Disclosed herein are methods comprising: illuminating a first location of an optothermal substrate with electromagnetic radiation; wherein the optothermal substrate converts at least a portion of the electromagnetic radiation into thermal energy; and wherein the optothermal substrate is in thermal contact with a liquid sample comprising a plurality of thermally reducible metal ions; thereby: generating a confinement region at a location in the liquid sample proximate to the first location of the optothermal substrate; trapping at least a portion of the plurality of thermally reducible metal ions within the confinement region; and thermally reducing the trapped portion of the plurality of thermally reducible metal ions; thereby: depositing a metal particle on the optothermal substrate at the first location. Also disclosed herein are systems for performing the methods described herein. Also disclosed herein are patterned substrates made by the methods described herein, and methods of use thereof.

An ink composition including a metal salt amine complex; wherein the metal salt amine complex is formed from a metal salt and an amine; a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator; and an optional solvent. A process including forming a metal salt amine complex; adding a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator to the metal salt amine complex to form an ink. A process forming conductive features on a substrate with the ink composition.

An ink composition including a metal salt amine complex; wherein the metal salt amine complex is formed from a metal salt and an amine; a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator; and an optional solvent. A process including forming a metal salt amine complex; adding a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator to the metal salt amine complex to form an ink. A process forming conductive features on a substrate with the ink composition.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution. A metal-containing (e.g., metal salt or organometallic compound) film that is sensitive to a patterning agent is deposited on a semiconductor substrate. The metal-containing film is then patterned directly (i.e., without the use of a photoresist) by exposure to the patterning agent in a vacuum ambient to form the metal mask. For example, the metal-containing film is photosensitive and the patterning is conducted using sub-30 nm wavelength optical lithography, such as EUV lithography.

Provided is a method of forming an apatite coating, including brining an apatite-forming precursor solution including Ca.sup.2+ ions and PO.sub.4.sup.3 ions into direct contact with at least one region of the substrate, emitting a laser beam onto the region of the substrate in direct contact with the precursor solution through the precursor solution, and forming apatite on the region onto which the laser beam is emitted.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

A method for preparing a metal layer comprising: a) preparing a liquid composition comprising at least one precursor of at least one metal, at least one solvent of the precursor and at least one photo-initiator, the concentration of the precursor being at least 0.6% by weight relative to the weight of the liquid composition; b) depositing the liquid composition on a substrate forming a liquid composition deposited on a substrate; c) irradiating with a UV, Vis and IR source the liquid composition deposited on a substrate obtained at step b) forming a metal layer comprising or consisting of the metal; d) obtaining a metal layer. The present invention also relates to a material comprising a substrate and a metal layer, the metal layer being in contact with said substrate, the metal layer consisting of particles of metal in spatial contact together thereby forming a continuous metal layer of particles.

Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution. A metal-containing (e.g., metal salt or organometallic compound) film that is sensitive to a patterning agent is deposited on a semiconductor substrate. The metal-containing film is then patterned directly (i.e., without the use of a photoresist) by exposure to the patterning agent in a vacuum ambient to form the metal mask. For example, the metal-containing film is photosensitive and the patterning is conducted using sub-30 nm wavelength optical lithography, such as EUV lithography.

A method and system for forming a thin patterned metal film on a substrate are presented. The method includes applying an ink composition on a pre-treated surface of the substrate, wherein the ink composition includes at least metal cations; and exposing at least the applied ink composition on the substrate to a low-energy plasma, wherein the low-energy plasma is operated according to a first set of exposure parameters.