Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

The invention provides a device and a method for manufacturing 3D metal structures by a sequence of electroplating steps, each step adding a cross-section layer of the 3D structure via anodes, selected from a planar 2D anode grid array and forming a pattern template, creating a deposition image on a cathode plate.

Disclosed are an electrochromic element, device, and product, and a manufacturing method therefor. The electrochromic device (7) comprises: an electrochromic yarn (6), an ion storage yarn (18), and a power source (8), wherein the electrochromic yarn (6) contains a first flexible conductive yarn (5) and an electrochromic layer (4) coated on a surface layer of the first flexible conductive yarn (5); the ion storage yarn (18) contains a second flexible conductive yarn (1) and an ion storage layer (17) coated on a surface layer of the second flexible conductive yarn (1); and the first flexible conductive yarn (5) is electrically connected to a negative electrode of the power source (8), and the second flexible conductive yarn (1) is electrically connected to a positive electrode of the power source (8). The electrochromic device (7) can achieve a clear color development effect and make an electrochromic material have a good fastness. The preparation method is simple to operate and easily realizes industrial batch production.

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

A method for plating a printed circuit board, includes placing a substrate, including a through hole, in contact with a plating solution and disposing the substrate to face an electrode; and applying a pulsed current to each surface of the substrate, including applying pulsed currents of opposite polarity to both surfaces of the substrate at least once and applying pulsed forward currents to both surfaces of the substrate at least once, to plate from a middle to an end of the through hole.

A system for fabricating anisotropic magnetic nanowire composites includes a chamber for containing an ionic fluid. A hole in a wall of the chamber allows for the ionic fluid to be in contact with a porous template outside of the chamber, and a cathode and an anode provide an electric field across the ionic fluid and porous template. The electric field causes ionic materials in the ionic fluid to migrate into the pores of the porous template, therefore plating nanowires in the porous template. Constant distances and positions of the anode, cathode, a reference probe, and a stirring element allow for the fabrication of longer, more uniform nanowires, and for the generation of consistent magnetic nanowire composites across multiple fabrication sessions.

A system for fabricating anisotropic magnetic nanowire composites includes a chamber for containing an ionic fluid. A hole in a wall of the chamber allows for the ionic fluid to be in contact with a porous template outside of the chamber, and a cathode and an anode provide an electric field across the ionic fluid and porous template. The electric field causes ionic materials in the ionic fluid to migrate into the pores of the porous template, therefore plating nanowires in the porous template. Constant distances and positions of the anode, cathode, a reference probe, and a stirring element allow for the fabrication of longer, more uniform nanowires, and for the generation of consistent magnetic nanowire composites across multiple fabrication sessions.

A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.

A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.