An electroforming method capable of suppressing peeling of an electroforming material from an electroforming master during electroforming, and controlling a shape of an electroforming material, and a method for producing an electroforming material are provided. The present invention is to provide the electroforming method including forming an electroforming material on a surface of an electroforming master in an electroforming liquid by using the electroforming master as a cathode, in which the electroforming master includes a conductive substrate having a pattern on a surface, the pattern having a protruding portion of which a surface is non-conductive, and an underlying layer that has a sheet resistance of 500Ω/□ or greater, and that is formed on at least a part of the surface of the substrate in an in-plane direction, and the method for producing an electroforming material.

An electroforming master including an n-type semiconductor, and a substrate provided with a pattern on a surface thereof, in which an oxide film is formed on the surface, and a thickness of the oxide film is 18 Å or smaller, a method for producing the above-described electroforming master, and a method for producing an electroforming material using the above-described electroforming master.

An electroforming master including an n-type semiconductor, and a substrate provided with a pattern on a surface thereof, in which an oxide film is formed on the surface, and a thickness of the oxide film is 18 Å or smaller, a method for producing the above-described electroforming master, and a method for producing an electroforming material using the above-described electroforming master.

A method of manufacturing a metal mask includes providing a growth substrate with a conductive surface. Then, a cover pattern is formed on the conductive surface, which has at least one opening and an insulated surface touching the conductive surface. Next, using the cover pattern as a mask, a first electroforming is performed to form a mold part on the conductive surface. The mold part fills the opening and has a conductive pattern surface touching the conductive surface. The conductive pattern surface is flush with the insulated surface. After the first electroforming, the growth substrate is removed, while the cover pattern and the mold part are reserved. After removing the growth substrate, a second electroforming is performed to the conductive pattern surface of the mold part to form a metal pattern. Afterwards, the mold part and the cover pattern are removed from the metal pattern.

A method of manufacturing a metal mask includes providing a growth substrate with a conductive surface. Then, a cover pattern is formed on the conductive surface, which has at least one opening and an insulated surface touching the conductive surface. Next, using the cover pattern as a mask, a first electroforming is performed to form a mold part on the conductive surface. The mold part fills the opening and has a conductive pattern surface touching the conductive surface. The conductive pattern surface is flush with the insulated surface. After the first electroforming, the growth substrate is removed, while the cover pattern and the mold part are reserved. After removing the growth substrate, a second electroforming is performed to the conductive pattern surface of the mold part to form a metal pattern. Afterwards, the mold part and the cover pattern are removed from the metal pattern.

In manufacturing of a first electroformed component and a second electroformed component having portions fitted to each other into close contact, after the first electroformed component is formed, the first electroformed component is used as a portion of an electroforming mold to form the second electroformed component. Using the first electroformed component as a portion of the electroforming mold to form the second electroformed component, the shape of the first electroformed component is transferred to the second electroformed component. As a result, multiple types of components differing in shape may be accurately manufactured concurrently in a series of manufacturing steps.

In manufacturing of a first electroformed component and a second electroformed component having portions fitted to each other into close contact, after the first electroformed component is formed, the first electroformed component is used as a portion of an electroforming mold to form the second electroformed component. Using the first electroformed component as a portion of the electroforming mold to form the second electroformed component, the shape of the first electroformed component is transferred to the second electroformed component. As a result, multiple types of components differing in shape may be accurately manufactured concurrently in a series of manufacturing steps.

The present invention relates to an Fe—P—Cr alloy thin plate and a method for manufacturing the same. An embodiment of the present invention provides an Fe—P—Cr alloy thin plate including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities.

The present invention relates to an Fe—P—Cr alloy thin plate and a method for manufacturing the same. An embodiment of the present invention provides an Fe—P—Cr alloy thin plate including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities.

In certain embodiments, a method comprises placing nonconductive fibers adjacent to a conductive material, immersing the nonconductive fibers and the conductive material in a plating medium, and applying a voltage to the conductive material to initiate electroplating. The method further comprises engulfing, by electroplating, the nonconductive fibers in metal to create a metal matrix composite.