Patent classifications
C23C4/01
LIQUID METAL-BASED ELECTRODE AND METHOD OF MANUFACTURING THE SAME
The present disclosure relates to a method of manufacturing a liquid metal-based electrode using a light sintering process. The method of manufacturing a liquid metal-based electrode includes a step of preparing a metal nanoparticle solution, a step of adding metal micron particles and a surface modifier to the metal nanoparticle solution to prepare a mixed solution, a step of adding a liquid metal to the mixed solution to prepare a composite ink containing the liquid metal having a surface oxide film formed thereon, a step of forming an electrode by applying the composite ink onto a substrate, and a step of irradiating the electrode with light to destroy the surface oxide film.
LIQUID METAL-BASED ELECTRODE AND METHOD OF MANUFACTURING THE SAME
The present disclosure relates to a method of manufacturing a liquid metal-based electrode using a light sintering process. The method of manufacturing a liquid metal-based electrode includes a step of preparing a metal nanoparticle solution, a step of adding metal micron particles and a surface modifier to the metal nanoparticle solution to prepare a mixed solution, a step of adding a liquid metal to the mixed solution to prepare a composite ink containing the liquid metal having a surface oxide film formed thereon, a step of forming an electrode by applying the composite ink onto a substrate, and a step of irradiating the electrode with light to destroy the surface oxide film.
POPPET VALVE
A poppet valve includes: a valve body comprising a valve stem body, a valve head body with a valve combustion face, and a valve fillet body interconnecting the valve stem body and the valve head body. The valve fillet body surface has an increased thermal resistance compared to the valve combustion face.
POPPET VALVE
A poppet valve includes: a valve body comprising a valve stem body, a valve head body with a valve combustion face, and a valve fillet body interconnecting the valve stem body and the valve head body. The valve fillet body surface has an increased thermal resistance compared to the valve combustion face.
Method to selectively pattern a surface for plasma resistant coat applications
A method for providing a part with a plasma resistant ceramic coating for use in a plasma processing chamber is provided. A patterned mask is placed on the part. A film is deposited over the part. The patterned mask is removed. A plasma resistant ceramic coating is applied on the part.
Method to selectively pattern a surface for plasma resistant coat applications
A method for providing a part with a plasma resistant ceramic coating for use in a plasma processing chamber is provided. A patterned mask is placed on the part. A film is deposited over the part. The patterned mask is removed. A plasma resistant ceramic coating is applied on the part.
RARE-EARTH OXIDE BASED COATINGS BASED ON ION ASSISTED DEPOSITION
A component for a processing chamber includes a ceramic body having at least one surface with a first average surface roughness. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 μm over the at least one surface and having a second average surface roughness that is less than the first average surface roughness.
RARE-EARTH OXIDE BASED COATINGS BASED ON ION ASSISTED DEPOSITION
A component for a processing chamber includes a ceramic body having at least one surface with a first average surface roughness. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 μm over the at least one surface and having a second average surface roughness that is less than the first average surface roughness.
Method of manufacturing conductive film holes
A method for applying a coating to a substrate having a plurality of holes. The method comprises: applying a braze material to a substrate having a plurality of holes; heating the substrate to melt the braze material to form a melt; cooling the substrate to solidify the melt to form plugs in the respective holes; applying a coating to the substrate; and further heating the substrate to melt the plugs.
Method of manufacturing conductive film holes
A method for applying a coating to a substrate having a plurality of holes. The method comprises: applying a braze material to a substrate having a plurality of holes; heating the substrate to melt the braze material to form a melt; cooling the substrate to solidify the melt to form plugs in the respective holes; applying a coating to the substrate; and further heating the substrate to melt the plugs.