A turbomachine part includes (i) a nickel-based superalloy substrate including, in mass content, 5.0% to 8.0% cobalt, 6.5% to 10% chromium, 0.5% to 2.5% molybdenum, 5.0% to 9.0% tungsten, 6.0% to 9.0% tantalum, 4.5% to 5.8% aluminum, hafnium in a mass content greater than or equal to 2000 ppm, and optionally including niobium in a mass content less than or equal to 1.5%, and optionally at least one of carbon, zirconium and boron each in a mass content less than or equal to 100 ppm, the remainder being composed of nickel and unavoidable impurities; and (ii) a β-structured nickel aluminide coating covering the substrate.

A coated part includes a metallic substrate, a thermal barrier comprising a ceramic material and covering the metallic substrate, wherein the coated part further includes a protective coating covering the thermal barrier, the protective coating including, in a first region, a first MAX phase, denoted PZ2, of formula (Zr.sub.xTi.sub.1-x,).sub.2AlC or a first MAX phase, denoted PC2, of formula (Cr.sub.xTi.sub.1-x,).sub.2AlC with x non-zero and less than or equal to 1 in the MAX phases PZ2 and PC2, and the protective coating includes, in a second region covering the first region, a second MAX phase of formula Ti.sub.2AlC.

A coated substrate has a substrate and a coating system having one or more ceramic layers. At least a first layer of one of the one or more ceramic layers is a columnar layer having as-deposited columns and intercolumn gaps. The intercolumn gaps have a mean width at least one of: at least 4.0 micrometers; and at least 1.5% of a thickness of said first layer.

A process of smoothing a top surface of a bit line metal of a memory structure to decrease resistance of a bit line stack. The process includes depositing titanium layer of approximately 30 angstroms to 50 angstroms on polysilicon layer on a substrate, depositing first titanium nitride layer of approximately 15 angstroms to approximately 40 angstroms on titanium layer, annealing substrate at a temperature of approximately 700 degrees Celsius to approximately 850 degrees Celsius, depositing second titanium nitride layer of approximately 15 angstroms to approximately 40 angstroms on first titanium nitride layer after annealing, depositing a bit line metal layer of ruthenium on second titanium nitride layer, annealing bit line metal layer at temperature of approximately 550 degrees Celsius to approximately 650 degrees Celsius, and soaking bit line metal layer in hydrogen-based ambient for approximately 3 minutes to approximately 6 minutes during annealing.

Provided is a hot stamped body comprising a steel base material, an Al-plating layer formed on at least one surface of the steel base material, a coating formed on the Al-plating layer and containing ZnO particles and CeO.sub.2 particles having an average particle size smaller than an average particle size of the ZnO particles, and a Zn- and Al-containing complex oxide layer formed between the Al-plating layer and the coating. Further, provided is a method for producing a hot stamped body comprising forming an Al-plating layer on at least one side of a steel sheet, coating a surface of the Al-plating layer with an aqueous solution containing ZnO particles and CeO.sub.2 particles, then heating it to form a coating containing ZnO particles and CeO.sub.2 particles on the Al-plating layer, and hot pressing the steel sheet. Further, provided is an Al-plated steel sheet comprising a steel base material, an Al-plating layer formed on at least one surface of the steel base material, and a coating formed on the Al-plating layer and containing ZnO particles and CeO.sub.2 particles having an average particle size smaller than an average particle size of the ZnO particles.

A device comprising: a substrate; a first coating deposited on the substrate; an intermediate coating deposited on the first coating, wherein the first coating is interposed between the substrate and the intermediate coating; and a second coating deposited on the intermediate coating, wherein the intermediate coating is interposed between the first coating and the second coating, and the second coating is outermost and black. The substrate, the first coating, the intermediate coating and the second coating define at least one of a jewelry item and a component of a jewelry item.

An electrical contact part comprising, a carrier substrate of a metallic material, a metallic coating applied to the carrier substrate, and a coating barrier material applied to the carrier substrate in a partial area of the carrier substrate, wherein the coating barrier material substantially prevents coating of the carrier substrate in the portion.

A method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

A hot stamped body comprising a steel base material and an Al-Zn-Mg-based plating layer formed on a surface of the steel base material, wherein the plating layer has a predetermined chemical composition, the plating layer comprises an interfacial layer positioned at an interface with the steel base material and containing Fe and Al and a main layer positioned on the interfacial layer, the main layer comprises, by area ratio, 10.0 to 85.0% of an Mg—Zn containing phase and 15.0 to 90.0% of an Fe—Al containing phase, the Mg—Zn containing phase comprises at least one selected from the group consisting of an MgZn phase, Mg.sub.2 Zn.sub.3 phase, and MgZn.sub.2 phase, and the Fe—Al containing phase comprises at least one of an FeAl phase and Fe—Al—Zn phase and an area ratio of the Fe—Al—Zn phase in the main layer is 10.0% or less.

A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm.sup.3/μm.sup.2, and the five-point peak height (S5p) of the treating surface is 0.15 to 2.00 μm.