An article has a metallic substrate having a plurality of recesses. A first coating is at least at the recesses and has: a splatted layer; and a columnar layer atop the splatted layer. A second coating is away from the recesses and has: a columnar layer atop the substrate without an intervening splatted layer.

An article has a metallic substrate having a plurality of recesses. A first coating is at least at the recesses and has: a splatted layer; and a columnar layer atop the splatted layer. A second coating is away from the recesses and has: a columnar layer atop the substrate without an intervening splatted layer.

An object of this invention is to provide a crucible for growing a sapphire single crystal, which is optimized for providing a sapphire single crystal and is reusable. A crucible for growing a sapphire single crystal of this invention includes: a base material (3) containing molybdenum as a main component and having a crucible shape; and a coating layer (5) with which only an inner periphery of the base material (3) is coated and which is formed of tungsten and inevitable impurities, in which the coating layer (5) has a surface roughness Ra of 5 μm or more and 20 μm or less.

An object of this invention is to provide a crucible for growing a sapphire single crystal, which is optimized for providing a sapphire single crystal and is reusable. A crucible for growing a sapphire single crystal of this invention includes: a base material (3) containing molybdenum as a main component and having a crucible shape; and a coating layer (5) with which only an inner periphery of the base material (3) is coated and which is formed of tungsten and inevitable impurities, in which the coating layer (5) has a surface roughness Ra of 5 μm or more and 20 μm or less.

Methods of preventing or reducing cutter loss in a steel body PDC drilling tool may include applying a hardfacing layer on a surface of a PDC cutter pocket to form a covered PDC cutter pocket, the hardfacing layer comprising a metal binder and coated tungsten carbide particles; and bonding a PDC cutter into the covered PDC cutter pocket with a brazing material. Steel body PDC drilling tools may include a steel body, a PDC cutter, a PDC cutter pocket, and a hardfacing layer. Methods of preventing or reducing cutter loss in a steel body PDC drilling tool may include applying a hardfacing layer on a surface of a PDC cutter pocket of the steel body PDC drilling tool; applying a coated buffering layer on the hardfacing layer to form a coated PDC cutter pocket; and bonding the PDC cutter into the coated PDC cutter pocket with a brazing material.

In a method for manufacturing a cylinder block provided with cylinder bores, the cylinder block is held by a clamp device, stress is generated in the cylinder block by a holding force of the clamp device to duplicate deformations of the cylinder bores after assembling hearing caps thereon, boring is carried out with the cylinder bores deformed in a condition where the stress is generated, and a thermally sprayed coating is formed, after the boring, on each inner surfaces of the cylinder bores deformed in the condition where the stress is generated. According to the method for manufacturing a cylinder block, superior cylindricity, after assembling the bearing caps, of the cylinder bores on each of which the thermally sprayed coating is formed can be brought, and workability degradation of finishing works (honing) for each inner surface of the cylinder bores (thermally sprayed coatings) can be restricted.

In a method for manufacturing a cylinder block provided with cylinder bores, the cylinder block is held by a clamp device, stress is generated in the cylinder block by a holding force of the clamp device to duplicate deformations of the cylinder bores after assembling hearing caps thereon, boring is carried out with the cylinder bores deformed in a condition where the stress is generated, and a thermally sprayed coating is formed, after the boring, on each inner surfaces of the cylinder bores deformed in the condition where the stress is generated. According to the method for manufacturing a cylinder block, superior cylindricity, after assembling the bearing caps, of the cylinder bores on each of which the thermally sprayed coating is formed can be brought, and workability degradation of finishing works (honing) for each inner surface of the cylinder bores (thermally sprayed coatings) can be restricted.

A method of forming a sprayed coating includes preparing a spray target member having a surface on which openings of first ends of holes are formed, preparing a plurality of masking pins each of which comprises metal, and inserting each of the masking pins into a corresponding one of the holes so that each of the masking pins partially protrudes from the surface. The method also includes applying an adhesive agent for fixing the masking pins to the respective holes, to at least one of the holes or the masking pins, forming a ceramic layer by spraying on the surface of the spraying target member, the ceramic layer comprising a ceramic material, while the masking pins are fixed to the respective holes via the adhesive agent, and removing the masking pins from the holes after the spraying step.

A semiconductor processing member is provided, including a body and a plasma spray coating provided on the body. The coating is an ABO or ABCO complex oxide solid solution composition, where A, B and C are selected from the group consisting of La, Zr, Ce, Gd, Y, Yb and Si, and O is an oxide. The coating imparts both chlorine and fluorine plasma erosion resistance, reduces particle generation during plasma etching, and prevents spalling of the coating during wet cleaning of the semiconductor processing member.

A semiconductor processing member is provided, including a body and a plasma spray coating provided on the body. The coating is an ABO or ABCO complex oxide solid solution composition, where A, B and C are selected from the group consisting of La, Zr, Ce, Gd, Y, Yb and Si, and O is an oxide. The coating imparts both chlorine and fluorine plasma erosion resistance, reduces particle generation during plasma etching, and prevents spalling of the coating during wet cleaning of the semiconductor processing member.