A method is used for cleaning heat exchanger systems. The method is performed at a computer system having one or more processors and memory storing one or more programs configured for execution by the one or more processors. The method determines component percentages of a cleaning solution based, at least in part, on operational parameters of a heat exchanger system. The operational parameters include chemical composition of fluids passing through the heat exchanger system and operating temperatures of the fluids passing through the heat exchanger system. The component percentages of the cleaning solution include: (1) hydrogen peroxide, 2-90 wt. %; (2) a complexing agent, 3-30 wt. %; (3) water-soluble calixarene, 0.01-10 wt. %; and (4) water. The complexing agent includes a polybasic organic acid or a sodium salt thereof, or a derivative of phosphorous acid.

The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

Disclosed herein are systems for treating a substrate. The system may include a cleaner composition, a deoxidizing composition comprising a Group IVA metal and/or a Group IVB metal and free fluoride and having a pH of 1.0 to 3.0, and/or a seal composition. The system may also include a coating composition. The cleaner composition, deoxidizing composition, and/or seal composition may comprise a homopolymer or a copolymer comprising a phosphorous-containing monomeric subunit m1. Also disclosed is a deoxidizing composition comprising a Group IVA metal and a Group IVB metal and free fluoride and having a pH of 1.0 to 3.0. Also disclosed are methods of treating a substrate. Also disclosed are treated substrates.

Described herein is a simplified process for a pretreatment of metallic substrates for cold forming. Also described herein are a corresponding reactive lubricant, a metallic substrate which has been pretreated by the process, and a method of using the pretreated metallic substrate.

Described herein is a simplified process for a pretreatment of metallic substrates for cold forming. Also described herein are a corresponding reactive lubricant, a metallic substrate which has been pretreated by the process, and a method of using the pretreated metallic substrate.

A method for producing a grain oriented electrical steel sheet includes a decarburization annealing process where an oxidation degree PH.sub.2O/PH.sub.2 is controlled, an annealing separator applying process where a mass ratio of MgO and Al.sub.2O.sub.3 in an annealing separator is controlled, a final annealing process where an oxidation degree is controlled when atmosphere includes hydrogen or a dew point is controlled when atmosphere consists of inert gas, and an insulation coating forming process where a baking temperature and a heat treatment temperature are controlled.

A method for producing a grain oriented electrical steel sheet includes a decarburization annealing process where an oxidation degree PH.sub.2O/PH.sub.2 is controlled, an annealing separator applying process where a mass ratio of MgO and Al.sub.2O.sub.3 in an annealing separator is controlled, a final annealing process where an oxidation degree is controlled when atmosphere includes hydrogen or a dew point is controlled when atmosphere consists of inert gas, and an insulation coating forming process where a baking temperature and a heat treatment temperature are controlled.

The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.