A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.

Described herein are systems and methods for performing a surface mechanical attrition treatment (SMAT) to the surface of a variety of materials including thin films, nanomaterials, and other delicate and brittle materials. In an aspect, a surface of a material is modified to a modified surface and from an original state to a modified state, wherein the modified state comprises a physical modification, a chemical modification, or a biological modification. In another aspect, a surface mechanical attrition treatment (SMAT) is applied to the modified surface of the material for a defined duration of time, wherein a condition associated with the SMAT is adjusted based on a structural composition of the material. In yet another aspect, a defined strain is imposed on the structural composition of the material based on the SMAT.

Method for producing an object by additively manufacturing a preform of the object from a building material comprising a polymer. The preform is encapsulated with a metal or metal alloy encapsulant that is capable of withstanding temperatures greater than the preform. The encapsulated preform is heated at a predetermined temperature and for a period of time, such that the preform at least partially transmutes into the form of a carbonaceous solid.

A plated material includes a base metal made from Cu or an alloy containing Cu as a main raw material, an underlayer made from Ni formed on the base metal, and an Ag plated layer formed on the underlayer. A thickness of the underlayer is 0.1 μm to 1.0 μm. A thickness of the Ag plated layer is 1.0 μm or less.

Present disclosure relates to magnetic materials, chips having magnetic materials, and methods of forming magnetic materials. In certain embodiments, magnetic materials may include a seed layer, and a cobalt-based alloy formed on seed layer. The seed layer may include copper, cobalt, nickel, platinum, palladium, ruthenium, iron, nickel alloy, cobalt-iron-boron alloy, nickel-iron alloy, and any combination of these materials. In certain embodiments, the chip may include one or more on-chip magnetic structures. Each on-chip magnetic structure may include a seed layer, and a cobalt-based alloy formed on seed layer. In certain embodiments, method may include: placing a seed layer in an aqueous electroless plating bath to form a cobalt-based alloy on seed layer. In certain embodiments, the aqueous electroless plating bath may include sodium tetraborate, an alkali metal tartrate, ammonium sulfate, cobalt sulfate, ferric ammonium sulfate and sodium borohydride and has a pH between about 9 to about 13.

A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having a nonresist portion with a favorable rectangular sectional shape, a method of manufacturing a resist pattern using the composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template manufactured by the method. In a chemically amplified positive-type photosensitive resin composition including an acid generator, a resin whose solubility in alkali increases under the action of acid, and an organic solvent, an acrylic resin is used that includes a constituent unit derived from an acrylic acid ester including an —SO.sub.2-containing cyclic group or a lactone-containing cyclic group, and a constituent unit derived from an acrylic acid ester containing an organic group including an aromatic group and an alcoholic hydroxyl group.

The present invention relates to a method for recovering a precious metal selectively adsorbed on a porous porphyrin polymer, and to an electroless plating method capable of recovering a precious metal in a film form by desorbing and leaching the precious metal without an additional oxidizing agent and using same as a plating solution to reduce the precious metal on the surface of a substrate without an additional reducing agent.

A substrate processing apparatus includes a rotation driving mechanism configured to rotate a rotary table configured to hold a substrate; an electric heater provided in the rotary table to be rotated along with the rotary table and configured to heat the substrate; a power receiving electrode provided in the rotary table to be rotated along with the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode and configured to supply a power to the electric heater via the power receiving electrode; an electrode moving mechanism; a power feeder configured to supply the power to the power feeding electrode; a processing cup surrounding the rotary table; at least one processing liquid nozzle configured to supply a processing liquid; a processing liquid supply mechanism configured to supply at least an electroless plating liquid; and a controller.

Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

Disclosed are an anode active material for lithium secondary batteries, the anode active material comprising: a core part including a carbon-silicon complex and having a cavity therein; and a coated layer which is formed on the surface of the core part and includes a phosphor-based alloy.