A copper-clad laminate includes an insulating layer formed of a cured product of a resin composition and a surface treated copper foil in contact with the insulating layer, in which the resin composition contains a compound having at least one group specified in the present application and a crosslinking type curing agent; and the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil.

An electrolytic copper foil having higher electrical conductivity, and a method for producing the same are provided. The electrolytic copper foil according the present invention has a carbon content of 5 ppm or less, a sulfur content of 3 ppm or less, an oxygen content of 5 ppm or less, and a nitrogen content of 0.5 ppm or less; has a total content of carbon, sulfur, oxygen, nitrogen, and hydrogen of 15 ppm or less; and has a number of grains of 8.0 to 12.0/μm.sup.2, the number of grains changing to 0.6 to 1.0/μm.sup.2 by heating the electrolytic copper foil at 150° C. for 1 hour. A method for producing this electrolytic copper foil includes cleaning a copper raw material; dissolving the copper raw material after the cleaning to obtain an electrolytic solution having a total organic carbon (TOC) of 10 ppm or less; and electrolyzing the electrolytic solution to obtain the electrolytic copper foil.

An electrolytic copper foil having higher electrical conductivity, and a method for producing the same are provided. The electrolytic copper foil according the present invention has a carbon content of 5 ppm or less, a sulfur content of 3 ppm or less, an oxygen content of 5 ppm or less, and a nitrogen content of 0.5 ppm or less; has a total content of carbon, sulfur, oxygen, nitrogen, and hydrogen of 15 ppm or less; and has a number of grains of 8.0 to 12.0/μm.sup.2, the number of grains changing to 0.6 to 1.0/μm.sup.2 by heating the electrolytic copper foil at 150° C. for 1 hour. A method for producing this electrolytic copper foil includes cleaning a copper raw material; dissolving the copper raw material after the cleaning to obtain an electrolytic solution having a total organic carbon (TOC) of 10 ppm or less; and electrolyzing the electrolytic solution to obtain the electrolytic copper foil.

Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. In a first aspect, ΔRS between the deposited side and the drum side is at most about 95 MPa, and the deposited side exhibits a Vv in a range from about 0.15 μm.sup.3/μm.sup.2 to about 1.35 μm.sup.3/μm.sup.2. In a second aspect, the deposited side has a Sku of about 1.5 to about 6.5 and the deposited side exhibits a Vv in a range from about 0.15 μm.sup.3/μm.sup.2 to about 1.35 μm.sup.3/μm.sup.2. The characteristics are beneficial to improve the quality of the electrodeposited copper foil, thereby extending the charge-discharge cycle life of a lithium-ion secondary battery comprising the same.

Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. In a first aspect, ΔRS between the deposited side and the drum side is at most about 95 MPa, and the deposited side exhibits a Vv in a range from about 0.15 μm.sup.3/μm.sup.2 to about 1.35 μm.sup.3/μm.sup.2. In a second aspect, the deposited side has a Sku of about 1.5 to about 6.5 and the deposited side exhibits a Vv in a range from about 0.15 μm.sup.3/μm.sup.2 to about 1.35 μm.sup.3/μm.sup.2. The characteristics are beneficial to improve the quality of the electrodeposited copper foil, thereby extending the charge-discharge cycle life of a lithium-ion secondary battery comprising the same.

Disclosed herein is an electrolytic copper foil including a copper layer, wherein the copper layer includes a (220) surface, and an orientation index M(220) of the (220) surface is one or more.

Disclosed herein is an electrolytic copper foil including a copper layer, wherein the copper layer includes a (220) surface, and an orientation index M(220) of the (220) surface is one or more.

The present invention relates to a nanocoil-substrate complex for controlling adhesion and differentiation of stem cells, a manufacturing method thereof, and a method of controlling adhesion and differentiation of stem cells by using the nanocoil-substrate complex, and the method of controlling adhesion and differentiation of stem cells may temporally and reversibly control adhesion and phenotypic differentiation of stem cells in vivo and ex vivo by controlling application/non-application of a magnetic field to the nanocoil-substrate complex.

The present invention relates to a nanocoil-substrate complex for controlling adhesion and differentiation of stem cells, a manufacturing method thereof, and a method of controlling adhesion and differentiation of stem cells by using the nanocoil-substrate complex, and the method of controlling adhesion and differentiation of stem cells may temporally and reversibly control adhesion and phenotypic differentiation of stem cells in vivo and ex vivo by controlling application/non-application of a magnetic field to the nanocoil-substrate complex.

A method of depositing a high entropy alloy onto an electrode surface is provided. The method includes providing a bath including a plurality of ions of a plurality of metals. The method further includes submerging, at least partially, an electrode including an electrode surface in the bath. The method further includes applying a voltage to the electrode to form a high entropy alloy on the electrode surface.