The present invention is directed to composite nanoparticles comprising a metal, a rare earth element, and, optionally, a complexing ligand. The invention is also directed to composite nanoparticles having a core-shell structure and to processes for preparation of composite nanoparticles of the invention.

The present invention relates to a process for production of a powder of metal in an electrolytic cell comprising an anode made of the metal, a cathode and an electrolyte solution, which comprises a) anodic dissolution to form ions of the metal in the electrolyte solution and cathodic deposition of metal particles from the electrolyte solution, b) removal of the metal particles from the cathode into the electrolyte solution, and c) isolation of the metal particles from the electrolyte solution, wherein the metal is copper or silver, and wherein the electrolyte solution comprises (i) an alkane sulfonic acid or alkanol sulfonic acid and (ii) a soluble metal salt of an alkane sulfonic acid or alkanol sulfonic acid. The present invention also relates to the copper or silver powder obtained or obtainable by the process and use an alkane sulfonic acid or alkanol sulfonic acid in an electrolyte solution for production of a silver or copper powder by electrolytic deposition.

The present invention relates to a process for production of a powder of metal in an electrolytic cell comprising an anode made of the metal, a cathode and an electrolyte solution, which comprises a) anodic dissolution to form ions of the metal in the electrolyte solution and cathodic deposition of metal particles from the electrolyte solution, b) removal of the metal particles from the cathode into the electrolyte solution, and c) isolation of the metal particles from the electrolyte solution, wherein the metal is copper or silver, and wherein the electrolyte solution comprises (i) an alkane sulfonic acid or alkanol sulfonic acid and (ii) a soluble metal salt of an alkane sulfonic acid or alkanol sulfonic acid. The present invention also relates to the copper or silver powder obtained or obtainable by the process and use an alkane sulfonic acid or alkanol sulfonic acid in an electrolyte solution for production of a silver or copper powder by electrolytic deposition.

The invention is directed to a process to prepare metal nanoparticles or metal oxide nanoparticles by applying a cathodic potential as an alternating current (ac) voltage to a solid starting metal object which solid metal object is in contact with a liquid electrolyte comprising a stabilising cation. The invention is also directed to the use of the nanoparticles as a catalyst.

The invention is directed to a process to prepare metal nanoparticles or metal oxide nanoparticles by applying a cathodic potential as an alternating current (ac) voltage to a solid starting metal object which solid metal object is in contact with a liquid electrolyte comprising a stabilising cation. The invention is also directed to the use of the nanoparticles as a catalyst.

Provided is a silver-coated copper powder which can be utilized as an electrically conductive paste and an electromagnetic wave shield. A silver-coated copper powder has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 m to 5.0 m to be determined by scanning electron microscopic (SEM) observation gather, the surface of the copper particles is coated with silver, the average particle diameter (D50) of the silver-coated copper powder 1 is from 1.0 m to 100 m, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.

Provided is a silver-coated copper powder which can be utilized as an electrically conductive paste and an electromagnetic wave shield. A silver-coated copper powder has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 m to 5.0 m to be determined by scanning electron microscopic (SEM) observation gather, the surface of the copper particles is coated with silver, the average particle diameter (D50) of the silver-coated copper powder 1 is from 1.0 m to 100 m, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.

The inventive subject matter is directed to continuous electrochemical production of highly pure micro- or nanostructured lead that at least partially encloses the electroprocessing solvent and molecular hydrogen and optional guest compounds to form a mixed matrix. Such compositions are particularly suitable for cold forming of various structures and/or for alloy and composite material production.

The inventive subject matter is directed to continuous electrochemical production of highly pure micro- or nanostructured lead that at least partially encloses the electroprocessing solvent and molecular hydrogen and optional guest compounds to form a mixed matrix. Such compositions are particularly suitable for cold forming of various structures and/or for alloy and composite material production.

Provided is a copper powder which can be suitably utilized in applications such as an electrically conductive paste and an electromagnetic wave shield. A copper powder according to the present invention has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 m to 5.0 m to be determined by scanning electron microscopic SEM observation gather, the average particle diameter D50 of the copper powder is from 1.0 m to 100 m, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.