This aluminum-plated steel sheet has a steel sheet and a plating layer formed on a surface of the steel sheet, the plating layer contains one or more A group elements selected from a group consisting of Be, Mg, Ca, Sr, Ba, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, and Zn, a remainder of Al, Fe, and impurities, a thickness t of the plating layer is 10 to 60 μm, and an average grain size is 2t/3 or less and 15 μm or less in a thickness range from an outermost surface of the plating layer to a ⅔ thickness t position.

This aluminum-plated steel sheet has a steel sheet and a plating layer formed on a surface of the steel sheet, the plating layer contains one or more A group elements selected from a group consisting of Be, Mg, Ca, Sr, Ba, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, and Zn, a remainder of Al, Fe, and impurities, a thickness t of the plating layer is 10 to 60 μm, and an average grain size is 2t/3 or less and 15 μm or less in a thickness range from an outermost surface of the plating layer to a ⅔ thickness t position.

The present disclosure provides a micro-rough electrolytic copper foil and a copper clad laminate. The electrolytic copper foil has a micro-rough surface formed with mountain-shaped structures and recessed structures. A multiplication value of an arithmetic mean height (Sa) and a vertex density (Spd) of the mountain-shaped structures measured according to ISO 25178 is between 150000 μm/mm.sup.2 and 400000 μm/mm.sup.2. An arithmetic mean undulation (Wa) of the mountain-shaped structures measured according to JIS B0601:2001 is between 0.06 μm and 1.5 μm. Therefore, the electrolytic copper foil with good binding strength and electrical properties can be obtained.

The present disclosure provides a micro-rough electrolytic copper foil and a copper clad laminate. The electrolytic copper foil has a micro-rough surface formed with mountain-shaped structures and recessed structures. A multiplication value of an arithmetic mean height (Sa) and a vertex density (Spd) of the mountain-shaped structures measured according to ISO 25178 is between 150000 μm/mm.sup.2 and 400000 μm/mm.sup.2. An arithmetic mean undulation (Wa) of the mountain-shaped structures measured according to JIS B0601:2001 is between 0.06 μm and 1.5 μm. Therefore, the electrolytic copper foil with good binding strength and electrical properties can be obtained.

A copper-clad laminate including at least one of a copper layer having a roughened surface is disclosed. The copper-clad laminate is obtained by roughening at least one surface of a base copper layer so as to have a low profile comprising a copper layer having a thickness of from 5 μm to 70 μm and a resin layer on the copper layer, wherein a peeling strength between the copper layer and the resin layer is more than 0.6 N/mm when the thickness of the copper layer is more than 5 μm, wherein a ten-point mean roughness Sz of the roughened surface is lower than that of the base copper layer.

A copper-clad laminate including at least one of a copper layer having a roughened surface is disclosed. The copper-clad laminate is obtained by roughening at least one surface of a base copper layer so as to have a low profile comprising a copper layer having a thickness of from 5 μm to 70 μm and a resin layer on the copper layer, wherein a peeling strength between the copper layer and the resin layer is more than 0.6 N/mm when the thickness of the copper layer is more than 5 μm, wherein a ten-point mean roughness Sz of the roughened surface is lower than that of the base copper layer.

Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.

Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.

Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.

The present invention relates to an electrolytic copper foil for a secondary battery, and a method of producing the same. The electrolytic copper foil for a secondary battery exhibits a little change in a physical property caused by a difference in a crosshead speed when tensile strength and an elongation percentage of the electrolytic copper foil are measured, thereby achieving excellent charging and discharging characteristics of a battery and preventing exfoliation of an active material. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC), cobalt, and iron by using a drum, in which a ratio of the TOC to the cobalt and the iron contained in the electrolytic copper foil follows Formula 1 below.
TOC/(cobalt+iron)=1.3 to 1.5  [Formula 1]