A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treating surface is 0.4 to 3.0 μm. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of (111) plane to the sum of the integrated intensities of diffraction peaks of (111) plane, (200) plane, and (220) plane of the treating surface is at least 60%.

A process is provided comprising submerging a substrate in an electrochemical deposit bath having at least a metal salt and saccharin. In embodiments, the film is further treated with anodization, and in other cases chemical vapor deposition. Films are also provided formed by the disclosed processes. The films are nanoporous on at least a portion of a surface of the films. Also disclosed are electronic devices having the films disclosed, including lithium-ion batteries, storage devices, supercapacitors, electrodes, semiconductors, fuel cells, and/or combinations thereof.

A process is provided comprising submerging a substrate in an electrochemical deposit bath having at least a metal salt and saccharin. In embodiments, the film is further treated with anodization, and in other cases chemical vapor deposition. Films are also provided formed by the disclosed processes. The films are nanoporous on at least a portion of a surface of the films. Also disclosed are electronic devices having the films disclosed, including lithium-ion batteries, storage devices, supercapacitors, electrodes, semiconductors, fuel cells, and/or combinations thereof.

A surface-treated copper foil including a treating surface, where the root mean square height (Sq) of the treating surface is in a range of 0.20 to 1.50 μm and the texture aspect ratio (Str) of the treating surface is not greater than 0.65. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of (111) peak to the sum of the integrated intensities of (111) peak, (200) peak, and (220) peak of the treating surface is at least 60%.

A surface-treated copper foil including a treating surface, where the root mean square height (Sq) of the treating surface is in a range of 0.20 to 1.50 μm and the texture aspect ratio (Str) of the treating surface is not greater than 0.65. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of (111) peak to the sum of the integrated intensities of (111) peak, (200) peak, and (220) peak of the treating surface is at least 60%.

The method for producing an electrolytic aluminum foil of the present disclosure is a method for producing an electrolytic aluminum foil, the method including supplying an electrolytic solution in an electrolytic cell provided with a diaphragm between an anode and a cathode and depositing an aluminum foil on a surface of the cathode by electrolysis, wherein the diaphragm is made of aluminum having a purity of 85.0% or more and has a plurality of pores having an average pore diameter of 100 to 1000 μm.

The method for producing an electrolytic aluminum foil of the present disclosure is a method for producing an electrolytic aluminum foil, the method including supplying an electrolytic solution in an electrolytic cell provided with a diaphragm between an anode and a cathode and depositing an aluminum foil on a surface of the cathode by electrolysis, wherein the diaphragm is made of aluminum having a purity of 85.0% or more and has a plurality of pores having an average pore diameter of 100 to 1000 μm.

A surface-treated copper foil includes a treating surface, and a peak extreme height (Sxp) of the treating surface being in a range of 0.4-2.5 μm, where the hysteresis loop of the surface-treated copper foil includes a first magnetization and a second magnetization when the magnetic field strength of the hysteresis loop is zero, and the absolute difference between the value of the first magnetization and the value of the second magnetization is in a range of 20-1200 emu/m.sup.3.

A method for compact and flat bismuth metal preparation by electrolysis is provided. In the method, one or more of β-naphthol, acacia, sulfonated and vulcanized alkylphenol ethoxylate and naphthol ethoxylate oxides are added to the acidic solution of bismuth methanesulfonate as additives, and the cathodic bismuth is obtained by electrolysis at 20-80° C. The method for bismuth metal preparation is simple and easy to promote, environment-friendly, and the obtained bismuth metal has a flat and compact surface and good plate formation effect.

A method for compact and flat bismuth metal preparation by electrolysis is provided. In the method, one or more of β-naphthol, acacia, sulfonated and vulcanized alkylphenol ethoxylate and naphthol ethoxylate oxides are added to the acidic solution of bismuth methanesulfonate as additives, and the cathodic bismuth is obtained by electrolysis at 20-80° C. The method for bismuth metal preparation is simple and easy to promote, environment-friendly, and the obtained bismuth metal has a flat and compact surface and good plate formation effect.