A method of preparing silver nanoparticles, including silver nanorings. A zinc oxide thin film is formed initially by direct-current sputtering of a zinc target onto a substrate. A silver thin film is then formed by a similar sputtering technique, of a silver target onto the zinc oxide thin film. After that, the silver thin film is subject to an annealing treatment. The temperature, duration and atmosphere of the annealing treatment can be varied to control the average particle size, average distance between particles (density), particle size distribution of the silver nanoparticles. In at least one embodiment, silver nanoparticles of ring structure are produced.

The present invention relates to a method for the production of palladium(0) powder in which a palladium(0) starting powder is subjected to a thermal treatment in a furnace at a temperature of no more than 370° C. in a hydrogen gas atmosphere.

The present invention relates to a method for the production of palladium(0) powder in which a palladium(0) starting powder is subjected to a thermal treatment in a furnace at a temperature of no more than 370° C. in a hydrogen gas atmosphere.

An amorphously solidifying noble metal alloy has the following composition of AaBbCc, wherein: A represents at least one noble metal from a group of platinum and palladium; B represents at least one element from a group of Al, Au, Ag and Cu; and C represents at least one element from a group of Ga and Ge. The mass fraction a lies in a region of 45-60 mass percent. The mass fraction b lies in the region of 39-55 mass percent. The mass fraction c lies in the region of 0-13 mass percent. Where platinum and palladium are both present, the amorphous noble metal alloy does not have aluminum as the sole alloy component from group B. The above mass fractions a, b and c, aside from typical admixtures, impurities and alloy tolerances, add up to 100 mass percent.

An amorphously solidifying noble metal alloy has the following composition of AaBbCc, wherein: A represents at least one noble metal from a group of platinum and palladium; B represents at least one element from a group of Al, Au, Ag and Cu; and C represents at least one element from a group of Ga and Ge. The mass fraction a lies in a region of 45-60 mass percent. The mass fraction b lies in the region of 39-55 mass percent. The mass fraction c lies in the region of 0-13 mass percent. Where platinum and palladium are both present, the amorphous noble metal alloy does not have aluminum as the sole alloy component from group B. The above mass fractions a, b and c, aside from typical admixtures, impurities and alloy tolerances, add up to 100 mass percent.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

The present invention is directed to an alloy usable for jewelry applications in which the color can be classified as white, the alloy contains both platinum and palladium and is at a metal cost or lower than that of traditional palladium-containing jewelry alloys, and is commercially age hardenable through heat treatment.

The present invention is directed to an alloy usable for jewelry applications in which the color can be classified as white, the alloy contains both platinum and palladium and is at a metal cost or lower than that of traditional palladium-containing jewelry alloys, and is commercially age hardenable through heat treatment.

An Ag alloy sputtering target of the present invention includes, as a composition, 0.1 at % to 3.0 at % of Sn, 1.0 at % to 10.0 at % of Cu, and a balance of Ag and inevitable impurities. In addition, an Ag alloy film of the present invention includes, as a composition, 0.1 at % to 3.0 at % of Sn, 1.0 at % to 10.0 at % of Cu, and a balance of Ag and inevitable impurities.