A large-width cathode roller for producing high-strength ultra-thin copper foil includes titanium side plates and a titanium cylinder sealed by the titanium side plates, and a cathode roller core penetrated through the titanium side plates. Steel-copper explosive clad cylinders and a steel support plate are disposed in/on the side plate, inner ring surfaces of the side plates and the copper plates are connected to a copper sleeve around the cathode roller core, outer ring surfaces of the copper plates and the steel support plates are connected to a copper cylinder, inner ring surfaces of the steel support plates are connected to the cathode roller core; and multiple electrically conductive support rings on the copper cylinder are connected to the copper plates on two sides through the electrically conductive copper bars to form a conducting loop to improve the distribution uniformity of the current on the surface of the cathode roller.

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.

An aspect of the present invention provides an Fe—Ni alloy metal foil having excellent heat resilience, where the Fe—Ni alloy metal foil is prepared by an electroforming (EF) method and has a thickness of 100 μm or less (except O μm), wherein the Fe—Ni alloy metal foil comprises, by wt %, Ni: 34-46 %, a remainder of Fe and inevitable impurities, and wherein the Fe—Ni metal foil has a degree of heat resilience in an amount of 30 ppm or less.

An aspect of the present invention provides an Fe—Ni alloy metal foil having excellent heat resilience, where the Fe—Ni alloy metal foil is prepared by an electroforming (EF) method and has a thickness of 100 μm or less (except O μm), wherein the Fe—Ni alloy metal foil comprises, by wt %, Ni: 34-46 %, a remainder of Fe and inevitable impurities, and wherein the Fe—Ni metal foil has a degree of heat resilience in an amount of 30 ppm or less.

The present invention relates to an electrolytic copper foil for a secondary battery and a method of producing the same, and more particularly, to an electrolytic copper foil for a secondary battery, which has little change in a physical property of a copper foil before and after vacuum drying in a process of producing an electrolytic copper foil, thereby exhibiting excellent cycle life in a battery test at a high-density negative electrode, and preventing cracking. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC), zinc, and iron by using a drum, in which a ratio of the TOC to the zinc and the iron contained in the electrolytic copper foil follows Formula 1 below:
TOC/(zinc+iron)=1.3 to 1.5.  Formula 1:

The present invention relates to an electrolytic copper foil for a secondary battery and a method of producing the same, and more particularly, to an electrolytic copper foil for a secondary battery, which has little change in a physical property of a copper foil before and after vacuum drying in a process of producing an electrolytic copper foil, thereby exhibiting excellent cycle life in a battery test at a high-density negative electrode, and preventing cracking. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC), zinc, and iron by using a drum, in which a ratio of the TOC to the zinc and the iron contained in the electrolytic copper foil follows Formula 1 below:
TOC/(zinc+iron)=1.3 to 1.5.  Formula 1:

The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm.sup.2 of Ni and said Cr layer containing 10-100 μg/dm.sup.2 of Cr is provided.

The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm.sup.2 of Ni and said Cr layer containing 10-100 μg/dm.sup.2 of Cr is provided.

A metal nanolaminate includes a plurality of units stacked in a longitudinal direction of the metal nanolaminate. Each of the units includes a first layer and a second layer stacked in the longitudinal direction. The first layer includes a first metal material formed of a first metallic element and the second layer includes the first metal material and a second metal material formed of a second metallic element. Each of the first layer and the second layer has a thickness of at least 5 nm but less than 100 nm in the longitudinal direction.