C25D3/66

Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates

Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5-y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5-y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.

Electrochemical methods, devices and compositions
11280018 · 2022-03-22 · ·

The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the second current being transverse to the first current, and the second current inducing a relativistic charge across the first electrode.

Metal deposits, compositions, and methods for making the same
11274374 · 2022-03-15 · ·

Provided herein is a composition for forming a metal deposit on a substrate. The composition consists essentially of a carboxamide, trialkylamine chloride, and a metal salt. The carboxamide comprises Formula (I). The trialkylamine chloride and the carboxamide are in molar ratio between 1:1 and 1:30 to form an ionic liquid. The trialkylamine chloride is trimethylamine chloride (TMACl), triethylamine chloride (TEACl), triethanolamine chloride, or combinations thereof. The metal salt has the formula MX.sub.y, wherein M is a metal, X is a halide, and y is an oxidation number of M, the metal salt being in a concentration between about 0.2 and about 1.5 moles per liter of the ionic liquid. The metal deposit has an average grain size between about 0.2 μm and about 3 μm and contains less than about 1 mol % of each oxygen, carbon, and chlorine.

MnAl alloy and manufacturing method therefor
11293085 · 2022-04-05 · ·

A MnAl alloy according to the present invention exhibits metamagnetism and has crystal grains containing a τ-MnAl phase and crystal grains containing a γ2-MnAl phase and a β-MnAl phase. When the ratio of the τ-MnAl phase is A, 75%≤A≤99% is preferably satisfied, and when the ratios of the γ2-MnAl phase and β-MnAl phase are B and C, respectively, B<C is preferably satisfied. Thus, it is possible to obtain metamagnetism over a wide temperature range, particularly, over a temperature range of −100° C. to 200° C. and to enhance saturation magnetization.

MnAl alloy and manufacturing method therefor
11293085 · 2022-04-05 · ·

A MnAl alloy according to the present invention exhibits metamagnetism and has crystal grains containing a τ-MnAl phase and crystal grains containing a γ2-MnAl phase and a β-MnAl phase. When the ratio of the τ-MnAl phase is A, 75%≤A≤99% is preferably satisfied, and when the ratios of the γ2-MnAl phase and β-MnAl phase are B and C, respectively, B<C is preferably satisfied. Thus, it is possible to obtain metamagnetism over a wide temperature range, particularly, over a temperature range of −100° C. to 200° C. and to enhance saturation magnetization.

ALUMINUM AND ALUMINUM ALLOY ELECTROPLATED COATINGS
20230392275 · 2023-12-07 ·

In certain aspects, a coated steel substrate comprises a single or multiple-layer electroplated aluminum coating over a steel substrate. The multiple-layer electroplated aluminum coating comprises one or more porous layers and one or more compact layers. The one or more porous layers comprise a material selected from a group consisting of aluminum and aluminum alloys. The one or more compact layers comprise a material selected from a group consisting of aluminum and aluminum alloys. In certain aspects, a method of depositing a multiple-layer aluminum coating over a steel substrate includes electroplating one or more porous aluminum layers over the steel substrate. The one or more porous aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys. One or more compact aluminum layers are electroplated over the steel substrate. The one or more compact aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys.

Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates

Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.

Methods and systems for aluminum electroplating

Systems and methods for coating a metallic component are provided. In one embodiment, a metallic coating may be disposed in a plating bath comprising AlBr3. The metallic coating may be coupled with, or configured as, a working electrode. A counter electrode formed of aluminum may be disposed within the plating bath. An electric current may be applied between the two electrodes resulting in the electrodeposition of aluminum on the metallic component. In one particular embodiment, the plating bath may include LiBr, KBr and CsBr, with AlBr.sub.3 being present in an amount of approximately 80 percent or greater by weight. Various types of metals may be coated with aluminum using embodiments of the present disclosure. Additionally, the methods and systems described herein are amenable to coating of complex geometries.

Methods and systems for aluminum electroplating

Systems and methods for coating a metallic component are provided. In one embodiment, a metallic coating may be disposed in a plating bath comprising AlBr3. The metallic coating may be coupled with, or configured as, a working electrode. A counter electrode formed of aluminum may be disposed within the plating bath. An electric current may be applied between the two electrodes resulting in the electrodeposition of aluminum on the metallic component. In one particular embodiment, the plating bath may include LiBr, KBr and CsBr, with AlBr.sub.3 being present in an amount of approximately 80 percent or greater by weight. Various types of metals may be coated with aluminum using embodiments of the present disclosure. Additionally, the methods and systems described herein are amenable to coating of complex geometries.

Ionic liquid electrolyte and method to electrodeposit metals

An electrolyte and a method to electroplate a metal on a substrate using the electrolyte are described. The electrolyte includes an imidazolium compound, a metal salt, and water. The imidazolium compound has formula (I) ##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 are each independently selected from an H atom and an organic radical. L.sup.− is a compatible anion. The metal salt can include but is not limited to salts of the metals Li, Mg, Ca, Cr, Mn, Fe, Co, Ni, Cu, Zn, Cd, Pb, Bi, La, Ce, Al, Ag, Au, Ga, V, In, Nb, Mo, and W.