A thin-film magnetic head includes a coil, a magnetic path forming section, and an insulating film. The magnetic path forming section includes first and second magnetic material portions. The coil includes first and second coil elements located between the first and second magnetic material portions. The insulating film includes an underlying portion located under the first and second coil elements. In a method of manufacturing the thin-film magnetic head, the insulating film is formed to cover the first and second magnetic material portions, and then a seed layer is formed selectively on the underlying portion of the insulating film. The coil is formed by plating using the seed layer.

The present invention relates to a composition for forming a conductive pattern by irradiation of electromagnetic waves capable of allowing excellent formation of a conductive micro-pattern on various polymer resin products comprising a polycarbonate resin or on resin layers by a simple method such as irradiation of electromagnetic waves and plating, and capable of reducing the degradation of the physical properties of the resin products or resin layers caused by the irradiation of electromagnetic waves, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern by irradiation of electromagnetic waves comprises: a polymer resin comprising a polycarbonate resin; and an electromagnetic wave-absorbing inorganic additive which absorbs an electromagnetic wave having a wavelength in the infrared region and satisfies the characteristic that a laser sensitivity Ls defined by a predetermined relational expression is 1.6<−log(Ls)<6.0.

A method of metal plating components includes placing a component and a spacer on a brochette, placing the brochette with the component and the spacer on a structure, and placing the structure with the brochette into a metal plating tank having a metal plating solution such that the component is submersed in the metal plating solution. The spacer is configured to mask a portion of the least one component and the component and the spacer are arranged on the brochette such that the spacer prevents the portion of the component from being contacted by the metal plating solution. The method also includes metal plating a surface of the component submersed in the metal plating solution, removing the structure with the brochette from the metal plating solution, drying the component on the brochette, and removing the dried component and the spacer from the brochette. Metal plating systems are also provided.

A process for efficiently producing a wiring board in which an insulating substrate 1 having a through hole 2 is used, which includes forming a seed layer 3 on one surface of the insulating substrate 1, covering the surface of the insulating substrate 1 on which the seed layer 3 is formed with a masking film 4, arranging the insulating substrate 1 and a positive electrode 5 so that the surface of the insulating substrate 1 opposite to the surface of the insulating substrate 1 on which the seed layer 3 of the insulating substrate 1 is formed is faced to the positive electrode 5, carrying out electroplating to form a metal layer 8 in the through hole 2, and then removing the masking film 4.

A method for manufacturing a printed wiring board includes forming the outermost conductor layer on the outermost resin insulating layer, forming a solder resist layer on the outermost resin insulating layer such that the solder resist layer covers the outermost conductor layer formed on the outermost resin insulating layer, irradiating plasma upon an exposed surface of the solder resist layer formed on the outermost conductor layer, forming a catalyst on the exposed surface of the solder resist layer formed on the outermost conductor layer, and forming an electroless plating layer on the exposed surface of the solder resist layer via the catalyst formed on the exposed surface of the solder resist layer such that the electroless plating layer has a film thickness in a range of 0.22 μm to 0.38 μm.

A method for forming a coating on a surface of an airfoil is provided, where the airfoil has a leading edge, a trailing edge, a pressure side, and a suction side. The method can include forming a platinum-group metal layer on the surface of the airfoil along at least a portion of the trailing edge, and forming an aluminide coating over the surface of the airfoil of the leading edge, the trailing edge, the pressure side, and the suction side. The leading edge may be substantially free from any platinum-group metal. The method may further include, prior to forming the aluminide coating, forming a bond coating on the surface of the airfoil along the leading edge, and after forming the aluminide coating, forming a thermal barrier coating over the bond coating. A method is also generally provided for repairing a coating on a surface of an airfoil.

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

A method for producing a closed cavity on a substrate, including: a) forming a cavity surrounded by at least one block on a given face of a substrate, the cavity having an aspect ratio higher than a determined threshold; and b) depositing a closing layer on the at least one block surrounding the cavity, the aspect ratio of the cavity being such that in b), the closing layer does not entirely fill the cavity and an empty space in the cavity is maintained.

A flat cable includes: a plurality of conductors arranged in parallel; an insulating layer formed, on first surfaces of the plurality of conductors and on second surfaces that are opposite surfaces of the first surfaces, along the plurality of conductors; an exposed portion where the first surfaces at end portions of the conductors are exposed to outside; and a reinforcement plate formed on the second surfaces opposite to the exposed portion. On the second surfaces opposite to the exposed portion, the reinforcement plate is directly formed on the conductors, and on the second surfaces opposite to the first surfaces that are in continuous with the exposed portion, the reinforcement plate is formed between the conductors and the insulating layer on the second surfaces.

A flat cable includes: a plurality of conductors arranged in parallel; an insulating layer formed, on first surfaces of the plurality of conductors and on second surfaces that are opposite surfaces of the first surfaces, along the plurality of conductors; an exposed portion where the first surfaces at end portions of the conductors are exposed to outside; and a reinforcement plate formed on the second surfaces opposite to the exposed portion. On the second surfaces opposite to the exposed portion, the reinforcement plate is directly formed on the conductors, and on the second surfaces opposite to the first surfaces that are in continuous with the exposed portion, the reinforcement plate is formed between the conductors and the insulating layer on the second surfaces.