Undesired deposition of metals on a lipseal (lipseal plate-out) during electrodeposition of metals on semiconductor substrates is minimized or eliminated by minimizing or eliminating ionic current directed at a lipseal. For example, electrodeposition can be conducted such as to avoid contact of a lipseal with a cathodically biased conductive material on the semiconductor substrate during the course of electroplating. This can be accomplished by shielding a small selected zone proximate the lipseal to suppress electrode-position of metal proximate the lipseal, and to avoid contact of metal with a lipseal. In some embodiments shielding is accomplished by sequentially using lipseals of different inner diameters during electroplating of metals into through-resist features, where a lipseal having a smaller diameter is used during a first electroplating step and serves as a shield blocking electrodeposition in a selected zone. In a second electroplating step, a lipseal of a larger inner diameter is used.

A method of forming an electrode in accordance with an exemplary embodiment includes a process of forming a mask pattern on one surface of a base to expose a partial area of the one surface of the base by using a mask material that is polymer including an end tail having at least one bonding structure of covalent bond and double bond, a process of loading the base on which the mask pattern is formed into a chamber, and a process of forming a conductive layer containing copper on the exposed one surface of the base by using an atomic layer deposition method that alternately injects a source material containing copper and a reactive material that reacts with the source material into the chamber.

Thus, according to the method of forming an electrode in accordance with an exemplary embodiment, a thin-film caused by a material for forming an electrode is not formed on a surface of the mask pattern. Therefore, a residue is not remained when the mask pattern is removed to prevent a defect caused by the residue from being generated.

A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.

A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.

The present invention relates to a method for coating a component, wherein the component has a first and a second surface, and wherein the first and the second surface adjoin each other at an edge, in which method i) first of all, the edge between the first and the second surface is rounded, and ii) subsequently, a coating is applied to the first surface.

A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.

A benefit agent delivery system whereby benefit agents can be delivered on demand. The benefit agent delivery system comprises a first electrode layer, a microcell layer, a sealing layer, and a second electrode layer. The microcell layer comprises a plurality of microcells, each microcell of the plurality of microcells containing a carrier and a benefit agent, and a metallic layer spanning an opening of each microcell of the plurality of microcells. Application of an electric field across a microcell causes the removal of at least a portion of the metallic layer from the microcell opening, and enabling the benefit agent to be delivered from the benefit agent delivery system.

A method of manufacture can comprise: treating a surface of a polymeric substrate with a laser induced graphene; and bonding a metallic layer to the laser induced graphene.