A leak check method includes: performing a first inspection of measuring a pressure in an internal space formed by a seal of the substrate holder, while evacuating the internal space, and detecting that the pressure reaches a first pressure threshold value within a predetermined first inspection time; performing a second inspection of closing the internal space that has been evacuated, measuring the pressure in the closed internal space, and detecting that the pressure in the closed internal space does not exceed a second pressure threshold value within a predetermined second inspection time; and performing a third inspection of measuring a pressure difference between the pressure in the closed internal space and a vacuum pressure in a master container, and detecting that an amount of increase in the pressure difference within a predetermined third inspection time is kept equal to or below a pressure difference threshold value.

An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.

An electrochemical treatment system includes a treatment fluid supply manifold, a fluid return manifold, and an electrode section connected to the treatment fluid supply manifold. A plurality of treatment fluid supply ports feed fluid through or across the electrode and a plurality of fluid return ports proximate the treatment fluid supply ports are connected to the fluid return manifold. A porous pad is coupled to the electrode section for contacting a substrate to be treated and receives the treatment fluid via the plurality of treatment fluid supply ports. The plurality of fluid return ports remove spent and excess treatment fluid and gases from the substrate, the surrounding air, and the porous pad.

Provided is a stirring paddle driving mechanism with a small load. According to one embodiment, a wet substrate processing device is provided, having: a treatment tank for holding a treatment solution; a stirring paddle disposed inside the treatment tank; and a driving mechanism for driving the stirring paddle, wherein the driving mechanism has: a rotary motor; a central rotating member connected to the rotary motor; an outer fixed ring spaced from the central rotating member and surrounding an outside of the central rotating member; a planetary member connected to the central rotating member so as to rotate inside the outer fixed ring; and a driving shaft connected to the planetary member and the stirring paddle and extending in a radial direction of the outer fixed ring, wherein the driving shaft is configured to reciprocate in a longitudinal direction by rotation of the rotary motor.

Provided is a stirring paddle driving mechanism with a small load. According to one embodiment, a wet substrate processing device is provided, having: a treatment tank for holding a treatment solution; a stirring paddle disposed inside the treatment tank; and a driving mechanism for driving the stirring paddle, wherein the driving mechanism has: a rotary motor; a central rotating member connected to the rotary motor; an outer fixed ring spaced from the central rotating member and surrounding an outside of the central rotating member; a planetary member connected to the central rotating member so as to rotate inside the outer fixed ring; and a driving shaft connected to the planetary member and the stirring paddle and extending in a radial direction of the outer fixed ring, wherein the driving shaft is configured to reciprocate in a longitudinal direction by rotation of the rotary motor.

Systems for masking and sealing a component for surface treatment. A system includes a pair of fixture plates disposed on opposite ends of the component from each other. One or more inner sleeves are inserted into the component to mask and seal at least a portion of the component. An outer sleeve extends between the fixture plates to seal outside of the component. A pair of fixture rods extend between the first and second fixture plates and couple the first and second fixture plates together. The system is configured to effect surface treatment of an exposed area of the component, at least a portion of the exposed area defined by and disposed adjacent to the one or more inner sleeves.

A method of electroplating a metal foam includes placing a metal foam to be plated into an electroplating chamber with a plating material source, circulating an electrolyte through the chamber to carry metal ions from the plating material source, the circulating being selected and controlled to produce an even coating of plating material on surfaces of the metal foam.

A method of electroplating a metal foam includes placing a metal foam to be plated into an electroplating chamber with a plating material source, circulating an electrolyte through the chamber to carry metal ions from the plating material source, the circulating being selected and controlled to produce an even coating of plating material on surfaces of the metal foam.

A plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode (3001); step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value P.sub.11 and continue with a period T.sub.11 (3002); step 3: when the period T.sub.11 ends, adjusting the first plating power supply applied on the first anode to output a power value P.sub.12 and continue with a period T.sub.12, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value P.sub.21 and continue with a period T.sub.21 (3003); and step 4: when the period T.sub.21 ends, adjusting the second plating power supply applied on the second anode to output a power value P.sub.22 and continue with a period T.sub.22; wherein step 2 to step 4 are performed periodically.