Provided are a production method of a mold having a recessed pedestal pattern for preventing a liquid flow and a manufacturing method of a pattern sheet. A production method of a mold having a recessed pedestal pattern, has: a step of preparing an insert mold having a protruding needle pattern group; a step of preparing a mold having a first mold provided with a protruding pedestal shape and a second mold; a holding step of holding the protruding pedestal shape of the first mold and the protruding needle pattern group of the insert mold in an overlapping manner; a clamping step of performing clamping with the first mold and the second mold to form a cavity; and an injection step of filling the cavity with a resin.

Provided are a production method of a mold having a recessed pedestal pattern for preventing a liquid flow and a manufacturing method of a pattern sheet. A production method of a mold having a recessed pedestal pattern, has: a step of preparing an insert mold having a protruding needle pattern group; a step of preparing a mold having a first mold provided with a protruding pedestal shape and a second mold; a holding step of holding the protruding pedestal shape of the first mold and the protruding needle pattern group of the insert mold in an overlapping manner; a clamping step of performing clamping with the first mold and the second mold to form a cavity; and an injection step of filling the cavity with a resin.

Embodiments of the disclosure provide methods and apparatus for a shadow mask. In one embodiment, a shadow mask is provided and includes a frame made of a metallic material, and one or more mask patterns coupled to the frame, the one or more mask patterns comprising a metal having a coefficient of thermal expansion less than or equal to about 14 microns/meter/degrees Celsius and having a plurality of openings formed therein, the metal having a thickness of about 5 microns to about 50 microns and having borders formed therein each defining a fine opening having a recessed surface formed on a substrate contact surface thereof, wherein each of the one or more mask patterns have a flatness of less than about 150 microns across a surface area of about 70,000 square millimeters.

Embodiments of the disclosure provide methods and apparatus for a shadow mask. In one embodiment, a shadow mask is provided and includes a frame made of a metallic material, and one or more mask patterns coupled to the frame, the one or more mask patterns comprising a metal having a coefficient of thermal expansion less than or equal to about 14 microns/meter/degrees Celsius and having a plurality of openings formed therein, the metal having a thickness of about 5 microns to about 50 microns and having borders formed therein each defining a fine opening having a recessed surface formed on a substrate contact surface thereof, wherein each of the one or more mask patterns have a flatness of less than about 150 microns across a surface area of about 70,000 square millimeters.

A structure includes a metal layer and a plurality of interconnected unit cells forming a lattice contained at least partly within the metal layer, including at least a first unit cell formed of first interconnected graphene tubes, and a second unit cell formed of second interconnected graphene tubes, wherein the metal layer protrudes through holes within the lattice.

A continuous or semi-continuous process for fabricating nanowires or microwires makes use of the substantially planar template that may be moved through electrochemical solution to grow nanowires or microwires on exposed conductive edges on the surface of that template. The planar template allows fabrication of the template using standard equipment and techniques. Adhesive transfer may be used to remove the wires from the template and in one embodiment to draw a continuous wire from the template to be wound around the drum.

A continuous or semi-continuous process for fabricating nanowires or microwires makes use of the substantially planar template that may be moved through electrochemical solution to grow nanowires or microwires on exposed conductive edges on the surface of that template. The planar template allows fabrication of the template using standard equipment and techniques. Adhesive transfer may be used to remove the wires from the template and in one embodiment to draw a continuous wire from the template to be wound around the drum.

Provided are a production method of a mold having a recessed pedestal pattern for preventing a liquid flow and a manufacturing method of a pattern sheet. A production method of a mold having a recessed pedestal pattern, has: a step of preparing an insert mold having a protruding needle pattern group; a step of preparing a mold having a first mold provided with a protruding pedestal shape and a second mold; a holding step of holding the protruding pedestal shape of the first mold and the protruding needle pattern group of the insert mold in an overlapping manner; a clamping step of performing clamping with the first mold and the second mold to form a cavity; and an injection step of filling the cavity with a resin.

Provided are a production method of a mold having a recessed pedestal pattern for preventing a liquid flow and a manufacturing method of a pattern sheet. A production method of a mold having a recessed pedestal pattern, has: a step of preparing an insert mold having a protruding needle pattern group; a step of preparing a mold having a first mold provided with a protruding pedestal shape and a second mold; a holding step of holding the protruding pedestal shape of the first mold and the protruding needle pattern group of the insert mold in an overlapping manner; a clamping step of performing clamping with the first mold and the second mold to form a cavity; and an injection step of filling the cavity with a resin.

A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 m. The target surface has a surface roughness Sz of less than or equal to 0.308 m.