C22F1/14

Methods for preparing alternating arrangement silvercopper lateral composite ingot and strip

A method for preparing an alternating arrangement silver-copper lateral composite ingot, including: using a concave roller set; manufacturing a copper frame having a fixed width according to a negative tolerance of a width of the grooves of the concave roller, and corresponding copper bars and silver bars, and performing a surface treatment on the copper frame, the copper bars, and the silver bars; and then arranging different number of copper bars and silver bars at internals as needed and tightly placing into the copper frame to form a composite blank, i.e., a composite ingot. A method for preparing an alternating arrangement silver-copper lateral composite strip is further provided, and the silver-copper lateral composite ingot prepared by the method for preparing the alternating arrangement silver-copper lateral composite ingot is used to prepare the silver-copper lateral composite strip.

Methods for preparing alternating arrangement silvercopper lateral composite ingot and strip

A method for preparing an alternating arrangement silver-copper lateral composite ingot, including: using a concave roller set; manufacturing a copper frame having a fixed width according to a negative tolerance of a width of the grooves of the concave roller, and corresponding copper bars and silver bars, and performing a surface treatment on the copper frame, the copper bars, and the silver bars; and then arranging different number of copper bars and silver bars at internals as needed and tightly placing into the copper frame to form a composite blank, i.e., a composite ingot. A method for preparing an alternating arrangement silver-copper lateral composite strip is further provided, and the silver-copper lateral composite ingot prepared by the method for preparing the alternating arrangement silver-copper lateral composite ingot is used to prepare the silver-copper lateral composite strip.

SILVER JEWELRY AND METHOD FOR PRODUCING THE SAME
20210112931 · 2021-04-22 ·

Provided are a silver jewelry article formed using pure silver, which has high Vickers hardness and prohibit the occurrence of discoloration and its method. Disclosed are a silver jewelry article and its method, wherein the Vickers hardness is adjusted to 60 HV or higher, and when the height of the peak of 2θ=38°±0.2° by an XRD is designated as h1, and that of 2θ=44°±0.4° is designated as h2, h2/h1 is adjusted to 0.2 or greater.

SILVER ARTICLE AND METHOD FOR PRODUCING SILVER ARTICLE
20210115534 · 2021-04-22 ·

Provided are a silver article formed using pure silver, which has high Vickers hardness and prohibits the occurrence of metal corrosion and the occurrence of discoloration; and its method. Disclosed are a silver article and its method, wherein the Vickers hardness is adjusted to 60 HV or higher, and when the height of the peak of 2θ=38°±0.2° by an XRD is designated as h1, and that of 2θ=44°±0.4° is designated as h2, h2/h1 is adjusted to 0.2 or greater.

PLATINUM-BASED SPUTTERING TARGET, AND METHOD FOR PRODUCING THE SAME

The present invention relates to a platinum-based sputtering target containing platinum or a platinum alloy. The platinum-based sputtering target of the present invention is characterized by a material structure in a thickness-direction cross section thereof. Specifically, when a thickness-direction cross section is equally divided into n sections (n=5 to 20) along a thickness direction, a region including (n2) sections excluding both end sections is set as a determination region, and when an average grain size in each of the sections is measured in the determination region, as well as an average grain size in the entire determination region is measured, the average grain size in the entire determination region is 150 m or less, and a coefficient of variation calculated based on the average grain size in each of the sections of the determination region is 15% or less.

ALLOY FOR MEDICAL USE, AND METHOD FOR PRODUCING SAME

The present invention provides an alloy for medical use including an AuPt alloy, in which the AuPt alloy has a Pt concentration of 24 mass % or more and less than 34 mass % with the balance being Au, and has at least a material structure in which a Pt-rich phase having a Pt concentration higher than that of an -phase is distributed in an -phase matrix, the Pt-rich phase has a Pt concentration that is 1.2 to 3.8 times the Pt concentration of the -phase, and the Pt-rich phase has an area ratio of 1 to 22% in any cross-section. This alloy is an artifact-free alloy material that exhibits excellent compatibility with a magnetic field environment such as an MRI and has magnetic susceptibility of 4 ppm with respect to magnetic susceptibility of water.

ALLOY FOR MEDICAL USE, AND METHOD FOR PRODUCING SAME

The present invention provides an alloy for medical use including an AuPt alloy, in which the AuPt alloy has a Pt concentration of 24 mass % or more and less than 34 mass % with the balance being Au, and has at least a material structure in which a Pt-rich phase having a Pt concentration higher than that of an -phase is distributed in an -phase matrix, the Pt-rich phase has a Pt concentration that is 1.2 to 3.8 times the Pt concentration of the -phase, and the Pt-rich phase has an area ratio of 1 to 22% in any cross-section. This alloy is an artifact-free alloy material that exhibits excellent compatibility with a magnetic field environment such as an MRI and has magnetic susceptibility of 4 ppm with respect to magnetic susceptibility of water.

Thin-film transistor and method of forming an electrode of a thin-film transistor

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Thin-film transistor and method of forming an electrode of a thin-film transistor

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Coated wire

A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.