C23C14/0021

FRICTION REDUCED AND WEAR RESISTANT COATING, PREPARATION METHOD THEREOF AND PISTON RING
20200370162 · 2020-11-26 ·

Provided are a friction reduced and wear resistant coating, a preparation method thereof and a piston ring. The coating includes an adhesive layer, a transition layer, a gradient layer and a function layer in sequence. The gradient layer is a CrMo.sub.xN layer in which Mo content progressively increases. The function layer includes at least one cyclical layer. Each cyclical layer includes a first CrMo.sub.xN layer and a second CrMo.sub.xN layer in sequence from bottom to top. The Mo content of the first CrMo.sub.xN layer is lower than the Mo content of the second CrMo.sub.xN layer. The coating provided by the present invention has a friction coefficient of 0.3 to 0.45, 10% to 30% lower than a CrN coating, and has an overall hardness of up to 1400 HV to 2600 HV and a thickness of 80 m, satisfying the required durability for the full lifecycle of the piston ring. The preparation process of the coating is simple and highly operable, and thus is convenient for industrialization.

Arc evaporation device

An arc evaporation device includes a bar-shaped target having a front end surface and a side surface to be melted and evaporated from the front end surface by arc discharge; an arc power supply; a target feed unit which moves the target axially and in a feed direction; an ignition rod capable of contact with the side surface of the target, in an intersecting direction intersecting the feed direction; a rotary actuator which moves the ignition rod along the intersecting direction from a retraction position apart from the side surface in the intersecting direction to make the ignition rod enter a transport region into which the target is fed; and a detection unit which detects whether or not the ignition rod has come into contact with the side surface of the target during movement of the ignition rod.

METAL-ORGANIC PULSED LASER DEPOSITION FOR STOICHIOMETRIC COMPLEX OXIDE THIN FILMS
20200365403 · 2020-11-19 ·

Methods and systems for forming complex oxide films are provided. Also provided are complex oxide films and heterostructures made using the methods and electronic devices incorporating the complex oxide films and heterostructures. In the methods pulsed laser deposition is conducted in an atmosphere containing a metal-organic precursor to form highly stoichiometric complex oxides.

AlON coated substrate with optional yttria overlayer
10840067 · 2020-11-17 · ·

A fluorine plasma resistant coating on a substrate being a component in a semiconductor manufacturing system is disclosed. In one embodiment the composition includes an AlON coating that overlies a substrate, and an optional yttria coating layer that overlies the AlON coating, with a total coating thickness of about 5-6 microns.

Superalloy target

A superalloy target wherein the superalloy target has a polycrystalline structure of random grain orientation, the average grain size in the structure is smaller than 20 m, and the porosity in the structure is smaller than 10%. Furthermore, the invention includes a method of producing a superalloy target by powder metallurgical production, wherein the powder-metallurgical production starts from alloyed powder(s) of a superalloy and includes the step of spark plasma sintering (SPS) of the alloyed powder(s).

GAS BARRIER LAMINATE AND PACKAGING MATERIAL INCLUDING THE SAME
20200331024 · 2020-10-22 · ·

A gas barrier laminate including a resin substrate, a first coating layer containing a carboxylic acid polymer; and a second coating layer containing a polyvalent metal compound and a resin, laminated in this order; a ratio of a thickness of the second coating layer to the first coating layer in the range of 1.0 or more and 4.0 or less; and the second coating layer satisfies at least one of the following: (condition 1) a haze of the second coating layer is 8% or less; (condition 2) a surface roughness Ra of the second coating layer is or less of the thickness of the second coating layer; and (condition 3) the number of concave portions having a diameter of 1.5 m or more per unit area on a surface of the second coating layer opposite to the first coating layer is 2/0.01 mm.sup.2 or less.

SURFACE-COATED CUTTING TOOL

A surface-coated cutting tool includes: a substrate including a rake face and a flank face; a first coating film that coats the rake face; and a second coating film that coats the flank face, wherein the first coating film includes a first composite nitride layer at a region d1 on the rake face, the second coating film includes a second composite nitride layer at a region d2 on the flank face, the first composite nitride layer includes Ti.sub.1-x1-y1Al.sub.x1Ta.sub.y1C.sub.1N.sub.1, the second composite nitride layer includes Ti.sub.1-x2-y2Al.sub.x2Ta.sub.y2C.sub.2N.sub.2.

Method for Solvent-Free Perovskite Deposition
20200332408 · 2020-10-22 ·

A method for solvent-free perovskite deposition. The method comprises loading a lead target and one or more samples adhered to a substrate holder into a deposition chamber, pumping down to a high vacuum pressure, and backfilling the deposition chamber with the vapor of a salt precursor to form a perovskite material.

Low stress hard coatings and applications thereof
10808325 · 2020-10-20 · ·

In one aspect, coated cutting tools are described herein comprising a substrate and a coating comprising a refractory layer deposited by physical vapor deposition adhered to the substrate, the refractory layer comprising M.sub.1xAl.sub.xN wherein x0.68 and M is titanium, chromium or zirconium, the refractory layer including a cubic crystalline phase and having hardness of at least 25 GPa.

Separator, method for preparing separator and electrochemical device containing separator

A separator, a method for preparing the separator, and an electrochemical device containing the separator. The separator includes a substrate and an inorganic layer disposed on at least one side of the substrate. The substrate is a porous substrate. The inorganic layer is a dielectric layer containing no binder. The inorganic layer has a thickness of 20 nm to 2000 nm. A mass of the inorganic layer is M1, a mass of the substrate is M2, and M1/M2 is greater than or equal to 0.05 but smaller than or equal to 7.5. An interfacial peeling force between the inorganic layer and the substrate is not smaller than 30 N/m. The interfacial wettability and thermal shrinkage resistance performance of the separator are effectively improved while the separator has a certain mechanical strength. The separator can have favorable mechanical strength and thermal shrinkage percentage and high energy density.