Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, which comprising a plurality of electrodes, for forming electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. Embodiments of the present invention also provide an electroplating method for electroplating on a surface of a wafer, the method controlling the plurality of electrodes to form electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. The present invention is more accurate and reliable, the electroplating efficiency is also increased.

The present invention relates to a 3D printing device using selective electrochemical deposition and particularly to a 3D printing device capable of selectively depositing metal materials onto a substrate by using additive manufacturing by electrochemical deposition (electrochemical additive manufacturing, ECAM).

The present invention relates to a three-dimensional printing device using selective electrochemical deposition and particularly to a three-dimensional printing device capable of selectively depositing metal materials onto a substrate by using additive manufacturing by electrochemical deposition (electrochemical additive manufacturing, ECAM).

An electrolysis device including a housing, an electrolysis plate, and a rotating element is provided. The housing has a first surface and a second surface that are opposite to each other. The electrolysis plate disposed in the housing includes a rotating plate, a working electrode, and a counter electrode. The working electrode and the counter electrode are respectively disposed on the rotating plate and separated from each other. The rotating element is pivotally disposed on the rotating plate, so that the electrolysis plate is able to rotate in the housing.

An electrolysis device including a housing, an electrolysis plate, and a rotating element is provided. The housing has a first surface and a second surface that are opposite to each other. The electrolysis plate disposed in the housing includes a rotating plate, a working electrode, and a counter electrode. The working electrode and the counter electrode are respectively disposed on the rotating plate and separated from each other. The rotating element is pivotally disposed on the rotating plate, so that the electrolysis plate is able to rotate in the housing.

Embodiments of the present technology may include an electroplating system. The electroplating system may include a vessel. The system may also include a wafer holder configured for holding a wafer in the vessel. The system may further include an anode in the vessel. In addition, the method may include a plurality of thief electrodes. For each thief electrode of the plurality of thief electrodes, a thief current channel may be defined by a channel wall. The channel wall for each thief electrode may define an aperture adjacent to the wafer holder. The thief current channel may extend from each thief electrode to the aperture. The system may include a current control system in electrical communication with the plurality of thief electrodes. The current control system may be configured such that an amount of current delivered to each thief electrode can be adjusted independently.

Embodiments of the present technology may include an electroplating system. The electroplating system may include a vessel. The system may also include a wafer holder configured for holding a wafer in the vessel. The system may further include an anode in the vessel. In addition, the method may include a plurality of thief electrodes. For each thief electrode of the plurality of thief electrodes, a thief current channel may be defined by a channel wall. The channel wall for each thief electrode may define an aperture adjacent to the wafer holder. The thief current channel may extend from each thief electrode to the aperture. The system may include a current control system in electrical communication with the plurality of thief electrodes. The current control system may be configured such that an amount of current delivered to each thief electrode can be adjusted independently.

An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.

An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.

A guide system for use in electro-processing a bore of a gun barrel includes a non-conductive external bore guide and a non-conductive internal bore guide. The external bore guide is an adapter that is configured to removably engage the outside of the gun barrel and includes a conduit formed therein. The conduit is disposed such that it is axially aligned with a bore of the gun barrel when the external bore guide is engaged with the gun barrel. The internal bore guide is elongated and includes an axial recess that is sized to seat an electro-processing electrode (an anode). A method for uniformly plating the bore includes moving an anode through the gun barrel at one or more rate(s) of travel to uniformly plate the bore is also disclosed. The plating is sufficiently uniform to conform to military specifications. The systems, methods, support structures, etc. described herein are particularly well-suited to plating small-bore gun barrels.