Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include depositing a first aqueous composition comprising a first reactive component onto a metallic layer of a substrate; depositing a second aqueous composition comprising a second reactive component on selected portions of the deposited first aqueous composition to form, from a chemical reaction between the first reactive component and the second reactive component, a bi-component material mask in a pattern to protect selected regions of the metallic layer; and depositing an etch solution to remove the metallic layer in regions not protected by the bi-component material mask.

Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include depositing a first aqueous composition comprising a first reactive component onto a metallic layer of a substrate; depositing a second aqueous composition comprising a second reactive component on selected portions of the deposited first aqueous composition to form, from a chemical reaction between the first reactive component and the second reactive component, a bi-component material mask in a pattern to protect selected regions of the metallic layer; and depositing an etch solution to remove the metallic layer in regions not protected by the bi-component material mask.

A method of forming a surface texture includes arranging a flexible mask (610, 920) with a pattern over a surface (621) of a component (620); and performing electrochemical etching on the surface (621) of the component (620) to form a surface texture on the surface (621) according to the pattern of the flexible mask.

The present invention relates to a colored metal film comprising a metal article and a plurality of pores. The plurality of pores further comprises a high layer, an intermediate layer, and a low layer, in which the three layers together forms an embossed image. The present invention also relates to a method of manufacturing colored metal films. The method is used to manufacture a flat image or an embossed image on a metal article. The method comprises a finishing process, a first coating process, a color adjustment, a first printing process, an etching process, a second coating process, a second printing process, a sealing process, and a cleaning process.

The present invention relates to a colored metal film comprising a metal article and a plurality of pores. The plurality of pores further comprises a high layer, an intermediate layer, and a low layer, in which the three layers together forms an embossed image. The present invention also relates to a method of manufacturing colored metal films. The method is used to manufacture a flat image or an embossed image on a metal article. The method comprises a finishing process, a first coating process, a color adjustment, a first printing process, an etching process, a second coating process, a second printing process, a sealing process, and a cleaning process.

A method of making a polycrystalline diamond compact includes forming a first layer of polycrystalline diamond precursor materials comprising diamond particles and a first concentration of catalyst, forming a second layer of polycrystalline diamond precursor materials comprising diamond particles and a second concentration of catalyst, and placing a layer of an infiltrant material in the proximity of the first or the second layer of polycrystalline diamond precursor materials. The second concentration of catalyst is greater than the first concentration of catalyst. The infiltrant material is a catalyst. The first layer and the second layer are sintered under high-pressure high-temperature conditions in the presence of the infiltrant material to form the polycrystalline diamond compact. At least a portion of the catalyst is leached from the polycrystalline diamond compact.

A process for creating an anode foil for use in an electrolytic capacitor of an implantable cardioverter defibrillator is provided. The process includes placing a partially masked bulk metal foil in an etch electrolyte solution to etch exposed area of the bulk metal foil, removing the etch-resistant mask to expose the unetched areas, widening the bulk metal foil, and partially cutting the bulk metal foil between a plurality of unetched areas to form a partially detached etched foil anode, such that the unetched areas are not cut and the unetched areas serve as attachment tabs to keep the partially detached etched foil anode attached to the bulk metal foil. Additionally, the process may include an oxide formation step, wherein the step of partially cutting the bulk metal foil is performed after the etching and widening steps, and before the oxide formation step.

The object of the present invention is to provide a metal plate capable of manufacturing a deposition mask in which dispersion of positions of through-holes is restrained. A thermal recovery rate is defined as parts per million of a difference a distance between to measurement points on a sample before a heat treatment and a distance therebetween after the heat treatment, relative to the distance therebetween before the heat treatment. In this case, an average value of the thermal recovery rates of the respective samples is not less than −10 ppm and not more than +10 ppm, and (2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm.

The object of the present invention is to provide a metal plate capable of manufacturing a deposition mask in which dispersion of positions of through-holes is restrained. A thermal recovery rate is defined as parts per million of a difference a distance between to measurement points on a sample before a heat treatment and a distance therebetween after the heat treatment, relative to the distance therebetween before the heat treatment. In this case, an average value of the thermal recovery rates of the respective samples is not less than −10 ppm and not more than +10 ppm, and (2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm.

An apparatus and a process for removing a support structure from a 3D printed part, where the 3D printed part along with the support structure is placed in an acid solution and the part is surrounded by an induction heater. The acid solution is recirculated through the acid tank to prevent the acid solution from heating up too much. Small surfaces of the part are heated up by the induction heater before larger pieces are heated so that the acid will remove the smaller pieces first. After enough time, all of the support structure is removed by the acid and the heater to leave the finished 3D printed part with the support structure removed.