A method of electroplating a metal foam includes placing a metal foam to be plated into an electroplating chamber with a plating material source, circulating an electrolyte through the chamber to carry metal ions from the plating material source, the circulating being selected and controlled to produce an even coating of plating material on surfaces of the metal foam.

An aluminum plating film contains aluminum as a main component. The aluminum plating film has, between coating surfaces at both ends in a thickness direction, an intervening layer that contains a metal having a lower ionization tendency than aluminum or an intervening layer that contains an alloy of aluminum and a metal having a lower ionization tendency than aluminum.

Provided is a silicon bulk thermoelectric conversion material in which thermoelectric performance is improved by reducing the thermal conductivity as compared with the prior art. In the silicon bulk thermoelectric conversion material, the ZT is greater than 0.2 at room temperature with the elemental silicon. In the silicon bulk thermoelectric conversion material, a plurality of silicon grains have an average of 1 nm or more and 300 nm or less, a first hole have an average of 1 nm or more and 30 nm or less present in the plurality of silicon grains and surfaces of the silicon grains, and a second hole have an average of 100 nm or more and 300 nm or less present between the plurality of silicon grains, wherein the aspect ratio of a crystalline silicon grain is less than 10.

A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.

A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.

An oxygen-free or oxygen-poor solution for the electroless deposition of a platinum group metal is described. The solution includes a ruthenium (II) amine complex having a first oxidation potential, and a platinum group metal compound having a reduction potential larger than the opposite of the oxidation potential of the ruthenium (II) amine complex.

An oxygen-free or oxygen-poor solution for the electroless deposition of a platinum group metal is described. The solution includes a ruthenium (II) amine complex having a first oxidation potential, and a platinum group metal compound having a reduction potential larger than the opposite of the oxidation potential of the ruthenium (II) amine complex.

Methods of additive manufacturing are described herein. In one aspect, a method of printing an article comprises (a) selectively depositing an initial layer of transition metal or transition metal oxide on a substrate, and (b) at least partially replacing the initial layer of transition metal or transition metal oxide with a noble metal layer via a galvanic replacement reaction. In step (c), an additional layer of transition metal or transition metal oxide is deposited on the noble metal layer, and in step (d), the additional layer of transition metal or transition metal oxide is at least partially replaced with an additional noble metal layer via a galvanic replacement reaction. Steps (c) and (d) are repeated until the article is completed. In some embodiments, the article is subsequently separated from the substrate and can be coupled to a secondary substrate.

A method that forms a metal plating film having a thick film thickness by a solid phase method is provided. The present disclosure is a method that forms the metal plating films of a first metal and a second metal having an ionization tendency larger than an ionization tendency of the first metal. The method includes: depositing the second metal on a surface of a copper base material to form the plating film of the second metal; and depositing the first metal on a surface of the second metal by a solid electroless plating method to form the plating film of the first metal. The solid electroless plating method in the depositing of the first metal is performed using a laminated complex. The laminated complex includes a first substitution-type electroless plating bath, a solid electrolyte membrane, a copper base material, a third metal, a second substitution-type electroless plating bath, and an insulating polymer. The first substitution-type electroless plating bath contains ions of the first metal. The second metal is plated on the copper base material. The third metal has an ionization tendency larger than the ionization tendency of the first metal. The second substitution-type electroless plating bath contains ions of the first metal.

An apparatus and a method for manufacturing a continuous reactor type core-shell catalyst electrode, which may manufacture a large amount of continuous reactor type core-shell catalyst electrodes by improving coating efficiency of shell metal by using reaction chambers disposed in a circular shape or in a line are provided. The apparatus for manufacturing a continuous reactor type core-shell catalyst electrode includes: a main body; reaction chambers which are disposed plurally in a circular shape inside the main body, store reaction solution inside thereof, are equipped with a movable member and counter electrodes, and are coupled with a reference electrode to a lateral portion thereof; a palladium sheet which is moved by the movable member and immersed in the reaction solution as the movable member moves downward; a power supply which applies a voltage to the electrodes.