There is provided a film forming apparatus, including: a processing chamber having a processing space in which a film forming process is performed on a substrate; a substrate support part configured to support the substrate inside the processing chamber; at least one sputtering particle emission part including a target and configured to emit sputtering particles to the substrate from the target; and at least one etching particle emission part configured to emit etching particles having an etching action with respect to the substrate, wherein the sputtering particles emitted from the at least one sputtering particle emission part are deposited on the substrate to form a film, and a portion of the film is etched by the etching particles emitted from the at least one etching particle emission part.

A method includes providing a substrate including mandrels of a first material positioned on an underlying layer. Each of the mandrels includes a first sidewall and an opposing second sidewall. The method further includes forming sidewall spacers made of a second material and including a first sidewall spacer abutting each respective first sidewall and a second sidewall spacer abutting each respective second sidewall. The mandrels extend above top surfaces of the sidewall spacers. The method also includes forming first capped sidewall spacers by depositing a third material on the first sidewall spacers without depositing on the second sidewall spacers, forming second capped sidewall spacers by depositing a fourth material on the second sidewall spacers without depositing on the first sidewall spacers, and selectively removing at least one of the first material, the second material, the third material, and the fourth material to uncover an exposed portion of the underlying layer.

A decorative article (100) having an observed colour effect that is changeable depending on observer (200) viewing angle, the article comprising: a decorative element (110) comprising a front side (114) facing a forward direction and a back side (112) opposite the front side facing a rearward direction, wherein the back side comprises a back surface (113) having a first region (122) and a second region (124) surrounding the first region; a first coating (132) arranged on the first region of the back surface, the first coating causing a first colour effect (102); and a second coating (134) arranged on the second region of the back surface, the second coating causing a second colour effect (104) that differs from the first colour effect.

The present invention provides a mask, a display panel, a method for manufacturing a display panel, and a display device. The display panel has a hollow region and a display region surrounding the hollow region. The display panel includes a plurality of organic light-emitting devices arranged only in the display region. Each of the plurality of organic light-emitting devices includes an anode layer, a cathode layer, a light-emitting layer and a functional layer. The functional layer includes a plurality of uneven portions.

A mask assembly includes a frame in which an opening is defined, a support portion on the frame and overlapping with the opening, and a mask on the support portion and covering at least a portion of the opening. The support portion may include a central layer, a first outer layer on a first surface of the central layer, and a second outer layer on a second surface of the central layer, the second surface being opposite to the first surface.

The present disclosure provides a sputtering reaction chamber and a process assembly of the sputtering reaction chamber. The process assembly includes a shield, and the shield includes an integrally formed body member and a cover ring member, wherein the body member may be in a ring shape. The cover ring member may extend from a bottom of the body member to an inner side of the body member and may be configured to press an edge of a to-be-processed workpiece when a process is performed. A cooling channel may be arranged in the cover ring member and the body member and may be configured to cool the cover ring member and the body member by transferring coolant. The process assembly of the sputtering reaction chamber and the sputtering reaction chamber provided by the present disclosure can reduce heat radiation of the process assembly to the to-be-processed workpiece and released gases and impurities to effectively reduce a whisker defect and improve a product yield.

A mask assembly includes: a frame; an open mask disposed on the frame, and defining a first deposition opening, a second deposition opening spaced apart from the first deposition opening in a first direction, and a first dummy opening located between the first deposition opening and the second deposition opening; and a shield member including a first shield part overlapping the first dummy opening in a plan view.

Following a determination that the distance along the Z-direction between the substrate and the mask is greater than the distance along the Z-direction to the nearest end of depth of field (DOF) for a camera from the near side of the mask, a control unit reduces the distance between the X-Y position of a substrate-mark and the X-Y position of the associated mask-mark, with a high-speed relative approach along the Z-direction between the substrate and the mask. Following a determination that the distance along the Z-direction between the substrate and the mask is equal to or less than the distance along the Z-direction to the nearest end of depth of field (DOF) from the near side of the mask, the control unit reduces the distance between the X-Y position of the substrate-mark and the X-Y position of the associated mask-mark, with a reduced-speed relative approach along the Z-direction.

Contacting a multiplicity of seed crystals with an amorphous metallic alloy layer to form an amorphous precursor film or depositing an amorphous precursor film on a substrate and annealing the amorphous precursor film at a temperature between 50° C. and 400° C. to yield the metallic film with grains separated by grain boundaries.

A mask manufacturing method includes a step of providing a metal substrate having a plurality of virtual zones on its surface, using a plurality of nozzles to spray an etching solution on the surface, wherein the virtual zones include a first and a second zone, and the metal substrate has a first thickness and a second thickness respectively in an unit area of the first zone and the second zone, wherein the first thickness is greater than the second thickness; the step of using the nozzles to spray the etching solution on the surface further includes respectively using a first spraying pressure and a second spraying pressure to spray the etching solution on the first zone and the second zone, and the first spraying pressure is greater than the second spraying pressure. The invention also provides a mask manufacturing device.