Patent classifications
C23C14/0005
SINGLE-PHASE ALLOY OF GOLD AND TUNGSTEN
A single-phase alloy is formed, as weight percentages, of N % of gold, M % of tungsten, with N+M=100, M8 and N60. Also disclosed is a process for preparing such an alloy use of such an alloy and decorative sheets made from such an alloy.
Forming electrode active materials
In an example of a method for making an electrode active material, a sacrificial layer is formed on a nanomaterial. Carbon is coated on the sacrificial layer to form a carbon layer. Titanium dioxide is coated on the carbon layer to form a titanium dioxide layer. The sacrificial layer is removed to form a void between the nanomaterial and the carbon layer.
Free-standing lithium phosphorus oxynitride think films and methods of their manufacture
Methods and articles of manufacture for free-standing lithium phosphorus oxynitride (LiPON) thin films are disclosed. The methods facilitate synthesizing the LiPON thin films in a free-standing form with controllable film thicknesses and areas. The free-standing LiPON thin films, absent a solid substrate contacting the LiPON thin films, enable studying fundamental properties of LiPON thin films including mechanical properties and glassy transition behavior. In some embodiments, the method includes modifying a surface of a substrate, forming a layer of LiPON on the modified surface of the substrate, and separating the layer of LiPON from the substrate. The free-standing LiPON thin films, no longer requiring solid substrates, may be used in applications requiring an ionically conductive or electronically insulating coating, film, or barrier layer.
Ultra-low fractional area coverage flow diverter for treating aneurysms and vascular diseases
A flow diverter is described and fabricated using ultra-thin porous thin-film Nitinol, and is configured for implantation to a treatment site within a vessel for significant reduction in an intra-aneurismal flow velocity and vorticity. Using small size pores in a coverage area of only 10%, a 90% reduction in flow velocity into a pseudo-aneurysm can be achieved, with an almost immediate cessation of flow into an anatomical feature such as aneurysm sac in vivo. The size of the holes can be tailored to be any shape and range in size from 1-400 m using photolithography and from 5-1000 nm using ebeam lithography.
Curved high temperature alloy sandwich panel with a truss core and fabrication method
A lightweight sandwich panel structure with a complex shape and curvature, and a method to fabricate such a panel out of high temperature alloys. Embodiments of a micro-truss core structure that offer high specific strength and stiffness while allowing for curvature, and methods for depositing multiple layers of metals that can be interdiffused into complex alloys, are provided. A core of a panel may be fabricated from a polymer template, which may be shaped, e.g., curved, and coated with metal layers, which may then be heat treated to cause the layers of metal to interdiffuse, to form an alloy.
ULTRA-BRIGHT PASSIVATED ALUMINUM NANO-FLAKE PIGMENTS
Nano-thick flakes that are either flat, and specularly-reflective in visible light or that have microroughness intentionally controlled to disperse or interfere with visible light. Coatings and inks utilizing such flakes. Method for fabrication of such flakes in partial vacuum includes the repeated multiple times deposition of a release layer over a substrate surface and a flake layer over the release layer to form a multilayer structure further reduced to individual flakes. Reactive metal is passivated inline with the deposition of the flake layer for superior corrosion resistance. Chemically-functional materials are optionally added to the release material to transfer their functionality to the surface of flake layer to create unique functional properties on a flake surface before the multilayer structure is removed from the substrate.
Conductive transparent film and method for making same
A method for the production of a transparent conductor deposit on a substrate, the method comprising: providing a substrate formed from a first material; depositing a film of a second material on the substrate; causing the film to crack so as to provide a plurality of recesses; depositing a conductive material in the recesses; and removing the film from the substrate so as to yield a transparent conductive deposit on the substrate.
Nanowire manufacturing kit having nanowire manufacturing substrate and nanowire adhesive film and nanowire manufactured using the same
Provided is a nanowire manufacturing substrate, comprising a grid base layer on a substrate and a grid pattern formed by patterning the grid base layer, the grid pattern being disposed to produce a nanowire on a surface thereof. According to the present invention, the width and height of the nanowire can be adjusted by controlling the wet-etching process time period, and the nanowire can be manufactured at a room temperature at low cost, the nanowire can be mass-manufactured and the nanowire with regularity can be manufactured even in case of mass production.
SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER-CLAD LAMINATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
There is provided a surface-treated copper foil including a surface coating layer provided on at least one surface of a copper foil, the surface coating layer being mainly composed of silicon with a hydrogen content of 1 to 35 atomic % and/or a carbon content of 1 to 15 atomic %. This foil can be manufactured by forming a surface coating layer composed mainly of silicon with the above hydrogen and carbon contents on at least one surface of the copper foil by PVD or CVD. The present invention can provide a copper foil with a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board.
APPARATUS FOR MANUFACTURING THIN FILM CLUSTER, THIN FILM CLUSTER, THIN FILM, UV-BLOCKING AGENT AND COSMETICS
The present invention provides a thin film cluster production system characterized by producing a thin film cluster in situ and achieving improved quality, high productivity, and significantly reduced initial investment costs, a thin film cluster production method, a thin film cluster, a thin film, a UV protector, and cosmetics.