Methods and devices for forming a conductive line disposed over a substrate. A first dielectric layer is disposed over the substrate and coplanar with the conductive line. A second dielectric layer disposed over the conductive line and a third dielectric layer disposed over the first dielectric layer. A via extends through the second dielectric layer and is coupled to the conductive line. The second dielectric layer and the third dielectric layer are coplanar and the second and third dielectric layers have a different composition. In some embodiments, the second dielectric layer is selectively deposited on the conductive line.

An etching method of the invention includes: a resist pattern-forming step of forming a resist layer on a target object, the resist layer being formed of a resin, the resist layer having a resist pattern; an etching step of etching the target object via the resist layer having the resist pattern; and a resist protective film-forming step of forming a resist protective film on the resist layer. The etching step is repetitively carried out multiple times. After the etching steps are repetitively carried out multiple times, the resist protective film-forming step is carried out.

Article comprising a polymeric substrate having a first major surface comprising a plurality of particles attached thereto with plasmonic material on the particles. Articles described herein are useful, for example, for indicating the presence, or even the quantity, of an analyte.

A piston ring includes a substrate, and a film covering at least a part of a surface of the substrate. The film includes Si and N. A Si content of the film is in a range of 1.1 to 7.5 at %, a crystallite size of the film is in a range of 10 to 30 nm, and a compressive residual stress of the film is 400 to 800 MPa.

In a gas-barrier aluminum deposition film according to one embodiment of the present invention, a seed coating layer containing functional groups of at least one type selected from among a hydroxyl group (—OH), an amine group (—NH), and a carboxylic acid group (—COOH) is formed on a thermoplastic plastic base film to form a seed molecular layer that enables uniform deposition of aluminum, such as AlOx or AlNx, through chemical reaction, on a surface of the coating layer, with aluminum atoms vaporized at the initial stage of aluminum deposition, thereby inducing uniform deposition of an aluminum layer to be subsequently deposited. Therefore, it is possible to provide a deposited film having superior oxygen and water vapor barrier properties compared to existing aluminum deposition films.

A method for decorating a substrate which includes the succession of the following steps: provide the substrate; deposit a layer of a sacrificial material over a surface of the substrate; structure the sacrificial material layer so as to create in this sacrificial material layer a plurality of cavities to form a decorative or technical pattern; eliminate the sacrificial material layer except at the location where the pattern is provided.

An exterior material for cooking appliance capable of improving durability, heat resistance, scratch resistance, and cleaning performance by forming a Silicon-Diamond like carbon (SiDLC) coating layer including silicon (Si) under a high-temperature environment, and a method for manufacturing the exterior material. The exterior material includes: a base material; and a SiDLC coating layer provided on the base material, wherein the SiDLC coating layer includes Si of about 1 weight % to 50 weight %, carbon (C), and other inevitable impurities.

An exterior material for cooking appliance capable of improving visibility, Vickers hardness, and scratch resistance by forming laser holes in a surface of an exterior material including a Diamond like carbon (DLC) coating layer, and a method for manufacturing the exterior material. The cooking appliance exterior material includes a base material, a Diamond like carbon (DLC) coating layer provided on the base material, an adhesive layer provided between the base material and the DLC coating layer to attach the DLS coating layer to the base material to incase an adhesion force between the base material and the DLC coating layer, and a plurality of laser holes provided in a surface of the exterior material.

Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes: a polyimide-based substrate having a fluorine layer disposed on at least one side thereof; a tie-layer disposed on the polyimide-based substrate having the fluorine layer placed thereon; and a copper layer disposed on the tie layer, wherein the tie-layer includes at least one metal element selected from among metal elements of Group 4, Group 6, Group 13, and Group 14 in the Periodic Table, and the at least one metal element may have a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more.

A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface; depositing silver and/or copper onto the outer surface of the implant; diffusing the silver and/or copper into a subsurface zone adjacent the outer surface; and oxidizing or anodizing the implant after the diffusion step to form an oxidized or anodized layer that contains at least some amount of elemental silver, elemental copper or silver or copper ions or compounds.