Disclosed herein is a method comprising growing a shim by disposing a mandrel having an optional textured surface in an electrolytic bath, where the shim contains a negative image of the optional textured surface formed by electrolytic deposition of a metal; affixing the shim working-side down on a reference plane using a fixture; optically scanning the shim to reverse engineer a geometry of a non-working surface, where reverse engineering a geometry of the non-working surface includes developing a profile of the non-working surface and the thickness of the shim; and adding a material to the non-working surface of the shim via additive manufacturing to form a tool insert.

Disclosed herein is a method comprising growing a shim by disposing a mandrel having an optional textured surface in an electrolytic bath, where the shim contains a negative image of the optional textured surface formed by electrolytic deposition of a metal; affixing the shim working-side down on a reference plane using a fixture; optically scanning the shim to reverse engineer a geometry of a non-working surface, where reverse engineering a geometry of the non-working surface includes developing a profile of the non-working surface and the thickness of the shim; and adding a material to the non-working surface of the shim via additive manufacturing to form a tool insert.

The present disclosure provides a manufacture method of a mask for evaporation and a mask. The manufacture method of a mask for evaporation includes: providing an open mask the open mask including at least one open region (BB); forming a photoresist layer at least in the at least one open region, at least a portion of a pattern of the photoresist layer in the open region (BB) being identical to a hollow portion pattern of the mask for evaporation; and depositing a material of the mask for evaporation in a region in which the photoresist layer is formed, so as to form the non-hollow portion pattern of the mask for evaporation, in which the non-hollow portion pattern is connected to a side wall of the open region at an edge of the non-hollow portion pattern.

The present disclosure provides a manufacture method of a mask for evaporation and a mask. The manufacture method of a mask for evaporation includes: providing an open mask the open mask including at least one open region (BB); forming a photoresist layer at least in the at least one open region, at least a portion of a pattern of the photoresist layer in the open region (BB) being identical to a hollow portion pattern of the mask for evaporation; and depositing a material of the mask for evaporation in a region in which the photoresist layer is formed, so as to form the non-hollow portion pattern of the mask for evaporation, in which the non-hollow portion pattern is connected to a side wall of the open region at an edge of the non-hollow portion pattern.

A first light guide plate and a second light guide plate are arranged facing each other. A microprojection group comprising a plurality of microprojections is arranged in the visual recognition region of the surface facing the first light guide plate in the second light guide plate. The plurality of microprojections have a height and arrangement that ensure a distance where interference fringes are not visually recognized between the first light guide plate and the second light guide plate in contact with the second light guide plate. The microprojection group and the dimples configuring a design part formed on the second light guide plate are formed on an identical surface.

A first light guide plate and a second light guide plate are arranged facing each other. A microprojection group comprising a plurality of microprojections is arranged in the visual recognition region of the surface facing the first light guide plate in the second light guide plate. The plurality of microprojections have a height and arrangement that ensure a distance where interference fringes are not visually recognized between the first light guide plate and the second light guide plate in contact with the second light guide plate. The microprojection group and the dimples configuring a design part formed on the second light guide plate are formed on an identical surface.

Methods and processes are described that enable the manufacture of a superior thin-walled mold from which higher-quality, less-costly disposable gloves can be more efficiently produced. The method can include creating a glove form in a sacrificial material; electroforming an electroformed master from the glove form; removing sacrificial material from the electroformed master; creating a tertiary form from the electroformed master; forming an initial copper layering on the tertiary form; and developing the initial copper layering into a thick copper plating to create a copper mold for gloves.

Methods and processes are described that enable the manufacture of a superior thin-walled mold from which higher-quality, less-costly disposable gloves can be more efficiently produced. The method can include creating a glove form in a sacrificial material; electroforming an electroformed master from the glove form; removing sacrificial material from the electroformed master; creating a tertiary form from the electroformed master; forming an initial copper layering on the tertiary form; and developing the initial copper layering into a thick copper plating to create a copper mold for gloves.

A method of manufacturing a metal mask includes providing a growth substrate with a conductive surface. Then, a cover pattern is formed on the conductive surface, which has at least one opening and an insulated surface touching the conductive surface. Next, using the cover pattern as a mask, a first electroforming is performed to form a mold part on the conductive surface. The mold part fills the opening and has a conductive pattern surface touching the conductive surface. The conductive pattern surface is flush with the insulated surface. After the first electroforming, the growth substrate is removed, while the cover pattern and the mold part are reserved. After removing the growth substrate, a second electroforming is performed to the conductive pattern surface of the mold part to form a metal pattern. Afterwards, the mold part and the cover pattern are removed from the metal pattern.

A method of manufacturing a metal mask includes providing a growth substrate with a conductive surface. Then, a cover pattern is formed on the conductive surface, which has at least one opening and an insulated surface touching the conductive surface. Next, using the cover pattern as a mask, a first electroforming is performed to form a mold part on the conductive surface. The mold part fills the opening and has a conductive pattern surface touching the conductive surface. The conductive pattern surface is flush with the insulated surface. After the first electroforming, the growth substrate is removed, while the cover pattern and the mold part are reserved. After removing the growth substrate, a second electroforming is performed to the conductive pattern surface of the mold part to form a metal pattern. Afterwards, the mold part and the cover pattern are removed from the metal pattern.