An electroplating method for producing magnetic conducting materials, such as charging coils used in induction charging of electronic devices, comprising the following steps: constant tension releasing conducting material, such as cooper wire, the conducting material then undergo these process: alkaline washing then clean water washing, degreasing, acidic washing then clean water washing, continuous plating, clean water washing, drying, infrared measuring the diameter and retracting the conducting material. The method allows electroplating preparation of uniform and dense distribution of iron and nickel coating layer on the surface of conducting material, wherein, the thickness of the coating layer is 210 m. Since the conducting material is non-magnetic, but through the electroplating preparation, the entire charging coil is magnetized to become magnetic material, which when used during induction charging provides the coil with electro resistance that reducing high-frequency skin effect and improving electro induction.

An electroplating method for producing magnetic conducting materials, such as charging coils used in induction charging of electronic devices, comprising the following steps: constant tension releasing conducting material, such as cooper wire, the conducting material then undergo these process: alkaline washing then clean water washing, degreasing, acidic washing then clean water washing, continuous plating, clean water washing, drying, infrared measuring the diameter and retracting the conducting material. The method allows electroplating preparation of uniform and dense distribution of iron and nickel coating layer on the surface of conducting material, wherein, the thickness of the coating layer is 210 m. Since the conducting material is non-magnetic, but through the electroplating preparation, the entire charging coil is magnetized to become magnetic material, which when used during induction charging provides the coil with electro resistance that reducing high-frequency skin effect and improving electro induction.

Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO.sub.3).sub.2.sup.3 anions; SO.sub.3.sup.2 anions; and Bi.sup.3+ cations; convectively transporting Au(SO.sub.3).sub.2.sup.3 and Bi.sup.3+ to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO.sub.3).sub.2.sup.3 on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between 0.85 V and 1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free.

Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO.sub.3).sub.2.sup.3 anions; SO.sub.3.sup.2 anions; and Bi.sup.3+ cations; convectively transporting Au(SO.sub.3).sub.2.sup.3 and Bi.sup.3+ to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO.sub.3).sub.2.sup.3 on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between 0.85 V and 1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free.

A plating apparatus including a plating bath, a substrate holder to be arranged in the plating bath and adapted to hold a substrate, an anode for generating an electric field between the substrate and the anode, and at least one electric field shielding body for shielding the substrate holder and a part or the whole of the electric field, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other.

A plating apparatus including a plating bath, a substrate holder to be arranged in the plating bath and adapted to hold a substrate, an anode for generating an electric field between the substrate and the anode, and at least one electric field shielding body for shielding the substrate holder and a part or the whole of the electric field, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other.

Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions. This movement can provide a fresh electrolyte between the electrodes and enable deposition at new locations.

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit configured to receive a signal containing anode address data and configured to output a signal causing an anode array pattern; and, a first controller being a current controller configured to control a flow of current to the anode array; a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit; and a third controller configured to clear bubbles which have formed on the anode after a length of time of steady state deposition by controlling the flow of the electrolyte solution across the anode array surface.

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit configured to receive a signal containing anode address data and configured to output a signal causing an anode array pattern; and, a first controller being a current controller configured to control a flow of current to the anode array; a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit; and a third controller configured to clear bubbles which have formed on the anode after a length of time of steady state deposition by controlling the flow of the electrolyte solution across the anode array surface.

The disclosure discloses a manufacturing method and apparatus for an electronic component, and belongs to the technical field of manufacture of photovoltaic devices. The manufacturing method includes: putting a semiconductor device into a cathode region, and driving the semiconductor device to move in the cathode region, at the same time, connecting line plating rollers to a power source, and driving the line plating rollers to rotate, so that a surface of the semiconductor device is plated with metal lines in a movement direction thereof by conductive parts located in a circumferential direction of an outer side of each of the line plating rollers; the conductive parts include line plating regions and deplating regions; an anode is disposed on outer sides of the deplating regions and is electrically connected to a positive electrode of the power source by the conductive parts in the deplating regions.