Patent classifications
C25D1/04
Copper foil with minimized bagginess and tear, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same
Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm.sup.2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1:
PAR=Rp/Ra [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.
Copper foil with minimized bagginess and tear, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same
Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm.sup.2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1:
PAR=Rp/Ra [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.
Electrolytic copper foil, method for producing same, and high-capacity Li secondary battery negative electrode including same
The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/μm+ peak density/30+ amount of Cr adhesion/(mg/m.sup.2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.
Electrolytic copper foil, method for producing same, and high-capacity Li secondary battery negative electrode including same
The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/μm+ peak density/30+ amount of Cr adhesion/(mg/m.sup.2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.
Electrolytic copper foil having high-temperature dimensional stability and texture stability, and manufacturing method therefor
The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 μm/(m.Math.° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
Electrolytic copper foil having high-temperature dimensional stability and texture stability, and manufacturing method therefor
The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 μm/(m.Math.° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
ELECTROLYTIC IRON FOIL
[Object]
An object of the present invention is to provide an electrolytic foil and a battery current collector capable of restraining the risk of breakage and tearing during manufacturing due to reduction in film thickness and further exhibiting sufficient strength and elongation during repetitive charging and discharging of a secondary battery.
Solving Means
An electrolytic iron foil in which the electrolytic iron foil is less than 20 μm in thickness, the electrolytic iron foil has a first surface and a second surface, and a value obtained by dividing a three-dimensional surface texture parameter Sv by the thickness is equal to or less than 0.27 in both the first surface and the second surface.
ELECTROLYTIC IRON FOIL
[Object]
An object of the present invention is to provide an electrolytic foil and a battery current collector capable of restraining the risk of breakage and tearing during manufacturing due to reduction in film thickness and further exhibiting sufficient strength and elongation during repetitive charging and discharging of a secondary battery.
Solving Means
An electrolytic iron foil in which the electrolytic iron foil is less than 20 μm in thickness, the electrolytic iron foil has a first surface and a second surface, and a value obtained by dividing a three-dimensional surface texture parameter Sv by the thickness is equal to or less than 0.27 in both the first surface and the second surface.
Advanced electrodeposited copper foil and copper clad laminate using the same
An advanced electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil has an uneven micro-roughened surface. As observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, the uneven micro-roughened surface has a plurality of production direction stripes formed by copper crystals.
Metal plate for producing vapor deposition masks, inspection method for metal plates, production method for metal plates, vapor deposition mask, vapor deposition mask device, and production method for vapor deposition masks
A metal plate includes a surface including a longitudinal direction of the metal plate and a width direction orthogonal to the longitudinal direction. A surface reflectance by regular reflection of a light is 8% or more and 25% or less. The surface reflectance is measured when the light is incident on the surface at an angle of 45°±0.2°. The light is in at least one plane orthogonal to the surface.