A reactive primer compound is provided that can be used as an adhesion promoter on various substrates, particularly metal-containing substrates. The reactive primer compound has a diketone group that can form chelates with various metals through coordination chemistry plus an oxirane group that can undergo ring opening reactions with components of an adhesive or coating composition. Articles containing a metal-containing substrate and a primer layer, which includes the reactive primer compound, positioned adjacent the metal-containing substrate are also provided. The articles can further include a cured composition or a cured composition formed therefrom, wherein the curable composition typically includes an epoxy resin and a curative for the epoxy resin.

A process for producing a Ti or Ti alloy product includes exposing particles of pyrophoric Ti metal and Ti alloys to a liquor, gas or vapour that includes a passivation component that forms a passivated protective layer with Ti on surfaces of the particles.

A process for producing a Ti or Ti alloy product includes exposing particles of pyrophoric Ti metal and Ti alloys to a liquor, gas or vapour that includes a passivation component that forms a passivated protective layer with Ti on surfaces of the particles.