A method includes forming a seed layer over a first conductive feature of a wafer, forming a patterned plating mask on the seed layer, and plating a second conductive feature in an opening in the patterned plating mask. The plating includes performing a plurality of plating cycles, with each of the plurality of plating cycles including a first plating process performed using a first plating current density, and a second plating process performed using a second plating current density lower than the first plating current density. The patterned plating mask is then removed, and the seed layer is etched.

A vapor chamber that includes a housing having a first sheet and a second sheet that oppose each other and that are joined to each other in a peripheral region of the housing; a working liquid enclosed within the housing; and a wick structure on an inside surface of the first sheet or the second sheet. In the vapor chamber, the wick structure includes multiple protruding portions and a grid portion integral with the protruding portions. In addition, surfaces of the protruding portions and a surface of the grid portion opposite the inside surface of the first sheet or the second sheet are positioned on a same flat surface.

A steel filament for twisting into a steel cord for the reinforcement of rubber articles, which contains a steel substrate that is coated with a coating comprising brass. The coating is different in that the amount of iron at the surface is distinctively higher than that prior steel filaments. The coating has an average iron content of 4 or more atomic percent compared to the total of iron, zinc and copper atoms in the layer extending from the surface to a depth of 3 nanometer below the surface. The steel filaments show an improved adhesion retention under hot and humid conditions and in organic cobalt compound containing rubbers as well as rubbers that are substantially free of cobalt. The lifetime of the rubber article is extended.

A steel filament for twisting into a steel cord for the reinforcement of rubber articles, which contains a steel substrate that is coated with a coating comprising brass. The coating is different in that the amount of iron at the surface is distinctively higher than that prior steel filaments. The coating has an average iron content of 4 or more atomic percent compared to the total of iron, zinc and copper atoms in the layer extending from the surface to a depth of 3 nanometer below the surface. The steel filaments show an improved adhesion retention under hot and humid conditions and in organic cobalt compound containing rubbers as well as rubbers that are substantially free of cobalt. The lifetime of the rubber article is extended.

Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.

Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.

The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method of manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, so that a defect rate can be minimized.

The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method of manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, so that a defect rate can be minimized.

A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treating surface is 0.4 to 3.0 μm. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of (111) plane to the sum of the integrated intensities of diffraction peaks of (111) plane, (200) plane, and (220) plane of the treating surface is at least 60%.

In one example, an electroplating system comprises a first bath reservoir, a second bath reservoir, a clamp, a first anode in the first bath reservoir, a second anode in the second bath reservoir, and a direct current power supply. The first bath reservoir contains a first electrolyte solution that includes an alkaline copper-complexed solution. The second bath reservoir contains a second electrolyte solution that includes an acidic copper plating solution. The direct current power supply generates a first direct current between the clamp and the first anode to electroplate a first copper layer on the cobalt layer of the wafer submerged in the first electrolyte solution. The direct current power supply then generates a second direct current between the clamp and the second anode to electroplate a second copper layer on the first copper layer of the wafer submerged in the second electrolyte solution.