A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 .Math.m or more and less than 0.50 .Math.m and a nickel content 0.03 at% or more and 1.00 at% or less.

There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm.sup.2 or more. This method allows for easily producing a plated article wherein a uniform porous Ni plating layer is formed on the surface of a substrate.

An article that includes a polymer-based substrate; and a metallic nano-crystalline coating on at least a portion of the polymer-based substrate, where the metallic nano-crystalline coating defines an average grain size less than about 20 nanometers, where the portion of the polymer-based substrate has a first Young's modulus and the metallic nano-crystalline coating has a second Young's modulus, where the first Young's modulus is at least five times less than the second Young's modulus.

The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be layered or nanolayered wherein in the microstructure/nanostructure and composition of individual layers can be independently modulated.

Provided is a chemical treatment steel sheet including a steel sheet; a composite coated layer which is formed on at least one surface of the steel sheet, and contains 2 to 200 mg/m.sup.2 of Ni in terms of an amount of metal Ni and 0.1 to 10 g/m.sup.2 of Sn in terms of an amount of metal Sn, and in which an island-shaped Sn coated layer is formed on an Fe—Ni—Sn alloy layer; and a chemical treatment layer that is formed on the composite coated layer, and contains a 0.01 to 0.1 mg/m.sup.2 of Zr compounds in terms of an amount of metal Zr and 0.01 to 5 mg/m.sup.2 of phosphate compounds in terms of an amount of P.

Provided is a roughened plated sheet comprising a roughened plated layer having a roughened nickel plated layer and a zinc plated layer famed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rz.sub.jis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more.

Provided is a roughened plated sheet comprising a roughened plated layer having a roughened nickel plated layer and a zinc plated layer famed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rz.sub.jis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more.

High surface area coatings are applied to solid substrates to increase the surface area available for solid-phase synthesis of polymers. The high surface area coatings use three-dimensional space to provide more area for functional groups to bind polymers than an untreated solid substrate. The polymers may be oligonucleotides, polypeptides, or another type of polymer. The solid substrate is a rigid supportive layer made from a material such as glass, a silicon material, a metal material, and plastic. The coating may be thin films, hydrogels, microparticles. The coating may be made from a metal oxide, a high-κ dielectric, a low-κ dielectric, an etched metal, a carbon material, or an organic polymer. The functional groups may be hydroxyl groups, amine groups, thiolate groups, alkenes, n-alkenes, alkalines, N-Hydroxysuccinimide (NHS)-activated esters, polyaniline, aminosilane groups, silanized oxides, oligothiophenes, and diazonium compounds. Techniques for applying coatings to solid substrates and attaching functional groups are also disclosed.

High surface area coatings are applied to solid substrates to increase the surface area available for solid-phase synthesis of polymers. The high surface area coatings use three-dimensional space to provide more area for functional groups to bind polymers than an untreated solid substrate. The polymers may be oligonucleotides, polypeptides, or another type of polymer. The solid substrate is a rigid supportive layer made from a material such as glass, a silicon material, a metal material, and plastic. The coating may be thin films, hydrogels, microparticles. The coating may be made from a metal oxide, a high-κ dielectric, a low-κ dielectric, an etched metal, a carbon material, or an organic polymer. The functional groups may be hydroxyl groups, amine groups, thiolate groups, alkenes, n-alkenes, alkalines, N-Hydroxysuccinimide (NHS)-activated esters, polyaniline, aminosilane groups, silanized oxides, oligothiophenes, and diazonium compounds. Techniques for applying coatings to solid substrates and attaching functional groups are also disclosed.

Corrosion-resistant laminated structures and methods of fabricating laminated structures are disclosed. A method of fabricating a laminated structure includes: providing an object in an electroplating solution; forming a first layer on the object by applying a first electric current, the first electric current being associated with a first current density; and forming a second layer on the first layer by applying a second electric current, the second electric current being associated with a second current density. Each of the first layer and the second layer includes, at least in part, phosphorus. The first current density and the second current density are different.