A thin film deposition apparatus used to produce large substrates on a mass scale and improve manufacturing yield. The thin film deposition apparatus includes a deposition source; a first nozzle disposed at a side of the deposition source and including a plurality of first slits arranged in a first direction; a second nozzle disposed opposite to the first nozzle and including a plurality of second slits arranged in the first direction; and a barrier wall assembly including a plurality of barrier walls arranged in the first direction so as to partition a space between the first nozzle and the second nozzle.

A mask assembly includes: a mask frame; a mask supported by the mask frame, the mask including a plurality of pattern holes; and a magnetic part disposed on one surface of the mask. The magnetic part provides a magnetic force between the mask and a target substrate and improves an adhesion between the mask and the target substrate to prevent deposition defects.

A mask assembly includes: a mask frame; a mask supported by the mask frame, the mask including a plurality of pattern holes; and a magnetic part disposed on one surface of the mask. The magnetic part provides a magnetic force between the mask and a target substrate and improves an adhesion between the mask and the target substrate to prevent deposition defects.

A deposition mask unit includes a deposition mask sheet including a plurality of openings, and a deposition mask frame including a raised portion at which the deposition mask sheet is attachable to the deposition mask frame. The raised portion includes a support portion, and a bonding portion protruding from an upper surface of the support portion, an upper surface of the bonding portion being curved.

A pixel structure includes a plurality of first sub-pixels arranged in a first direction and a second direction. A maximum dimension of at least one first sub-pixel in a first direction is less than a first set value, and a maximum dimension of the at least one first sub-pixel in a second direction is greater than a second set value. The first set value is a maximum dimension of a set sub-pixel in the first direction, and the second set value is a maximum dimension of the set sub-pixel in the second direction. The first sub-pixel has an area equal to an area of the set sub-pixel.

A method of manufacturing a metal mask includes providing a growth substrate with a conductive surface. Then, a cover pattern is formed on the conductive surface, which has at least one opening and an insulated surface touching the conductive surface. Next, using the cover pattern as a mask, a first electroforming is performed to form a mold part on the conductive surface. The mold part fills the opening and has a conductive pattern surface touching the conductive surface. The conductive pattern surface is flush with the insulated surface. After the first electroforming, the growth substrate is removed, while the cover pattern and the mold part are reserved. After removing the growth substrate, a second electroforming is performed to the conductive pattern surface of the mold part to form a metal pattern. Afterwards, the mold part and the cover pattern are removed from the metal pattern.

A mask assembly and an organic light emitting display device manufactured using the mask assembly are capable of realizing an organic light emitting display device having a hole in a display area, the mask assembly including a frame defining a first opening area, a first mask on the frame and defining a plurality of second opening areas that overlap the first opening area, and a second mask fixed to the frame across the plurality of second opening areas, and including a body portion overlapping the first mask, a blocking portion at each respective one of the second opening areas, and a pattern portion between the body portion and the blocking portion, and defining a plurality of holes.

The present application provides mask plate, fabrication method thereof, and mask plate assembly. The mask plate includes two opening areas being respectively on different sides of mask pattern area along first direction, and two welding areas. One welding area is on a side of one opening area away from the mask pattern area along first direction, and the other welding area is on a side of the other opening area away from mask pattern area along first direction. Evaporation holes are arranged in mask unit, buffer holes are arranged in each opening area, and ratio of maximum dimension of buffer hole in any direction in plane where the mask plate is located to maximum dimension of evaporation hole in the direction is greater than 100. Buffer holes are distributed at equal intervals along a second direction, and second direction is in the plane and is perpendicular to first direction.

A mask plate is used for manufacturing a pixel definition layer of the display substrate, which includes first transparent patterns and first opaque patterns, and further includes transition structures located between the first transparent patterns and the first opaque patterns. And the transition structures include a plurality of second transparent patterns and second opaque patterns alternately arranged, and a line width of each of the second transparent patterns and each of the second opaque patterns is less than the resolution of an exposure machine by using the mask plate for exposure.

The present disclosure provides a method for fabricating an anti-reflective layer on a quartz surface by using a metal-induced self-masking etching technique, comprising: performing reactive ion etching to a metal material and a quartz substrate by using a mixed gas containing a fluorine-based gas, wherein metal atoms and/or ions of the metal material are sputtered to a surface of the quartz substrate, to form a non-volatile metal fluoride on the surface of the quartz substrate; forming a micromask by a product of etching generated by reactive ion etching gathering around the non-volatile metal fluoride; and etching the micromask and the quartz substrate simultaneously, to form an anti-reflective layer having a sub-wavelength structure.