Methods and systems for producing a three-dimensional structure using electrochemical additive manufacturing are described herein. The methods can comprise injecting a growth control solution into an electrolyte comprising a metal salt to form a growth control region and applying an electric potential to a working electrode to thereby form a layer of metal at a location defined by the growth control region. The injecting and applying steps of the methods can be repeated for form the three-dimensional structure on a layer-by-layer basis.

Methods and processes are described that enable the manufacture of a superior thin-walled mold from which higher-quality, less-costly disposable gloves can be more efficiently produced. The method can include creating a glove form in a sacrificial material; electroforming an electroformed master from the glove form; removing sacrificial material from the electroformed master; creating a tertiary form from the electroformed master; forming an initial copper layering on the tertiary form; and developing the initial copper layering into a thick copper plating to create a copper mold for gloves.

Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

A hydrogel is formed by a reaction which is induced, in an electrolytic solution, by an electrode product electrochemically generated by electrodes installed in the electrolytic solution. An apparatus including an electrolytic tank with a bottom surface on which a two-dimensional array of working electrodes is provided and a counter electrode installed in the electrolytic tank is prepared. An electrolytic solution containing a dissolved substance that causes electrolytic deposition of a hydrogel is housed in the electrolytic tank. By applying a predetermined voltage to one or more selected working electrodes of the two-dimensional array, a hydrogel with a two-dimensional pattern corresponding to the arrangement of the selected working electrodes is formed.

Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

A method for producing a 3D structure, according g to which a composite conductive substrate (CCS) with a conductive layer and a non-conductive layer is provided and a conductive pattern is determined for each layer of the 3D structure. A first layer of non-conductive matter on the CCS is printed, such that the conductive pattern of the first layer left empty from the non-conductive matter. The empty conductive pattern is filled with conductive matter by electroplating and for each following layer, in turn, printing, on the previous layer, a layer of non-conductive matter, the conductive pattern of the present layer left empty from the non-conductive matter; plating non-conductive areas of the previous layer that are left uncoated with conductive matter; and filling the empty conductive pattern of the present layer with conductive matter by electroplating.

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit configured to receive a signal containing anode address data and configured to output a signal causing an anode array pattern; and a first controller being a current controller configured to control a flow of current to the anode array; a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit; and a third controller configured to clear bubbles which have formed on the anode after a length of time of steady state deposition by controlling the flow of the electrolyte solution across the anode array surface..

An electrochemical system includes at least one electrochemical cell with a receptacle containing an electrolytic bath in which is disposed a counter electrode. At least one nozzle opens from the receptacle toward and proximate a substrate configured as a working electrode. The at least one electrochemical cell is selectively configurable between a configuration for electrodeposition of a material onto the substrate and a configuration for electrodissolution of material from a structure on the substrate. In a method of using an electrochemical cell, a metal salt—of the electrolytic bath—is flowed through the nozzle in the presence of at least one of a voltage difference and a current flow between the working electrode and the counter electrode. The system may be configured for relative movement between the at least one nozzle and the substrate, and the electrochemical cell(s) may be usable for any of electrodeposition, electrodissolution, and electrochemical sensing.

A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

An electrodeposition system, for additive manufacturing of a three-dimensional structure, includes at least one electrochemical cell. The at least one electrochemical cell includes a receptacle containing an electrolytic bath. At least one nozzle opens from the receptacle toward and proximate a substrate, which is configured as a working electrode of the at least one electrochemical cell. The at least one electrochemical cell also includes a counter electrode disposed in the electrolytic bath. In a method for forming a three-dimensional structure, a metal salt, dissolved in the electrolytic salt, flows through the nozzle to deposit a metal of the metal salt on a surface of the substrate configured as the working electrode. The system may be configured for relative movement between the at least one nozzle and the substrate, enabling additive manufacturing of a three-dimensional structure by electrodeposition.