An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction.

A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. First pressure forces of contacts of the cup applied by the wafer is detected. The first pressure forces are respective compared with corresponding predetermined pressure ranges.

An active (consumable) anode includes, in one aspect, a generally annular body and a protrusion used for connecting the anode to the power supply, where the protrusion extends outward from the generally annular body of the anode. The compositions of the generally annular body and of the protrusion are the same, and, in some embodiments, the anode is a one-piece anode that does not include any welding seams. Such structure results in reduced voltage fluctuations during plating and in improved control over plating uniformity. In some embodiments, the anode is a copper anode, a cobalt anode, or a nickel anode machined from a single sheet of anode-grade metal. The provided anode can be used in an electroplating apparatus as a secondary, peripherally disposed anode, in conjunction with a more centrally located primary anode. The provided anode is configured to modulate electroplating at the edge of the substrate.

An active (consumable) anode includes, in one aspect, a generally annular body and a protrusion used for connecting the anode to the power supply, where the protrusion extends outward from the generally annular body of the anode. The compositions of the generally annular body and of the protrusion are the same, and, in some embodiments, the anode is a one-piece anode that does not include any welding seams. Such structure results in reduced voltage fluctuations during plating and in improved control over plating uniformity. In some embodiments, the anode is a copper anode, a cobalt anode, or a nickel anode machined from a single sheet of anode-grade metal. The provided anode can be used in an electroplating apparatus as a secondary, peripherally disposed anode, in conjunction with a more centrally located primary anode. The provided anode is configured to modulate electroplating at the edge of the substrate.

There is provided an electrolyte for the electrodeposition of chromium comprising: (A) water; (B) at least one chromium salt; and (C) at least one complexing agent,
wherein the molar ratio of components B:C is in the range of 1:1 to 1:50. There is also provided a method for electrodepositing chromium metal onto a conductive substrate.

There is provided an electrolyte for the electrodeposition of chromium comprising: (A) water; (B) at least one chromium salt; and (C) at least one complexing agent,
wherein the molar ratio of components B:C is in the range of 1:1 to 1:50. There is also provided a method for electrodepositing chromium metal onto a conductive substrate.

An electrolytic copper foil capable of securing a secondary battery having a high capacity retention rate, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite to the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first protective layer includes chromium (Cr) and the first surface of the electrolytic copper foil has an adhesion factor of 1.5 to 16.3.

An electrolytic copper foil capable of securing a secondary battery having a high capacity retention rate, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite to the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first protective layer includes chromium (Cr) and the first surface of the electrolytic copper foil has an adhesion factor of 1.5 to 16.3.

A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. First pressure forces of contacts of the cup applied by the wafer is detected. The first pressure forces are respective compared with corresponding predetermined pressure ranges.

At least one plating pen is brought into aligned relationship with at least one hole defined in a board. The pen includes a central retractable protrusion, a first shell surrounding the protrusion and defining a first annular channel therewith, and a second shell surrounding the first shell and defining a second annular channel therewith. The protrusion is lowered to block the hole and plating material is flowed down the first channel to a surface of the board and up into the second channel, to form an initial deposit on the board surface. The protrusion is raised to unblock the hole, and plating material is flowed down the first annular channel to side walls of the hole and up into the second annular channel, to deposit the material on the side walls of the hole.