Provided is a ceramic coating intended to be applied on a metal support and having the form of at least a continuous film having a thickness between 2 and 100 μm, this coating comprising a matrix including at least a metal polyalkoxide and wherein are dispersed particles whereof the diameter ranges between 0.01 and 50 μm, said particles being from a material having a thermal conductivity equal to or higher than 10 W.Math.m.sup.−1.Math.K.sup.−1 and a bulk density of at the most 3.9 g/cm.sup.3. Also provided is an article, for example culinary, comprising such a coating and its method of manufacture.

The present invention provides a method for producing a sheet. The method includes providing a substrate, depositing a metal coating over at least one surface by dipping the substrate in a bath in order to obtain the sheet, wiping the metal coating by means of at least one nozzle projecting through at least one outlet a wiping gas onto the metal coating, the sheet being run in front of the nozzle, the wiping gas being ejected from the nozzle along a primary direction of ejection (E), a confinement box delimiting a confined zone at least downstream of the zone of impact (I) of the wiping gas on the sheet and solidifying the metal coating. The method satisfying: $\frac{Z}{d}\le 12\mathrm{and}{f}_{O_2}\le \frac{{10}^{-4}}{W^2}\left(0.63+\sqrt{0.4+{94900}^{*}{W}^2}\right)\mathrm{with}W=\frac{\sqrt{\mathrm{PdZ}}}{V}.$

The present invention provides a method for producing a sheet. The method includes providing a substrate, depositing a metal coating over at least one surface by dipping the substrate in a bath in order to obtain the sheet, wiping the metal coating by means of at least one nozzle projecting through at least one outlet a wiping gas onto the metal coating, the sheet being run in front of the nozzle, the wiping gas being ejected from the nozzle along a primary direction of ejection (E), a confinement box delimiting a confined zone at least downstream of the zone of impact (I) of the wiping gas on the sheet and solidifying the metal coating. The method satisfying: $\frac{Z}{d}\le 12\mathrm{and}{f}_{O_2}\le \frac{{10}^{-4}}{W^2}\left(0.63+\sqrt{0.4+{94900}^{*}{W}^2}\right)\mathrm{with}W=\frac{\sqrt{\mathrm{PdZ}}}{V}.$

A flat steel product for hot forming may be produced from a steel substrate that includes a steel comprising 0.1-3% by weight Mn and up to 0.01% by weight B, along with a protective coating that is applied to the steel substrate. The protective coating may be based on Al and may contain up to 20% by weight of other alloy elements. Also disclosed are methods for producing such flat steel products, steel components, and methods for producing steel components. Absorption of hydrogen is minimized during heating necessary for hot forming. This is achieved at least in part through an alloy constituent of 0.1-0.5% by weight of at least one alkaline earth or transition metal in the protective coating, wherein an oxide of the alkaline earth or transition metal is formed on an outer surface of the protective coating during hot forming of the flat steel product.

Disclosed is a hot-dip Al—Zn alloy coated steel sheet having excellent anti-corrosion property after coating, and a method for producing the same. In the disclosure, the hot-dip Al—Zn alloy coated steel sheet has a hot-dip coating layer containing by mass %, Al: 25% to 90%, and at least one of Sn: 0.01% to 2.0%, In: 0.01% to 10%, and Bi: 0.01% to 2.0%.

Disclosed is a hot-dip Al—Zn alloy coated steel sheet having excellent anti-corrosion property after coating, and a method for producing the same. In the disclosure, the hot-dip Al—Zn alloy coated steel sheet has a hot-dip coating layer containing by mass %, Al: 25% to 90%, and at least one of Sn: 0.01% to 2.0%, In: 0.01% to 10%, and Bi: 0.01% to 2.0%.

Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.

Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.

A high-strength cold-rolled steel sheet having excellent bending workability includes, by weight %, 0.13-0.25% of carbon (C), 1.0-2.0% of silicon (Si), 1.5-3.0% of manganese (Mn), 0.08-1.5% of aluminum (Al)+chromium (Cr)+molybdenum (Mo), 0.1% or less of phosphorus (P), 0.01% or less of sulfur (S), 0.01% or less of nitrogen (N), the remainder of Fe and inevitable impurities, and comprises, by area fraction, 3-25% of ferrite, 20-40% of martensite, and 5-20% of retained austenite, in which a nickel-rich layer formed of nickel (Ni) introduced from the outside is provided on a surface layer portion, and the concentration of nickel (Ni) at a depth of 1 μm from the surface may be greater than or equal to 0.15 wt %.

A high-strength cold-rolled steel sheet having excellent bending workability includes, by weight %, 0.13-0.25% of carbon (C), 1.0-2.0% of silicon (Si), 1.5-3.0% of manganese (Mn), 0.08-1.5% of aluminum (Al)+chromium (Cr)+molybdenum (Mo), 0.1% or less of phosphorus (P), 0.01% or less of sulfur (S), 0.01% or less of nitrogen (N), the remainder of Fe and inevitable impurities, and comprises, by area fraction, 3-25% of ferrite, 20-40% of martensite, and 5-20% of retained austenite, in which a nickel-rich layer formed of nickel (Ni) introduced from the outside is provided on a surface layer portion, and the concentration of nickel (Ni) at a depth of 1 μm from the surface may be greater than or equal to 0.15 wt %.