A maskless touch up tool having a faceplate and handle. The faceplate is placed on a surface for touching up of a coating on the surface. The surface may be on a rocket body. The faceplate may form a seal around a target region of the surface. The faceplate has an opening configured to receive a touch up coating therethrough for application of the touch up coating to the surface. The handle may extend away from the faceplate and be configured for gripping by a user. The tool may include a reservoir, or an attachment for an external container, configured to collect excess touch up coating from the surface. The tool may be used to touch up the surface coating without the need for masking of the surface.

A maskless touch up tool having a faceplate and handle. The faceplate is placed on a surface for touching up of a coating on the surface. The surface may be on a rocket body. The faceplate may form a seal around a target region of the surface. The faceplate has an opening configured to receive a touch up coating therethrough for application of the touch up coating to the surface. The handle may extend away from the faceplate and be configured for gripping by a user. The tool may include a reservoir, or an attachment for an external container, configured to collect excess touch up coating from the surface. The tool may be used to touch up the surface coating without the need for masking of the surface.

A maskless touch up tool having a faceplate and handle. The faceplate is placed on a surface for touching up of a coating on the surface. The surface may be on a rocket body. The faceplate may form a seal around a target region of the surface. The faceplate has an opening configured to receive a touch up coating therethrough for application of the touch up coating to the surface. The handle may extend away from the faceplate and be configured for gripping by a user. The tool may include a reservoir, or an attachment for an external container, configured to collect excess touch up coating from the surface. The tool may be used to touch up the surface coating without the need for masking of the surface.

A universal joint or other vehicle driveline assembly includes an inner race, an outer race, and bearings positioned between the races. In some embodiments, the components of the universal joint that are in contact with the bearings are selectively processed to be harder than the other non-contact surfaces of the component.

A universal joint or other vehicle driveline assembly includes an inner race, an outer race, and bearings positioned between the races. In some embodiments, the components of the universal joint that are in contact with the bearings are selectively processed to be harder than the other non-contact surfaces of the component.

A device structure may be manufactured by forming a first copper-containing metal interconnect structure embedded in a first dielectric material layer; forming a second dielectric material layer over the first copper-containing metal interconnect structure and the first dielectric material layer; forming a cavity through the second dielectric material layer such that a surface segment of the first copper-containing metal interconnect structure is exposed underneath the cavity; converting a surface portion of the first copper-containing metal interconnect structure into a copper-based tunneling barrier layer; and forming a second copper-containing metal interconnect structure in the cavity on the copper-based tunneling barrier layer.

A device structure may be manufactured by forming a first copper-containing metal interconnect structure embedded in a first dielectric material layer; forming a second dielectric material layer over the first copper-containing metal interconnect structure and the first dielectric material layer; forming a cavity through the second dielectric material layer such that a surface segment of the first copper-containing metal interconnect structure is exposed underneath the cavity; converting a surface portion of the first copper-containing metal interconnect structure into a copper-based tunneling barrier layer; and forming a second copper-containing metal interconnect structure in the cavity on the copper-based tunneling barrier layer.