A film deposition device (1A) of a metal film includes: a solid electrolyte membrane (13) that allows metal ions to be contained; a positive electrode (11) made of a porous body; a power supply part (14) that applies a voltage between the positive electrode and a base material; and a contact pressurization part (20) that comes into contact with the positive electrode (11) and uniformly pressurizes a film deposition region of a surface of the base material by the solid electrolyte membrane (13) via the positive electrode (11). The positive electrode (11) made of the porous body is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane. The power supply part (14) applies a voltage between the positive electrode and the base material so that the metal film made of the metal is deposited.

A film deposition device (1A) of a metal film includes: a solid electrolyte membrane (13) that allows metal ions to be contained; a positive electrode (11) made of a porous body; a power supply part (14) that applies a voltage between the positive electrode and a base material; and a contact pressurization part (20) that comes into contact with the positive electrode (11) and uniformly pressurizes a film deposition region of a surface of the base material by the solid electrolyte membrane (13) via the positive electrode (11). The positive electrode (11) made of the porous body is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane. The power supply part (14) applies a voltage between the positive electrode and the base material so that the metal film made of the metal is deposited.

A tin plating solution and a method for fabricating a semiconductor device are provided. The tin plating solution comprises tin ions supplied from a soluble tin electrode, an aliphatic sulfonic acid having a carbon number of 1 to 10, an anti-oxidant, a wetting agent, and a grain refiner that is an aromatic carbonyl compound.

A multilayer printed circuit board is provided. The multilayer printed circuit board includes a core, a first conductive layer coupled to the core, an insulating layer covering the first conductive layer, and a second conductive layer spaced from the first conductive layer by the insulating layer. The first conductive layer includes a first portion having a first thickness and a second portion having a second thickness greater than the first thickness. The second conductive layer is electrically coupled to the second portion of the first conductive layer by a conductive via extending through the insulating layer.

The present invention discloses a method and a device for laser-assisted electrochemical composite deposition using a rifling-type hollow rotating electrode, which relate to the field of micro-composite processing in special processing technologies. A center of a laser beam is allowed to pass through a rifling-type hollow rotating electrode and focus onto a cathode substrate. When the rifling-type hollow rotating electrode is rotated at a constant speed, an electrodeposition solution rotates in the rifling-type hollow rotating electrode and generates a certain centripetal force to improve the precision and localization of deposition. During the process of the present invention, an internal rifling structure of the electrode is rotated at a high speed so that the deposition solution generates a centripetal force. The internal rifling structure and an external helical structure of the rifling-type hollow rotating electrode make the deposition solution move upward to form a “self-circulation” system.

A method of using a masking device to mask a portion of a gas turbine engine component for an electroplating process is provided. The masking device includes a main body having sidewalls, a removeable coverplate having an end plate and one or more locking tabs, a fastener located at least partially within the main body, and a shank engaged with the fastener. The method includes placing the gas turbine engine component through an opening in the main body such that the component is held within the main body by a retention slot. The method includes sliding the one or more locking tabs of the removeable coverplate through the opening in the main body such that the removeable coverplate covers the opening of the main body. The method includes securing the one or more locking tabs in one or more relief slots in the sidewalls of the main body.

Disclosed herein are methods of forming one or more transducer elements in a transducer region of a slider by electrodepositing one or more metal ions from an ionic liquid solvent, and related sliders.

Template-guided growth of carbon nanotubes using anodized aluminum oxide nanopore templates provides vertically aligned, untangled planarized arrays of multiwall carbon nanotubes with Ohmic back contacts. Growth by catalytic chemical vapor deposition results in multiwall carbon nanotubes with uniform diameters and crystalline quality, but varying lengths. The nanotube lengths can be trimmed to uniform heights above the template surface using ultrasonic cutting, for example. The carbon nanotube site density can be controlled by controlling the catalyst site density. Control of the carbon nanotube site density enables various applications. For example, the highest possible site density is preferred for thermal interface materials, whereas, for field emission, significantly lower site densities are preferable.

The present invention provides a plating method capable of easily performing various decorative plating processes. The plating method includes a bulge forming process of forming a bulge on an object to be plated by ejecting ink drops of first UV-curable ink from an inkjet head such that the ejected ink drops land on the object, and a plating process of plating the object having the bulge formed thereon, after the bulge forming process. Also, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated.

The invention relates to a method for depositing a metal M1 onto a carbon layer, as well as to a method for manufacturing an electrode for fuel cells and to a method for manufacturing a fuel cell. The method for depositing a metal M1 onto a porous carbon layer according to the invention includes a step of depositing said metal M1 by means of the electrochemical reduction of an electrolytic solution of a salt of the metal M1, and, prior to said step of depositing the metal M1 by means of electrochemical reduction, a step of depositing a metal M2 by means of chemical reduction using a reducing gas of a salt of the metal M2, the thermodynamic equilibrium potential between the ionic form of the salt of M2 and M2, E.sup.eq.sub.ionic form of the salt of M2/M2 being greater than the thermodynamic equilibrium potential between the ionic form of the salt of M1 and M1, E.sup.eq.sub.ionic form of the salt of M1/M1. The invention can be used, in particular, in the field of fuel cells.