A method for recovering metals from scrap sources. The method includes obtaining scrap sources that include the metal to be recovered. The method also includes removing the metal from the scrap sources. Removing the metal from the scrap sources includes adding a reagent to the scrap sources, the reagent configured to leach the metal from the scrap sources creating a leachate. Removing the metal from the scrap sources also includes extracting the metal from the leachate and regenerating the reagent.

A method for preparing a filling material includes: dissolving FeCl.sub.3.Math.6H.sub.2O and an imprinted molecule in water to form a reaction solution; adding DMF to the reaction solution and stirring for dissolution; adding BDC to the reaction solution and stirring for dissolution; soaking PC into the reaction solution and stirring; and treating the reaction solution by a hydrothermal method to remove a molecule of an additive decomposition product and prepare the filling material imprinted with a casting structure of the molecule of additive decomposition product. The present invention can effectively and selectively adsorb the additive decomposition products and achieve the effects of effectively removing the additive decomposition products, preventing the decomposition products from being mixed in an electrodeposition film of the copper, realizing the uniform distribution of current on the cathode and the anode, improving the quality and preparing an electrolytic copper foil for high-frequency signal transmission.

A method for preparing a filling material includes: dissolving FeCl.sub.3.Math.6H.sub.2O and an imprinted molecule in water to form a reaction solution; adding DMF to the reaction solution and stirring for dissolution; adding BDC to the reaction solution and stirring for dissolution; soaking PC into the reaction solution and stirring; and treating the reaction solution by a hydrothermal method to remove a molecule of an additive decomposition product and prepare the filling material imprinted with a casting structure of the molecule of additive decomposition product. The present invention can effectively and selectively adsorb the additive decomposition products and achieve the effects of effectively removing the additive decomposition products, preventing the decomposition products from being mixed in an electrodeposition film of the copper, realizing the uniform distribution of current on the cathode and the anode, improving the quality and preparing an electrolytic copper foil for high-frequency signal transmission.

During the electrodeposition and electrorefining processes of metals, the electrodes undergo severe corrosion effects. A protective device and included system are proposed, wherein the electrode protective device solves the problem, given that its design and material preferably fireproof and anticorrosive, protect the electrodes. The design encompasses the entire exterior shape of the electrode support bar including the straight parts of the electrode plate that arise from the area of the support bars on both sides.

In a method for producing high-purity electrolytic copper, a first additive (A) containing an aromatic ring of a hydrophobic group and a polyoxyalkylene group of a hydrophilic group, a second additive (B) formed of polyvinyl alcohols, and a third additive (C) formed of tetrazoles are added to a copper electrolyte, copper electrolysis is performed by controlling each concentration of the first additive (A), the second additive (B), and the third additive (C), a current density and a bath temperature, and accordingly, electrolytic copper in which a concentration of Ag is less than 0.2 mass ppm, a concentration of S is less than 0.07 mass ppm, a concentration of all impurities is less than 0.2 mass ppm, and an area ratio of crystal grains having an average crystal grain misorientation (referred to as a GOS value) exceeding 2.5° is 10% or less is obtained.

In a method for producing high-purity electrolytic copper, a first additive (A) containing an aromatic ring of a hydrophobic group and a polyoxyalkylene group of a hydrophilic group, a second additive (B) formed of polyvinyl alcohols, and a third additive (C) formed of tetrazoles are added to a copper electrolyte, copper electrolysis is performed by controlling each concentration of the first additive (A), the second additive (B), and the third additive (C), a current density and a bath temperature, and accordingly, electrolytic copper in which a concentration of Ag is less than 0.2 mass ppm, a concentration of S is less than 0.07 mass ppm, a concentration of all impurities is less than 0.2 mass ppm, and an area ratio of crystal grains having an average crystal grain misorientation (referred to as a GOS value) exceeding 2.5° is 10% or less is obtained.

The problem of high rate electrodeposition of metals such as copper during electrowinning operations or high rate charging of lithium or zinc electrodes for rechargeable battery applications while avoiding the adverse effects of dendrite formation such as causing short-circuiting and/or poor deposit morphology is solved by pulse reverse current electrodeposition or charging whereby the forward cathodic (electrodeposition or charging) pulse current is “tuned” to minimize dendrite formation for example by creating a smaller pulsating boundary layer and thereby minimizing mass transport effects leading to surface asperities and the subsequent reverse anodic (electropolishing) pulse current is “tuned” to eliminate the micro- and macro-asperities leading to dendrites.

A method of acid mist suppression in copper electrowinning is described. In various embodiments, at least one liquid licorice root extract, powdered licorice root extract, or reconstituted licorice extract is added in an amount sufficient to the acidic electrolyte solution of the copper electrowinning process to suppress acid mist from the acidic electrolyte solution during the copper electrowinning process. In various embodiments, combinations of licorice extract and surfactant show synergies in acid mist suppression during copper electrowinning.

A method of acid mist suppression in copper electrowinning is described. In various embodiments, at least one liquid licorice root extract, powdered licorice root extract, or reconstituted licorice extract is added in an amount sufficient to the acidic electrolyte solution of the copper electrowinning process to suppress acid mist from the acidic electrolyte solution during the copper electrowinning process. In various embodiments, combinations of licorice extract and surfactant show synergies in acid mist suppression during copper electrowinning.

A method of acid mist suppression in copper electrowinning is described. In various embodiments, at least one liquid licorice root extract, powdered licorice root extract, or reconstituted licorice extract is added in an amount sufficient to the acidic electrolyte solution of the copper electrowinning process to suppress acid mist from the acidic electrolyte solution during the copper electrowinning process. In various embodiments, combinations of licorice extract and surfactant show synergies in acid mist suppression during copper electrowinning.