C25D1/02

ELECTROCHEMICAL METHOD FOR FABRICATION OF HIGH-PURITY, HIGH-CONDUCTIVITY CORRUGATED WAVEGUIDES

A method of manufacturing a corrugated copper microwave waveguide comprising placing a mandrel with external corrugations in an electrolyte bath substantially devoid of brighteners, accelerators, or levelers and including copper ions, sulfuric acid, chloride, and polyethylene glycol. The mandrel is placed proximate a copper anode in the bath. One or more waveforms are applied to the mandrel and anode to control electrodeposition distribution of copper to the mandrel rather than controlling the electrolyte bath chemistry. The mandrel and the resulting electroformed waveguide are removed from the electrolyte bath and the mandrel is excised (e.g., dissolved) resulting in a microwave waveguide with internal corrugations. Substantially devoid of additives (brighteners, accelerators, and/or levelers) generally means not having to repeatedly meter in additives during the electroforming process.

Method of producing reinforced container
10557208 · 2020-02-11 · ·

A container structure having one or more sections and a method for manufacturing such a structure is provided. Using an additive manufacturing process, a mold material is applied to produce a shaped substrate in the form of the desired sections and/or structure. Multiple reinforcement members are disposed within the substrate and extend between and are at least partially exposed at the inner and outer substrate surfaces. A coating material is applied to the inner and outer substrate surfaces and bonds to the exposed portions of the reinforcement members. The mold material is removed and replaced with another material among the reinforcement members between the substrate coatings.

Replication tools and related fabrication methods and apparatus
10546607 · 2020-01-28 · ·

Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.

Replication tools and related fabrication methods and apparatus
10546607 · 2020-01-28 · ·

Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.

METAL AND/OR CERAMIC MICROLATTICE STRUCTURE AND ITS MANUFACTURING METHOD
20200023614 · 2020-01-23 ·

A metal and/or ceramic microlattice structure, comprising an alternation of first layers and of second layers formed by tubes, and interlocking with each other in order to form open loops cooperating two by two in order to form nodes of an articulated/ball-joint nature.

METAL AND/OR CERAMIC MICROLATTICE STRUCTURE AND ITS MANUFACTURING METHOD
20200023614 · 2020-01-23 ·

A metal and/or ceramic microlattice structure, comprising an alternation of first layers and of second layers formed by tubes, and interlocking with each other in order to form open loops cooperating two by two in order to form nodes of an articulated/ball-joint nature.

ELECTROFORM VAPOR CHAMBER INTEGRATED THERMAL MODULE INTO PCB LAYOUT DESIGN

Systems and methods are described, and one method includes storing a PCB dimension, a vapor chamber (VC) case configuration, a package height of a heat-generating (HG) device, a component data identifying a height of a component, and a layout configuration data indicating locations for the HG device and the component. Upon determining the component location is an interfering location, the VC case configuration data is updated to indicate an inner clearance perimeter for the VC case, surrounding the interfering location. Electroforming forms the VC, for thermal coupling to the HG device, having a VC case with rimless, seamless outer peripheral surfaces aligned and facing according to the VC case outer perimeter, and other rimless surfaces aligned and facing, relative to the clearance perimeter, to form a clearance.

ELECTROFORM VAPOR CHAMBER INTEGRATED THERMAL MODULE INTO PCB LAYOUT DESIGN

Systems and methods are described, and one method includes storing a PCB dimension, a vapor chamber (VC) case configuration, a package height of a heat-generating (HG) device, a component data identifying a height of a component, and a layout configuration data indicating locations for the HG device and the component. Upon determining the component location is an interfering location, the VC case configuration data is updated to indicate an inner clearance perimeter for the VC case, surrounding the interfering location. Electroforming forms the VC, for thermal coupling to the HG device, having a VC case with rimless, seamless outer peripheral surfaces aligned and facing according to the VC case outer perimeter, and other rimless surfaces aligned and facing, relative to the clearance perimeter, to form a clearance.

DUCT ASSEMBLY AND METHOD OF FORMING

Duct assembly and method of forming a duct assembly, the method including providing a duct having an outer surface and an inner surface, the outer surface defining a periphery and the inner surface defining a first fluid passageway, covering at least a portion of the outer surface with at least a portion of a sacrificial body, depositing a metal layer over an exposed surface of the sacrificial body, and removing the sacrificial body.

Devices to detect a substance and methods of producing such a device

Devices to detect a substance and methods of producing such a device are disclosed. An example device to detect a substance includes a housing defining a first chamber and a substrate coupled to the housing. The substrate includes nanostructures positioned within the first chamber. The nanostructures are to react to the substance when exposed thereto. The device includes a first heater positioned within the first chamber. The heater is to heat at least a portion of the substance to ready the device for analysis.