Provided is a stirring paddle driving mechanism with a small load. According to one embodiment, a wet substrate processing device is provided, having: a treatment tank for holding a treatment solution; a stirring paddle disposed inside the treatment tank; and a driving mechanism for driving the stirring paddle, wherein the driving mechanism has: a rotary motor; a central rotating member connected to the rotary motor; an outer fixed ring spaced from the central rotating member and surrounding an outside of the central rotating member; a planetary member connected to the central rotating member so as to rotate inside the outer fixed ring; and a driving shaft connected to the planetary member and the stirring paddle and extending in a radial direction of the outer fixed ring, wherein the driving shaft is configured to reciprocate in a longitudinal direction by rotation of the rotary motor.

Provided is a stirring paddle driving mechanism with a small load. According to one embodiment, a wet substrate processing device is provided, having: a treatment tank for holding a treatment solution; a stirring paddle disposed inside the treatment tank; and a driving mechanism for driving the stirring paddle, wherein the driving mechanism has: a rotary motor; a central rotating member connected to the rotary motor; an outer fixed ring spaced from the central rotating member and surrounding an outside of the central rotating member; a planetary member connected to the central rotating member so as to rotate inside the outer fixed ring; and a driving shaft connected to the planetary member and the stirring paddle and extending in a radial direction of the outer fixed ring, wherein the driving shaft is configured to reciprocate in a longitudinal direction by rotation of the rotary motor.

According to one embodiment, a method of manufacturing a semiconductor device includes loading a substrate into a processing container, airtightly sealing the processing container in which the substrate has been loaded, reducing a pressure of the processing container airtightly sealed, supplying a processing solution into the processing container with reduced pressure, performing a process on the substrate using the processing solution, discharging the processing solution used for the process from the processing container, after discharging the processing solution, opening the processing container, and unloading the substrate subjected to the process out of the processing container.

Provided is a film formation device and a film formation method for a metallic coating that allow forming a metallic coating with a uniform film thickness. The film formation device of the present disclosure includes an anode, a solid electrolyte membrane, a power supply device, a solution container, and a pressure device. The solid electrolyte membrane is disposed between the anode and a substrate that serves as a cathode. The power supply device applies a voltage between the anode and the cathode. The solution container contains a solution between the anode and the solid electrolyte membrane. The solution contains metal ions. The pressure device pressurizes the solid electrolyte membrane to the cathode side with a fluid pressure of the solution. The film formation device further includes a shielding member disposed to surround an outer peripheral surface of the anode. The shielding member shields a line of electric force.

A method for plating a printed circuit board, includes placing a substrate, including a through hole, in contact with a plating solution and disposing the substrate to face an electrode; and applying a pulsed current to each surface of the substrate, including applying pulsed currents of opposite polarity to both surfaces of the substrate at least once and applying pulsed forward currents to both surfaces of the substrate at least once, to plate from a middle to an end of the through hole.

An electrode for electroplating or electrodeposition of a metal and to the method for obtaining the same is provided. The electrode has a conductive substrate, at least one layer of an electrochemically active coating placed on the substrate, and at least one topcoating layer of valve metal.

An electrode for electroplating or electrodeposition of a metal and to the method for obtaining the same is provided. The electrode has a conductive substrate, at least one layer of an electrochemically active coating placed on the substrate, and at least one topcoating layer of valve metal.

Methods and compositions for electrodepositing mixed metal reactive metal layers by combining reactive metal complexes with electron withdrawing agents are provided. Modifying the ratio of one reactive metal complex to the other and varying the current density can be used to vary the morphology the metal layer on the substrate.

A method for plating a printed circuit board, includes placing a substrate, including a through hole, in contact with a plating solution and disposing the substrate to face an electrode; and applying a pulsed current to each surface of the substrate, including applying pulsed currents of opposite polarity to both surfaces of the substrate at least once and applying pulsed forward currents to both surfaces of the substrate at least once, to plate from a middle to an end of the through hole.

A coating system includes an electrocoat (e-coat) bath having an e-coat fluid with a first amount of dissolved gases, a plurality of ultrasonic transducers mounted on at least two sides of the e-coat bath, a carrier frame and control circuitry. The control circuitry is configured to control a trajectory of a metal part dipped in the e-coat bath using the carrier frame, control the plurality of ultrasonic transducers to direct a plurality of acoustic waves at a defined ultrasonic operating frequency and at a first intensity to cause a plurality of localized pressure drops in the e-coat fluid, the first amount of dissolved gases is reduced or removed as bubbles from the e-coat fluid of the e-coat bath based on the directed plurality of acoustic waves, and increase the first intensity of the directed plurality of acoustic waves over a defined time period to accelerate dispersion of an e-coat pigment.