Energy bands of a thin film containing molecular clusters are tuned by controlling the size and the charge of the clusters during thin film deposition. Using atomic layer deposition, an ionic cluster film is formed in the gate region of a nanometer-scale transistor to adjust the threshold voltage, and a neutral cluster film is formed in the source and drain regions to adjust contact resistance. A work function semiconductor material such as a silver bromide or a lanthanum oxide is deposited so as to include clusters of different sizes such as dimers, trimers, and tetramers, formed from isolated monomers. A type of Atomic Layer Deposition system is used to deposit on semiconductor wafers molecular clusters to form thin film junctions having selected energy gaps. A beam of ions contains different ionic clusters which are then selected for deposition by passing the beam through a filter in which different apertures select clusters based on size and orientation.

Provided is a mask having a plurality of cell areas, each of which has a plurality of through-portions defined therein. The mask includes a mask film including a polymer and a conductive layer disposed on at least one surface of the mask film and including conductive metal or a conductive metal oxide. Accordingly, precision of a deposition process is enhanced while reducing process time and costs in a manufacturing process of the mask, and thus the yield in manufacturing a display panel using the mask is improved. Therefore, the display panel manufactured using the mask may have improved reliability.

One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, process chamber is provided that includes a lid plate having a plurality of cooling channels formed therein, a pedestal, the pedestal having a plurality of cooling channels formed therein, and a showerhead, wherein the showerhead comprises a plurality of segments and each segment is at least partially surrounded by a shield.

According to one or more embodiments, a mask assembly includes a mask frame including an opening and a portion surrounding the opening, and a mask arranged on the mask frame and including a first region and a second region, and a deposition material is passable through the first region corresponding to the opening, and the second region is around the first region, and the first region includes deposition openings, and the second region includes dummy openings, at least some of the dummy openings including centers arranged to deviate from a straight line connecting centers of the deposition openings, and a width of each of the deposition openings is the same as a width of each of the dummy openings.

A thin walled balloon formed in polymer tubing has a patterned metal layer on its outer surface, created by physical vapor deposition (PVD). The pattern is defined by a stencil mask assembled around the balloon, with the balloon inflated therein. The PVD occurs without deforming or degrading the polymer material of the balloon, by actively pulling heat away from the balloon a) by forming the stencil mask out of metal; b) by providing a metal heat conduction path away from the balloon to a heat sink, such as outside the vacuum chamber, and/or c) by flow of a cooling fluid within the balloon during the PVD process. Proper PVD process parameters are selected to minimize heat generation, such as having argon pressure in the range of 0.8 to 1.2 milli-torr and generating the plasma at a power of less than about 200 watts/ square inch of effective target surface area.

A deposition mask assembly for manufacturing a plurality of display devices includes a frame having an opening area, a first open mask disposed on the frame and having a first body portion defining a plurality of patterns overlapping the opening area, and a second open mask disposed on the first open mask and having a second body portion defining a plurality of opening portions overlapping the patterns of the first open mask, in which each of the patterns includes an auxiliary pattern spaced apart from the first body portion and a first bridge pattern connecting the first body portion and the auxiliary pattern.

The present disclosure provides a mask device and a manufacturing method thereof, and an evaporation system. The mask device includes a frame, strip alignment plates and a strip support plate, hollow portions are provided in the strip alignment plates, and the strip alignment plates are fixed on the frame; the strip support plate and the strip alignment plates cross each other, a plurality of welding spots are provided on the surface of the strip support plate proximal to the frame, and are welded and fixed to the frame, and the plurality of welding spots are provided in the region of the strip support plate corresponding to the hollow portions.

A method comprising providing a carbonaceous material, the substrate having a first thermal conductivity. The method further comprises depositing a first masking layer having a second thermal conductivity on at least a portion of the substrate, a ratio of the second thermal conductivity to the first thermal conductivity being less than or equal to 1:30. The method further comprises depositing a second masking layer on the first masking layer to form an etch mask, and etching an exposed portion of the substrate.

A tensioning device, including a base configured to carry a mask plate, a clamp configured to clamp the mask plate, and a deformation adjusting assembly provided on the base or on the clamp, wherein the deformation adjusting assembly is configured to adjust a deformation of an end portion of the mask plate protruding from the base in a direction of gravity when the base carries the mask plate, so as to make the deformation less than a preset deformation threshold. A base, a clamp and a clamping for the mask plate are also provided.

An apparatus for manufacturing a display apparatus includes a deposition source, a nozzle head, a substrate fixer, and a deposition preventer. The deposition source is outside the chamber and vaporizes or sublimates a deposition material. The nozzle head is in the chamber, is connected to the at least one deposition source, and simultaneously sprays the deposition material onto an entire surface of a display substrate. The substrate fixer is connected to the chamber and moves linearly, with the display apparatus is mounted on the substrate fixer. The deposition preventer is in the chamber surrounding an edge portion of the nozzle head and an edge portion of the substrate fixer. The deposition preventer is heated during a deposition process.