Embodiments of the present disclosure relate to forming multi-depth films for the fabrication of optical devices. One embodiment includes disposing a base layer of a device material on a surface of a substrate. One or more mandrels of the device material are disposed on the base layer. The disposing the one or more mandrels includes positioning a mask over of the base layer. The device material is deposited with the mask positioned over the base layer to form an optical device having the base layer with a base layer depth and the one or more mandrels having a first mandrel depth and a second mandrel depth.

Energy bands of a thin film containing molecular clusters are tuned by controlling the size and the charge of the clusters during thin film deposition. Using atomic layer deposition, an ionic cluster film is formed in the gate region of a nanometer-scale transistor to adjust the threshold voltage, and a neutral cluster film is formed in the source and drain regions to adjust contact resistance. A work function semiconductor material such as a silver bromide or a lanthanum oxide is deposited so as to include clusters of different sizes such as dimers, trimers, and tetramers, formed from isolated monomers. A type of Atomic Layer Deposition system is used to deposit on semiconductor wafers molecular clusters to form thin film junctions having selected energy gaps. A beam of ions contains different ionic clusters which are then selected for deposition by passing the beam through a filter in which different apertures select clusters based on size and orientation.

A system and method are provided for implementing a unique scheme by which to execute digital vapor phase patterning on metals, semiconductor substrates and other surfaces using a proposed variable data digital lithographic image forming architecture or technique. For certain substrate printing and manufacturing applications, including some printed electronics applications, the disclosed schemes implement techniques to digitally pattern metal layers with bulk material properties in a manner that is aligned with underlying layers on the fly. The disclosed digital printing process may pattern a release oil on a substrate in support of a metal deposition process. Changeable patterning is implemented with an ability to modify the alignment of the patterns on-the-fly. The release layer on a drum is laser patterned in order that the patterned release layer is transferred to the substrate, or the patterning of the release layer is accomplished directly on the substrate.

A mask frame and an evaporation mask assembly. The mask frame has a first surface and a second surface facing away from each other and includes: a frame body, which is formed as a frame structure with an opening; and a support body, provided in the opening and connected to the frame body. The support body includes a plurality of evaporation apertures distributed in an array and a plurality of support units distributed around the evaporation apertures, each support unit includes a supporting portion and a bonding portion extending from the supporting portion toward the evaporation apertures, the supporting portion includes a supporting surface located on the first surface, the bonding portion includes a bonding surface protruding to the second surface in a first direction from the first surface to the second surface.

A device for depositing a layer, which has been structured by the application of a mask, on a substrate, includes an adjusting device for adjusting the position of a mask support with respect to a support frame. The device also includes, a mask lifting device, by which the support frame, together with the mask support, the adjusting device and a mask assembly, can be vertically displaced from a mask changing position into a processing position. The device also includes a substrate holder lifting device, by which the substrate holder can be vertically displaced from a loading position into a processing position. Restraining means, which include a V-groove and a spherical surface, restrain the substrate holder in the processing position on the support frame. The spherical surface, formed by a ball element of the support frame, is supported on flanks of the V-groove that is formed by the substrate holder.

Disclosed are a mask and a manufacturing method for the mask, aiming to solve the problem in the prior art of the easy occurrence of color mixing due to the inaccurate position of evaporation when a pattern of a light-emitting substrate is formed by means of a mask. The mask for covering a mother board, which is formed by a multi-division exposure procedure and thus has a substrate invalid region that cannot be exposed due to the multi-division exposure procedure, comprises: a metal frame; a support mask located on one side of the metal frame; at least one fine metal mask strip, which is located on the side of the support mask that faces away from the metal frame, and is provided with multiple openings for the evaporation of a light-emitting film for sub-pixels in the mother board; and a support plate located between the metal frame and the fine metal mask for covering the substrate invalid region, with the thickness of the support plate being greater than that of the support mask.

A deposition system that mitigates feathering in a directly deposited pattern of organic material is disclosed. Deposition systems in accordance with the present disclosure include an evaporation source, an electrically conductive shadow mask, and an electrically conductive field plate. The source imparts a negative charge on vaporized organic molecules as they are emitted toward a target substrate. The source and substrate are biased to produce an electric field having field lines that extend normally between them. The shadow mask and field plate are located between the source and substrate and each functions as an electrostatic lens that directs the charged vapor molecules toward propagation directions aligned with the field lines as the charged vapor molecules approach and pass through them. As a result, the charged vapor molecules pass through the shadow mask to the substrate along directions that are substantially normal to the substrate surface, thereby mitigating feathering in the deposited material pattern.

According to one embodiment, there is provided a substrate processing apparatus including a first electrode, a second electrode, a third electrode, a first power supply circuit, a second power supply circuit and a control line. The first electrode is arranged in a processing chamber, and on which a substrate can be placed. The second electrode faces the first electrode. The third electrode is arranged along a side wall in the processing chamber and facing the first electrode. The first power supply circuit is connected to the first electrode. The second power supply circuit is connected to the third electrode. The control line is connected to the first power supply circuit and the second power supply circuit.

The present disclosure provides a pixel arrangement including five first sub-pixels located respectively at a central position and four vertex positions of a first virtual rectangle, four second sub-pixels located at respective central positions of four sides of the first virtual rectangle, and four third sub-pixels located in respective four second virtual rectangles, each of the second virtual rectangles being defined by a corresponding one of the four vertex positions of the first virtual rectangle, respective center positions of two adjacent sides of the four sides of the first virtual rectangle that contain the corresponding vertex position, and the center position of the first virtual rectangle, the four second virtual rectangles forming the first virtual rectangle, and wherein, among the four third sub-pixels, an area of at least one third sub-pixel is different from that of other third sub-pixel. A display panel including the pixel arrangement is also provided.

The present disclosure relates to systems and methods of additive manufacturing that reduce or eliminates defects in the bulk deposition material microstructure resulting from the additive manufacturing process. An additive manufacturing system comprises evaporating a deposition material to form an evaporated deposition material and ionizing the evaporated deposition material to form an ionized deposition material flux. After forming the ionized deposition material flux, the ionized deposition material flux is directed through an aperture, accelerated to a controlled kinetic energy level and deposited onto a surface of a substrate. The aperture mechanism may comprise a physical, electrical, or magnetic aperture mechanism. Evaporation of the deposition material may be performed with an evaporation mechanism comprised of resistive heating, inductive heating, thermal radiation, electron heating, and electrical arc source heating.