A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.

A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.

A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 μm. The target surface has a surface roughness Sz of less than or equal to 0.308 μm.

A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 μm. The target surface has a surface roughness Sz of less than or equal to 0.308 μm.

A porous material with a specific surface area higher than 10/mm, and methods and system for manufacturing such a porous material. The porous material includes a plurality of pores having a substantially uniform size with a variation of less than about 20%, wherein the size is larger than about 100 nm and smaller than about 5 mm. A system including the porous material can be configured as one of a desalination system, a super-fine bubble generation system, a capacitor system, or a battery system.

The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.

The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.

A method for producing a porous aluminum foil of the present invention is characterized in that a porous aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, and having a water content of 100 to 2000 ppm, and then the film is separated from the substrate. The nitrogen-containing compound is preferably at least one selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R.sup.1R.sup.2R.sup.3R.sup.4N.X (R.sup.1 to R.sup.4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation).

A method for producing a porous aluminum foil of the present invention is characterized in that a porous aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, and having a water content of 100 to 2000 ppm, and then the film is separated from the substrate. The nitrogen-containing compound is preferably at least one selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R.sup.1R.sup.2R.sup.3R.sup.4N.X (R.sup.1 to R.sup.4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation).

The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be layered or nanolayered wherein in the microstructure/nanostructure and composition of individual layers can be independently modulated.