelastic alloy of the present invention is capable of exhibiting superelasticity in a normal temperature range, and hardly generated artifacts in a magnetic field environment. The alloy can be produced by setting a casting time in a melting and casting step to a fixed time, and hot-pressing an alloy after casting to make material structures homogeneous.

The invention relates to a palladium-copper-silver alloy with palladium as the main component, wherein the palladium-copper-silver alloy has a weight ratio of palladium to copper of at least 1.05 and at most 1.6 and has a weight ratio of palladium to silver of at least 3 and at most 6, and wherein the palladium-copper-silver alloy contains more than 1 wt % and up to a maximum of 6 wt % of ruthenium, rhodium or ruthenium and rhodium and contains, as the remainder, palladium, copper and silver and at most 1 wt % of other metallic elements including impurities. The invention also relates to a wire, a strip or a probe needle made of such a palladium-copper-silver alloy and to the use of such a palladium-copper-silver alloy for testing electrical contacts or for making electrical contact or for producing a sliding contact.

The present invention relates to a medical Au—Pt—Pd alloy including Au, Pt, Pd, and inevitable impurities. The Au—Pt—Pd alloy has an alloy composition inside a polygon (A1-A2-A3-A4) surrounded by straight lines connected at point A1 (Au: 53 atom %, Pt: 4 atom %, and Pd: 43 atom %), point A2 (Au: 70 atom %, Pt: 4 atom %, and Pd: 26 atom %), point A3 (Au: 69.9 atom %, Pt: 30 atom %, and Pd: 0.1 atom %), and point A4 (Au: 49.9 atom %, Pt: 50 atom %, and Pd: 0.1 atom %) in a Au—Pt—Pd ternary state diagram. In a metal structure of the alloy, at least one of a Au-rich phase and a Pt-rich phase is distributed, and the total of the area ratio of the Au-rich phase and the area ratio of the Pt-rich phase is 1.5% or more and 25.4% or less.

The present invention relates to a medical Au—Pt—Pd alloy including Au, Pt, Pd, and inevitable impurities. The Au—Pt—Pd alloy has an alloy composition inside a polygon (A1-A2-A3-A4) surrounded by straight lines connected at point A1 (Au: 53 atom %, Pt: 4 atom %, and Pd: 43 atom %), point A2 (Au: 70 atom %, Pt: 4 atom %, and Pd: 26 atom %), point A3 (Au: 69.9 atom %, Pt: 30 atom %, and Pd: 0.1 atom %), and point A4 (Au: 49.9 atom %, Pt: 50 atom %, and Pd: 0.1 atom %) in a Au—Pt—Pd ternary state diagram. In a metal structure of the alloy, at least one of a Au-rich phase and a Pt-rich phase is distributed, and the total of the area ratio of the Au-rich phase and the area ratio of the Pt-rich phase is 1.5% or more and 25.4% or less.

An object of the present invention is to provide a Pd alloy, a Pd alloy material, and a probe pin for electric and electronic devices in which specific resistance, hardness, and processability are balanced at a higher level than before, and methods for manufacturing the same. In order to achieve this object, the Pd alloy for electric and electronic devices according to the present invention having a composition comprising 50.1 mass % or more and 55.5 mass % or less of Pd, 6.3 mass % or more and 16.1 mass % or less of Ag, 30.0 mass % or more and 38.0 mass % or less of Cu, and 0.5 mass % or more and 2.0 mass % or less of In is adopted.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.