An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.

A new scanning electrochemical microscopy tip positioning method that allows topography and surface activity to be resolved independently is presented. A SECM tip is oscillated relative to the surface of interest. Changes in the oscillation amplitude, caused by the intermittent contact of the SECM tip with the surface of interest, are used to detect the surface of interest, and as a feedback signal for various types of imaging

A new scanning electrochemical microscopy tip positioning method that allows topography and surface activity to be resolved independently is presented. A SECM tip is oscillated relative to the surface of interest. Changes in the oscillation amplitude, caused by the intermittent contact of the SECM tip with the surface of interest, are used to detect the surface of interest, and as a feedback signal for various types of imaging

The present invention discloses a method for preparing a sodium interface and a method for preparing a sodium-based optical structure device. This sodium interface is prepared in an inert gas atmosphere by the following steps: (1) melting solid sodium metal into liquid by heat, and stripping off solid oxides and impurities on the surface of the molten sodium metal to obtain pure liquid sodium with metallic luster; and (2) spin-coating a dielectric substrate with the liquid sodium to obtain the sodium interface tightly attached to the dielectric substrate. The prepared sodium interface can be used as a plasmon polariton material for use in plasmon polariton optical waveguides, nano-lasers and the like.

The present invention discloses a method for preparing a sodium interface and a method for preparing a sodium-based optical structure device. This sodium interface is prepared in an inert gas atmosphere by the following steps: (1) melting solid sodium metal into liquid by heat, and stripping off solid oxides and impurities on the surface of the molten sodium metal to obtain pure liquid sodium with metallic luster; and (2) spin-coating a dielectric substrate with the liquid sodium to obtain the sodium interface tightly attached to the dielectric substrate. The prepared sodium interface can be used as a plasmon polariton material for use in plasmon polariton optical waveguides, nano-lasers and the like.

A method of fusing an alloy-based material with a coating layer using a thermal spray process. The method includes determining a predetermined energization frequency of a high-frequency power supply unit based on a diffused area thickness (T1) and a non-diffused area thickness (T2) of the alloy-based material, inductively heating the alloy-based material and the coating layer to reach a predetermined temperature at the predetermined energization frequency of the high-frequency power supply unit, selectively heating the alloy-based material at the predetermined energization frequency within a penetration depth range of a total thickness (D2) of the alloy-based material to suppress an austenite transformation of at least a portion of the alloy-based material, and fusing the selectively heated alloy-based material with the coating layer by suppressing the austenite transformation of at least the portion of the alloy-based material.

Examples of an alloy injection molded liquid metal substrate are described. In an example, an alloy injection molded liquid metal substrate includes a liquid metal substrate and an alloy injection molded on a first surface of the liquid metal substrate.

The present invention discloses a method for preparing a sodium interface and a method for preparing a sodium-based optical structure device. This sodium interface is prepared in an inert gas atmosphere by the following steps: (1) melting solid sodium metal into liquid by heat, and stripping off solid oxides and impurities on the surface of the molten sodium metal to obtain pure liquid sodium with metallic luster; and (2) spin-coating a dielectric substrate with the liquid sodium to obtain the sodium interface tightly attached to the dielectric substrate. The prepared sodium interface can be used as a plasmon polariton material for use in plasmon polariton optical waveguides, nano-lasers and the like.

The present invention discloses a method for preparing a sodium interface and a method for preparing a sodium-based optical structure device. This sodium interface is prepared in an inert gas atmosphere by the following steps: (1) melting solid sodium metal into liquid by heat, and stripping off solid oxides and impurities on the surface of the molten sodium metal to obtain pure liquid sodium with metallic luster; and (2) spin-coating a dielectric substrate with the liquid sodium to obtain the sodium interface tightly attached to the dielectric substrate. The prepared sodium interface can be used as a plasmon polariton material for use in plasmon polariton optical waveguides, nano-lasers and the like.

Provided are: a grain-oriented electrical steel sheet that has an excellent magnetic property and coating adhesiveness after stress relief annealing; and a production method therefor. This grain-oriented electrical steel sheet has: a steel sheet; a metal coating which contains a metal element and which is disposed on the steel sheet; a coating layer A which is a ceramic coating having an oxide content of less than 30 mass % and which is disposed on the metal coating; and a coating layer B which is an insulating tensile coating containing an oxide and which is disposed on the coating layer A, wherein the metal coating has a thickness of 1.0-10.0 nm, and in the metal element, the atomic radius ratio represented by formula (1) is at least 10%, when the atomic radius of iron is defined as RFe and the atomic radius of the metal element as RA.
(|R.sub.Fe−R.sub.A|/R.sub.Fe)×100.  Formula (1):